According to TrendForce’s latest memory spot price trend report, DRAM spot prices have finally stabilized as Samsung is committed to propping them up. Spot prices of DDR4 products, in particular, continue the momentum. As for NAND flash, demand for a small extent of inventory replenishment remains possible for 3Q24, which may help the sales performance from the spot market to improve from that of 2Q24. Details are as follows:

DRAM Spot Price:

DRAM spot prices, which had experienced a long period of decline, have finally stabilized as Samsung is committed to propping them up. Spot prices of DDR4 products, in particular, have risen slightly. Additionally, since spot prices are currently lower than contract prices for both DDR4 and DDR5 products, module houses and other buyers prefer spot trading. This, in turn, has helped stabilize spot prices. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) has increased by 0.81% from US$1.979 last week to US$1.995 this week.

NAND Flash Spot Price:

Spot prices have started to stabilize recently as a result of reluctance in truncation from spot traders and module houses, as well as the consideration on how the growth of demand has been exceedingly confined by the drop of prices. Demand for a small extent of inventory replenishment remains possible for 3Q24, when sales performance from the spot market is expected to improve from that of 2Q24. On the whole, spot prices would first maintain equilibrium whilst awaiting for the final development of suppliers’ contract prices and the market status for 3Q24, before deciding on subsequent actions. Spot prices of 512Gb TLC wafers have dropped by 0.58% this week, arriving at US$3.272.

Masahiro Okitsu, President of Sharp, a subsidiary of Foxconn, announced in a joint interview with Japanese media that the Sakai Display Product (SDP) plant, which produces large-size LCD panels for TVs, will cease production earlier than planned. Initially scheduled for the end of September, the shutdown is now expected to occur in late August.

According to a report by Asahi Shimbun on July 16, Sharp President Masahiro Okitsu announced in a joint media interview that the SDP, which produces LCD panels for TVs, is expected to completely cease production after the Obon festival (late August). This interview marks Okitsu’s first media appearance since taking office as Sharp’s president on June 27.

Okitsu mentioned that around July 20, SDP will start put glass substrates into production, with the final batch of LCD panels produced a month later.

Sharp’s SDP land and plant will be transformed into an AI data center, and a collaboration with Softbank and KDDI has been announced. However, Masahiro Okitsu did not elaborate on this cooperation framework during the media interview on July 16th.

Regarding Foxconn Chairman Young Liu’s appointment as Chairman of Sharp, Okitsu stated that this makes the division of duties clearer. Foxconn will oversee and support Sharp, while the existing brand business operations will be managed by Sharp.

Okitsu also pointed out the goal of increasing the operating profit margin of the “brand business,” which includes products like white goods, to 7% by the 2027 fiscal year (compared to less than 5% in the 2023 fiscal year). He emphasized that achieving a return to profitability in the 2024 fiscal year is imperative.

Reportedly, with Foxconn’s technical assistance, Sharp also plans to enter the AI and electric vehicle (EV) businesses, with plans to launch in the 2026-2027 fiscal years.

On May 14, Sharp announced its financial report, indicating that due to impairment losses in its panel business, the net loss for the 2023 fiscal year (April 2023 – March 2024) reached JPY 149.9 billion, marking the second consecutive year with a net loss exceeding 100 billion yen. However, Sharp forecasts that for the 2024 fiscal year (April 2024 – March 2025), its consolidated operating profit will be JPY 10 billion, with a consolidated net profit estimated at JPY 5 billion.

Read more

• [News] Foxconn Ventures into Advanced Packaging, Sharp to Follow with Production Capacity in 2026
• Sharp Announces Closure of Sakai Gen 10 Line, Supply Cut of 5 Million TV Panels Expected in 2025, Says TrendForce

(Photo credit: Sharp)

Huawei’s Consumer Business CEO, Richard Yu, has publicly revealed plans for Huawei’s next-generation tri-folding phone for the first time. He stated that this product, widely considered challenging to achieve in the industry, is finally about to be launched after five years of development.

According to a report from the Chinese technology website ” Chinaz,” the tri-folding phone features an innovative inside-out folding mechanism and a dual-hinge design, with the screen size expected to reach approximately 10 inches.

