According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

As memory giants ramp up HBM production at full throttle, they are eager to find strong allies in the supply chain. Fujifilm Holdings, a Japanese semiconductor materials supplier, is said to build a new facility in South Korea to meet the booming demand from local memory chipmakers, including SK hyn...

According to Commercial Times, citing South China Morning Post, the U.S. plans to introduce new measures before the end of this year to prevent China from obtaining advanced AI chips through third countries such as Singapore, Malaysia, and the Middle East. The report highlights that these countries ...

Following Beijing’s antitrust investigation targeting NVIDIA earlier this week, rumors have been circulating among netizens that the U.S. chip giant intentionally removed items from its online store on Tmall, China’s largest e-commerce platform. However, NVIDIA's official Weibo account refuted t...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...