The U.S. has tightened restrictions on foundries supplying 7nm and below chips to Chinese clients. According to a report from Economic Daily News, following TSMC’s suspension of services to restricted Chinese clients, rumors suggest that South Korea’s Samsung is also affected by U.S. restrictions, preventing it from offering such foundry services to Chinese firms.

Samsung’s foundry division has reportedly notified Chinese clients about the restrictions, according to the report. However, Samsung has declined to comment on these rumors.

As for Intel, since it is closely aligned with the U.S., the company is also expected to comply with U.S. regulations, as the report mentioned. This would lead to a comprehensive blockade of China’s effort to develop advanced AI chips, signaling a new chapter in the U.S.-China semiconductor confrontation, potentially reshaping the global semiconductor landscape.

The report pointed out that currently, only three companies—TSMC, Samsung, and Intel—are capable of providing foundry services below the 7nm process. China’s leading foundry, SMIC, claims to have 7nm production capability, but it lacks the necessary economies of scale and efficiency.

Citing industry sources, the report suggests that Alibaba’s AI chip subsidiary, T-Head, could be the most heavily impacted by the restrictions, indicating that, following Huawei, Alibaba has now also come under scrutiny by the White House. Along with T-head, other Chinese AI chip companies, such as Bitmain and Cambricon, are also likely to be impacted.

Fully owned by Alibaba, T-Head has made rapid progress in next-generation chip development, with its “Yitian” series reaching sub-5nm technology, as the report mentioned. The company claims that its technology supports applications across diverse fields, including AI in automotive, gaming, and scientific research.

The report indicated that as China’s path to self-developed AI chips encounters setbacks, it may be forced to rely on downgraded versions of AI chips from U.S. companies like NVIDIA and AMD to comply with American restrictions. This development, as the report noted, could undermine Beijing’s hopes of using domestically developed AI chips to circumvent U.S. limitations.

(Photo credit: Samsung)

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• [News] Four Key Takeaways on TSMC’s Reported Halt of 7nm and Below Chip Supplies to China
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As Samsung has implied earlier that it plans to collaborate with TSMC on HBM4, the memory giant seems to take a key step forward. A report by South Korean media outlet Maeli Business Newspaper discloses that the memory giant has already begun developing “Custom HBM4,” a next-gen high-bandwidth memory tailored specifically for Microsoft and Meta.

Samsung aims to begin mass production of HBM4 promptly upon completing development by the end of 2025, the report suggests.

Industrial sources cited by the report state that Samsung is establishing a dedicated production line for HBM4, which is now in the “pilot production” phase, where small-scale, trial manufacturing takes place ahead of mass production.

Citing sources familiar with the situation, the report further notes that Samsung is actively working on HBM4 designed for Microsoft and Meta. Both tech heavyweights have their own AI chips, namely, Microsoft’s Maia 100 and Meta’s Artemis.

As major tech companies make strides in scaling up their own AI data centers, there is a strong demand to cut costs associated with chip purchases. Therefore, many design and utilize their own AI accelerators while also buying AI chips from NVIDIA and AMD, according to Maeli.

Samsung, with its memory division and an LSI division capable of designing computational chips, is ideally positioned as a top partner for these major tech companies, according to Maeli.

Though the specifics of the HBM4 product that Samsung will supply to these companies remain undisclosed, Samsung did reveal the general specifications in February, according to Maeli.

Its data transmission speed, or bandwidth, reportedly reaches 2 terabytes per second (TB), marking a 66% increase over HBM3E, while its capacity has risen 33% to 48 gigabytes (GB), up from 36GB.

The report explains that unlike previous memory products, HBM4 is also referred to as “Computer-in-Memory (CIM)” due to its advanced capabilities, which go beyond standard memory functions to include specialized operations aligned with customer requirements.

Up to HBM3, the focus is said to be mainly on managing heat generation and maximizing speed, according to a semiconductor industrial official cited by the report. With HBM4, however, the emphasis will shift toward integrating AI computation capabilities (NPU) and specific data processing functions (IP) to meet evolving needs, the report says.

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• [News] SK hynix and Samsung Reportedly Step up Focus on HBM4 and CXL amid Rising Chinese Competition
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(Photo credit: Samsung)

Currently, the global semiconductor industry is entering a new period of transformation. With the rapid development of AI, big data, cloud computing, and other technologies, the demand for high-performance computing chips, optical communication chips, and advanced packaging has surged, and recent reports suggest that prices for these types of chips are increasing.

Advanced Process and Advanced Packaging Products May See Price Increases

According to a recent report by Morgan Stanley, TSMC is considering raising prices for its 3nm process and CoWoS advanced packaging technology in response to soaring market demand. TSMC plans to implement these price increases in 2025, with the cost of its 3nm process potentially rising by up to 5%.

Industry analysts point out that on the demand side, major AI chip manufacturers such as NVIDIA and AMD heavily rely on TSMC’s 3nm process, and the explosive growth in AI technology has driven continuous demand for these chips, contributing to the price increase.

On the supply side, the high research and production costs associated with advanced process technology—including equipment investment, material costs, and R&D personnel—add significant pressure to the supply chain. Multiple factors have led to a tight supply of such chips, further driving up prices.

Additionally, TSMC’s 5nm and 4nm process quotes have increased more than previously anticipated by 4%, with some price hikes reaching as much as 10%.