Richard Yu pointed out that this new design will not only revolutionize the way phones are used but also broaden their use cases. When fully unfolded, the phone can rival a tablet, meeting basic office needs such as text and spreadsheet processing.

The latest industry news cited by the report further suggests that Huawei’s tri-folding phone will be unveiled in September, set to compete with Apple’s iPhone 16 series. Although the price of Huawei’s tri-folding phone is expected to be very high, potentially starting at nearly CNY 20,000, significantly surpassing the price of an iPhone, it showcases Huawei’s top-tier domestic technology and innovation in China.

However, despite the relatively noticeable growth in shipment volumes, the base number of foldable phones is very low, and the overall market size remains small.

Compared to the traditional smartphone market, which easily reaches sales volumes of over one billion units, TrendForce previously estimated that the shipments of foldable phones are expected to reach 17.8 million units in 2024, making up only 1.5% of the smartphone market. Despite high repair rates and costs, market penetration is projected to climb to 4.8% by 2028.

Read more

• [News] Apple Reportedly Joins the Foldable Phone Market, Setting Stage for Three-Way Competition
• [News] Huawei Issues Rush Orders for Crucial Components, Focusing on CIS for Foldable Phones

(Photo credit: Huawei)

As Samsung actively expands its high-bandwidth memory (HBM) capabilities, it is also striving to enhance the penetration rate of its existing memory products in mobile devices such as smartphones. On July 16, Samsung announced that it has completed verification of its latest LPDDR5X DRAM, which can be paired with MediaTek’s next-generation smartphone chips.

Since MediaTek has yet to release its next-generation 5G flagship chip, the Dimensity 9400, Samsung’s announcement has drawn greater attention to the upcoming release date of the Dimensity 9400.

Samsung’s LPDDR5X DRAM boasts a 25% performance improvement over the previous generation, with increased execution speed, and will be compatible with the Dimensity 9400 chip set to be released in the fourth quarter. Industry sources cited by Economic Daily News further note that this means smartphone brands that choose the Dimensity 9400 as their main chip can also opt for Samsung’s LPDDR5X DRAM as the mobile memory solution for their new devices.

Samsung’s latest LPDDR5X DRAM claims to extend the battery life of mobile devices and enhance the speed of AI functions within the device, such as voice-to-text generation, without the need for server or cloud access.

According per another report by the Korea Economic Daily, JC Hsu, General Manager of MediaTek’s Wireless Communication Business Unit, stated that Samsung’s LPDDR5X DRAM, with an execution speed of up to 10.7 Gbps, will leverage more AI capabilities and performance of MediaTek’s upcoming products.

Read more

• [News] Samsung’s HBM3e Rumored to be Certified by NVIDIA, Boosting DDR5 Price Increases in Q3
• [News] Samsung Develops Custom HBM with Tech Giants, with Commercialization Expected in HBM4

(Photo credit: Samsung)

According to a report by Yonhap News Agency, data released by Korea’s Ministry of Science and information and communication technology ICT on July 15 shows that in the first half of this year, Korea’s ICT industry exports grew by 28.2% YoY to USD 108.85 billion, setting the second-highest record for the same period in history.

Fueled by demands in the AI, IT information technology, and telecommunications equipment markets, semiconductor exports, one of Korea’s main export products, surged by 49.9% YoY, reaching USD 65.83 billion.

On a market segment basis, Korea’s memory exports in the first half of the year saw a hike of 88.7% YoY, driven by increased exports of products like high bandwidth memory (HBM).

Due to increased investment in server and data center as well as increased demand for personal computer and other devices, exports of computers and peripheral devices rose by 35.6% YoY; instead, mobile phone exports decreased by 2.8% YoY to USD 5.58 billion.

In June, ICT exports grew by 31.1% YoY, reaching USD 21.05 billion, the highest value for the same month in history. Semiconductor exports were USD 13.44 billion, also setting a record high for the same month. Notably, memory chip exports soared by 85.2% YoY, reaching USD 8.83 billion.

Read more

• [News] Korean Semiconductor Equipment Maker Develops ALD Technology to Reduce EUV Process Demand
• [News] Korean Advanced Packaging Industry’s Rise Delayed by TSMC and ASE Expansion

(Photo credit: SK Hynix)