On September 10, two major smartphone manufacturers, Apple and Huawei, held new product launch events simultaneously. Apple’s iPhone 16 is powered by the A18 series Bionic chip, which is said to make it the first truly native AI smartphone.

Meanwhile, Huawei’s Mate XT, the world’s first triple-foldable phone, redefines the future standard for foldable devices.

• iPhone 16 Hit the Market, Backed by a Powerful Chip

On September 9, Apple held its product launch event, introducing the iPhone 16 series, including the iPhone 16, iPhone 16 Plus, iPhone 16 Pro, and iPhone 16 Pro Max. All models in the new series are equipped with the new 3nm A18 series processor, with the standard iPhone 16 featuring A18 chip, and the flagship iPhone 16 Pro and Pro Max powered by A18 Pro chip.

Compared to A16 Bionic chip used in the iPhone 15, iPhone 16’s processor makes a leap forward by two generations, offering a gaming experience on par with console-level performance.

The A18 and A18 Pro chips in the iPhone 16 series use the world’s first second-generation 3nm process and the latest Armv9 instruction set architecture. They have a built-in 16-core neural engine, with smaller transistors that increase speed and efficiency.

The memory subsystem has been uniformly upgraded, increasing total system memory bandwidth by 17%.

The A18 chip in the standard iPhone 16 features a 6-core CPU (2 performance cores + 4 efficiency cores), which is 30% faster than the A16 Bionic in the iPhone 15 and 60% faster than the A14 chip in the iPhone 12.

Its GPU is more efficient, consuming 35% less power for the same performance. A18 chip adopts Apple’s latest desktop-class GPU architecture, with a 5-core GPU that supports key functions like Apple Intelligence, photography, and graphically intensive games. It’s 40% faster than the A16’s GPU and twice as fast as the A14’s GPU.

The A18 Pro chip, debuting in the iPhone 16 Pro series, delivers up to 15% faster performance and 20% less power consumption compared to the A17 Pro when running the same workloads.

Additionally, Apple Intelligence’s running speed improves by 15%. Fitted with brand new 6-core GPU, A18 Pro optimizes graphics performance, features a GPU speed of up to 20% at the fastest and supports hardware ray tracing.

A18 Pro also supports faster USB 3 and ProRes video recording, along with a new video encoder and image signal processor, which double data throughput, boosting encoding speed and video processing efficiency.

Apple emphasized that the iPhone 16 series will introduce new generative AI features centered around Apple Intelligence for the first time. Apple Intelligence is set to launch in beta this fall as part of the iOS 18 update on all iPhone 16 models, as well as the iPhone 15 Pro and iPhone 15 Pro Max, with Siri and the device language initially set to U.S. English. Some functions and additional languages will be rolled out next year.

TrendForce previously noted that Apple Intelligence is a major highlight of the iPhone 16 series this year. While the LLM parameters on Apple’s devices are not as extensive as those on Android phones, Apple is expected to achieve superior system integration thanks to its closed ecosystem, self-developed processors, and strong control over app development.

The company is also focusing on improving Siri’s accuracy and has partnered with ChatGPT to boost AI performance. TrendForce points out that Apple Intelligence will gradually roll out more features and support for additional languages.

However, its functionality in China remains unclear, and the lack of significant AI-centric applications could potentially impact sales of the iPhone 16 series this year. 

From a production perspective, TrendForce’s research on September 6 pointed out that the excitement around Apple Intelligence has been building since WWDC24, and with a relatively low base in 2023, Apple’s four new models are expected to have a combined production volume of 86.7 million units in the second half of 2024, marking an 8% year-on-year increase.

Looking at total production for 2024, Apple is currently close to Samsung, the market leader, and could potentially surpass Samsung by the end of the year to become the top smartphone manufacturer by market share for the first time.

• Huawei’s World-First Triple-Fold Design Sets a New Standard

At the Huawei Extraordinary Brand Event and HarmonyOS Product Launch, Huawei officially unveiled the world’s first mass-produced triple-fold smartphone, the Mate XT. Prior to Huawei, companies like Samsung, TCL, and even Africa’s smartphone leader Transsion had already showcased triple-fold “concept phones.”

According to official reports, Huawei Mate XT measures 156.7mm in length. When unfolded, its width is 73.5mm in single-screen mode, 143mm in dual-screen mode, and 219mm in triple-screen mode.

