According to TrendForce's latest memory spot price trend report, regarding DRAM, price decline for both DDR4 and DDR5 products has begun to moderate, as sellers realize that further price reductions are unlikely to spur procurement activities. As for NAND flash, the price reduction of eMMC has gradu...

The flames of war continues to spread, as the HBM battle seems to extend to the next-gen products. According to the Korean Economic Daily, Samsung and SK hynix are reportedly developing HBM4 samples for Tesla, as the EV giant joins other U.S. tech giants in the race to develop its own AI chips. T...

According to a Wccftech report, citing Bloomberg, Huawei’s efforts to develop more advanced chips for AI have faced significant setbacks due to U.S. sanctions, making it unable to match the performance of even older NVIDIA products. The report notes that the sanctions have blocked Taiwan's TSMC...

Apple is anticipated to release its lightest and thinnest smartphone, the iPhone 17 Air, next year, featuring the A19 chip, according to MacRumors. Industry sources cited by Economic Daily News reveal that TSMC will likely remain Apple’s exclusive supplier for high-end processors. TSMC’s 3nm pro...

Is the thinner iPhone in history on the road? Apple Insider suggests that Apple’s new iPhone 17 lineup may debut a redesigned model with a remarkable thickness of just 6mm. Industry analysts cited by another report from the Economic Daily News are optimistic that TSMC will remain the sole processo...