At the SEMICON Taiwan 2024, Samsung's Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions while maintaining fl...

As Intel's January announced the collaboration with UMC on the 12-nanometer process platform, UMC's Co-General Manager, Jason Wang, led a team to support Intel's IFS event. Cited by Commercial Times in its report, Wang emphasized that UMC's existing customers would have more production location ...

Intel announced on the evening of January 25th that it will collaborate with UMC to develop 12-nanometer process platform technology. The production will utilize Intel's wafer fab capacity in the United States, and both parties will share the cash generated from the collaboration. The production is ...