When folded, the device is just 12.8mm thick and weighs approximately 298g. Mate XT boasts the world’s largest foldable screen at 10.2 inches, with a high resolution of 2200 x 2480. With a thickness of just 3.6mm, the Mate XT offers a user experience rivaling that of a small tablet, while still being compact enough to fit in a pocket when folded.

TrendForce reports that shipments of foldable phones are expected to reach 17.8 million units in 2024, making up only 1.5% of the smartphone market. Despite high repair rates and costs, market penetration is projected to climb to 4.8% by 2028.  

Samsung, which held a dominant 60% market share in foldable phones between 2023 and 2024, is facing more intensive competition from multiple smartphone brands, pushing its market share down to 50%, and Huawei has become its fiercest competitor.

The launch of Huawei’s 4G foldable Pocket S in 2023 performed exceptionally well in the market, driving Huawei to break into double digits for the first time in foldable phone market share, reaching 12%.

In 2023, Huawei also introduced upgraded 5G foldable phones, including the Mate X5 and Pocket 2. With the recent release of the Mate XT, Huawei’s foldable phone market share is expected to approach 30% by the end of this year.

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• [News] Huawei’s Tri-Fold Phone Revealed Hours after Apple, with Pre-Orders Reportedly Exceeding 4 Million
• [News] Fuelled by AI Features, Apple’s iPhone 16 Shipments Reportedly to Increase by 10%

(Photo credit: Apple)

On September 9, Indian tech blog PiunikaWeb cited a report from Tech & Leaks Zone, stating that rumors have hinting at Google’s preparation to exit Samsung Electronics’ wafer foundry business, Samsung Foundry, and switch to TSMC in 2025. The next two generations of Google’s custom Tensor processors are reportedly expected to use TSMC’s 3nm and 2nm processes, respectively.

As per the same report, Google’s Tensor G4 processor is being manufactured by Samsung Foundry using its 4nm process. However, the G4 offers only a slight upgrade compared to the Tensor G3 in the Pixel 8 smartphone, as the G4 continues to use Samsung’s older FO-PLP packaging technology instead of the newer FO-WLP packaging, which is more capable in preventing overheating.

On the other hand, Google’s Tensor G5, which will be used in the Pixel 10, is reportedly set to be manufactured by TSMC using the latest 3nm process and TSMC’s advanced InFO-POP packaging technology. The Tensor G6, which will support the Pixel 11 series, will also be produced by TSMC using 2nm process.

Notably, Apple had introduced an AI technical document in June, disclosed that two AI models supporting “Apple Intelligence” were trained in the cloud using Google’s custom-designed Tensor Processing Unit (TPU).

Per Google’s official website, the cost of using its most advanced TPU can be less than USD 2 per hour if reserved three years in advance. Google first introduced the TPU in 2015 for internal use, and it became available to the public in 2017.

Additionally, per a report from wccftech, Google’s ARM-based TPU v5p “Axion,” designed specifically for data centers, is also rumored to be manufactured using TSMC’s enhanced 3nm process, N3E.

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• [News] Google’s Tensor G5 Reportedly Manufactured with TSMC’s 3nm and InFO-POP Packaging
• [News] Breaking Apple’s Monopoly – TSMC’s InFO Packaging Reportedly Adds Google Chips

(Photo credit: Google)

According to a report from The Register, DPU developer Xockets recently filed a lawsuit, accusing AI chip giant NVIDIA, Microsoft, and intellectual property risk management company RPX of colluding to avoid paying Xockets the fees it is owed, violating federal antitrust laws, and intentionally infringing on its patents.

The report states that in addition to seeking monetary compensation, Xockets is also requesting an injunction. If granted, this injunction would prevent NVIDIA from selling its upcoming Blackwell architecture GPUs.

Per Reuter’s report, Xockets, founded in 2012, claims that its invention, the Data Processing Unit (DPU), plays a critical role in some of NVIDIA’s and Microsoft’s systems. The company states that its technology helps offload and accelerate tasks that would otherwise place a heavy burden on server processors.

Reportedly, Xockets founder Parin Dalal began filing a series of DPU technology patents in 2012. These patents describe architectures used for the linear downloading, acceleration, and isolation of data-intensive computational operations from server processors.

Xockets claims that its DPU-related patents cover various applications including cloud computing, machine learning, security, network overlay, stream data processing, and cloud computing architectures. Xockets alleges that Microsoft and Mellanox, which was acquired by NVIDIA in 2020, which was acquired by NVIDIA in 2020, have infringed on these patents.

