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As the U.S.-China chip war heats up, China is going all-in on AI ASICs, with Huawei’s flagship chips stealing the spotlight. But with rumors of the Ascend 920 entering mass production in 2H25, Commercial Times raises doubts about SMIC’s N+3 process and the chip’s access to top-tier HBM. Acc...
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As EUV machines are now essential for pushing sub-2nm chips into mass production in the angstrom era, partnerships with ASML remain a key industry focus. However, according to etnews, ASML and Samsung appear to have dropped plans for their joint EUV research center in Hwaseong, as ASML has begun sel...
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As leading memory giants ramp up preparations for the next-generation high bandwidth memory (HBM) battle, JEDEC—the standards-setting body for the microelectronics industry—has officially released the JESD270-4 HBM4 standard, a new memory standard designed to meet the surging demands of AI workl...
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As per CCTV News, on April 17, NVIDIA CEO Jensen Huang arrived in Beijing at the invitation of the China Council for the Promotion of International Trade (CCPIT). His visit to China sends a positive signal of cooperation and demonstrates NVIDIA’s long-term commitment to the Chinese market. Duri...
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As HBM has emerged as a key battle ground for memory giants amid the surging demand for AI, Micron has created a dedicated business unit for HBM. The company says in its press release that the new structure will be in place by early fiscal Q4, starting May 30, 2025, and financial reporting will foll...