Reports indicate that TSMC also plans to raise prices for its CoWoS advanced packaging technology, with potential increases between 10% and 20%. High demand for CoWoS from major companies like NVIDIA, AMD, Microsoft, Amazon, and Google has resulted in a shortage of CoWoS packaging capacity, which has driven up prices.

According to TrendForce research, NVIDIA is the primary driver of demand for CoWoS, and with the upcoming launch of its Blackwell series, demand for CoWoS is expected to increase by more than 10 percentage points annually by 2025.

Optical Communication Chip Sector Begins Price Increases

Demand for high-speed, high-bandwidth, and low-latency optical communication is rising, particularly in data centers, enterprise networks, and telecommunications, driving demand in the optical communication chip market. Recently, media reports revealed that Marvell, a major optical communication chip manufacturer, has issued a price increase notice, with its entire product line set to see price hikes starting January 1, 2025. According to TrendForce, Marvell ranked sixth in the global IC design market in 2023.

Industry forecasts predict that, driven by ongoing advances in optical communication technology and expanding applications, the global optical communication chip market will grow rapidly in the coming years.

The development and application of technologies such as silicon photonics, optoelectronic hybrid integration, and high-performance photonic chip materials are expected to bring new growth points and opportunities to the optical communication chip market.

(Photo credit: Marvell)

According to a report by Economic Daily News, Supermicro’s ongoing financial crisis has reportedly led to the suspension of its planned expansion at its Malaysia facility, which was set to double its production capacity. This disruption has prompted Supermicro’s major client, Malaysia’s largest conglomerate and a top NVIDIA AI server buyer, YTL Group, to shift its substantial AI data center order.

The same report indicates that YTL Group is now turning to Wistron Group’s Malaysian subsidiary, Wiwynn, for nearby support to fulfill the order, which involves substantial deliveries of NVIDIA’s high-end GB200 NVL72 full-rack servers.

Industry insiders cited by Economic Daily News previously speculated that NVIDIA would lead any order reallocation; however, this shift originates from Supermicro’s client, YTL Group, whose choice of Wiwynn is strategic. Wiwynn’s plant is situated near Supermicro’s new facility in Malaysia, offering a geographical advantage and boasting robust AI server capabilities.

YTL Group has strong ties with NVIDIA. In March, YTL Power, a subsidiary of YTL Group, announced a partnership with NVIDIA to install DGX GB200 NVL72 AI server systems, aiming to establish a green AI data center in Johor, Malaysia.

Originally, YTL’s sizable AI data center project was to be shared between Supermicro and Wiwynn. Supermicro’s Johor plant was expected to double capacity with a new line in Q4, but this plan has been delayed due to financial issues. Wiwynn’s nearby plant has also been expanding, enhancing its one-stop manufacturing services and adding advanced cooling technologies such as direct liquid cooling and immersion cooling to handle the redirected order.

Supermicro CEO Charles Liang, speaking at COMPUTEX 2024, previously unveiled the company’s ambitious Malaysia expansion, aiming to double its output to 10,000 server racks per month by Q4. With the expansion now halted, orders have shifted to Wiwynn.

Wiwynn’s new plant in Johor began assembling server racks last October, and a second phase focusing on motherboard production is expected to go online later this year, with potential plans for a third plant.

Economic Daily News reports that Johor, Malaysia’s largest data center investment hub and the ninth-largest in the Asia-Pacific, currently hosts 13 data centers, with four more under construction. The region’s affordable land, water, and power resources, along with its proximity to Singapore, have drawn multinational companies such as Australia’s AirTrunk and Microsoft, which recently acquired land in Johor for a new data center.

(Photo credit: YTL Power)

According to Liberty Times, citing Wccftech, while initial expectations suggested that Huawei’s new Mate 70 smartphone would feature a next-generation flagship SoC, like the Kirin 9100, recent rumors indicate that Huawei may instead equip the standard Mate 70 model with a different Kirin chip. Only the high-end models, such as the Pro, Pro+, and RS Ultimate, are likely to receive the advanced Kirin 9100 chip.

Wccftech reports that this decision highlights Huawei’s ongoing challenges with chip yield rates, which have limited its ability to produce the new high-performance chips at scale. Consequently, Huawei has been compelled to reserve these advanced chips for higher-priced models.

Leaked information previously indicated that the Kirin 9100 is manufactured by SMIC using a 6nm process, according to Wccftech. However, since SMIC is limited to using older DUV equipment, production costs remain high, and yields are still constrained, preventing Huawei from producing these chipsets in large quantities. As a result, Huawei can only use this chip in a limited number of high-end models, as the report noted.

As for the standard version of the Mate 70, the report indicated that it may feature a different Kirin chip that’s slightly less powerful than the high-end processor. Some speculate that the standard model might adopt the previous generation Kirin 9000s or 9010, and at this stage it is still uncertain whether the Kirin 9100 will appear in the top-tier versions of the Mate 70 series, as the report from Liberty Times pointed out.

Read more

• [News] Huawei Expected to Unveil Mate70 and Foldable Device Following Apple’s iPhone 16 Release
• [News] Huawei’s Mate 70 Will Reportedly Use a Kirin SoC Made with SMIC’s 7nm Node instead of 5nm

(Photo credit: Huawei)