In a recent statement, Xockets claimed that NVIDIA has utilized DPU technology patented by Xockets, allowing NVIDIA to monopolize the AI server market using its GPUs. Meanwhile, Microsoft has allegedly monopolized the AI platform market using NVIDIA GPUs.

Xockets further claimed that it has made effort to engage in sincere negotiations with NVIDIA and Microsoft, but these attempts have been rejected.

Xockets’ lawsuit reveals that it actually demonstrated the relevant technology to Microsoft in 2016, and the technology was subsequently adopted by Mellanox within the same year for cloud computing downloads used by Redmond and other clients.

Additionally, NVIDIA’s ConnectX smartNIC, BlueField DPU, and NVLink switch, which are crucial for extending AI training and inference deployments across large GPU clusters, are said to infringe on Xockets’ patents.

Regarding this matter, NVIDIA has declined to comment, while Xockets’ spokesperson has also not provided any additional explanation.

The report highlights that Microsoft and NVIDIA may not be Xockets’ only targets but are at least the most profitable ones. Other companies, such as Broadcom, Intel, AMD, Marvell, Napatech, and Amazon, are also actively developing products similar to NVIDIA’s ConnectX, BlueField, and NVLink.

Regarding the lawsuit, the judge overseeing the case has approved a preliminary injunction hearing to be held on September 19.

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• [News] NVIDIA’s Blackwell Overcomes Delays, as GB200 Reportedly Sets for December Mass Production
• [News] Foxconn Remains Unfazed Despite NVIDIA’s GB200 Delay, with Customers Aim to Secure Their Orders

(Photo credit: Xockets)

According to sources cited by Indian media outlet Financial Express, Apple is said to be in talks with Micron, Tata Group, and other Indian chip manufacturers to procure USD 12 billion worth of chips locally for iPhones produced in India.

Reportedly, Apple plans to shift 26% of its iPhone production to India by 2026. Industry sources cited by the report further suggest that by then, Apple will become the largest single buyer of Indian-made semiconductors, surpassing any other sectors such as defense, aerospace, and automotive.

Sources further point out that if Micron and Tata are able to produce chips that meet Apple’s requirements, a significant portion of the chips needed for iPhones will come from these companies, potentially creating substantial opportunities for the Indian semiconductor industry.

Before the outbreak of the pandemic, Apple iPhones and almost all other consumer products were manufactured in China. Following the introduction of the Production-Linked Incentive (PLI) scheme by the Indian government, potentially prompting Apple to begin shifting its production lines.

In 2022, the Indian government launched a USD 10 billion PLI scheme to stimulate domestic semiconductor production. To date, India has approved five chip manufacturing projects with a total value of roughly USD 18 billion and has reserved USD 1.2 billion for future projects.

Meanwhile, Micron’s chip plant in Gujarat, India, is expected to begin operations this year, marking the company’s first chip facility in India.

Additionally, Tata Group, in collaboration with PSMC, plans to build a packaging plant in Gujarat, with operations slated to commence in 2026, producing chips using 28nm, 40nm, 55nm, 90nm, and 110nm nodes.

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• [News] 300mm Wafer Fab Construction Picks up Steam Worldwide
• [News] Reducing Reliance on China, Apple to Produce High-End iPhones in India for the First Time

(Photo credit: Tata Group)

According to TrendForce’s latest memory spot price trend report, neither DRAM nor NAND spot prices show much momentum. Regarding DRAM, spot prices are still falling as Samsung is increasing the amount of reball DDR5 (D1Y) chips that come from decommissioned modules. As for NAND flash, the spot market persists in sluggishness this week, where spot traders are continuously lowering their quotations. Details are as follows:

DRAM Spot Price:

In the spot market, prices are still falling as Samsung is increasing the amount of reball DDR5 (D1Y) chips that come from decommissioned modules. Since these reball chips are second-hand and low-cost products, Samsung can achieve profitability. However, this is leading to a continuous decline in spot prices, thereby affecting confidence across the entire DRAM market and buyers’ sentiment. Most buyers are now cautious and unwilling to actively stock up. The average spot price of the mainstream chips (i.e., DDR4 1Gx8 2666MT/s) decreased by 0.10% from US$1.972 last week to US$1.970 this week.

NAND Flash Spot Price:

The spot market for NAND Flash persists in sluggishness this week, where spot traders are continuously lowering their quotations to alleviate their pressure from inventory, though overall transaction dynamics are maintained at a lackluster level without apparent signs of recovery under unimproved end demand. Spot price of 512Gb TLC wafers dropped by 3.45% this week, arriving at US$3.075.