In addition to China, Russia has also made semiconductors one of its major focuses. According to a report by Tom’s Hardware, which cites local media CNews, the country has set aside over 240 billion rubles (USD 2.54 billion) to fund a program aimed at replacing 70% of the foreign chipmaking equipment by 2030.

This effort, according to the reports, includes the launch of 110 R&D projects to reduce reliance on imported wafer fabrication tools and eventually produce chips using 28nm-class process technology. However, it is worth noting that the total investment is 57 times smaller than what Russia plans to spend on defense in its war with Ukraine in 2025 alone, the reports note.

According to the reports, to put things in context, domestic chipmakers like Angstrem and Mikron can produce chips using mature technologies, such as 65nm and 90nm nodes. However, only 12% of the 400 tools used for chip production in the country are currently made locally.

Moreover, sanctions have worsened the situation, which raise the price of essential equipment by 40% to 50% due to the need to smuggle it into Russia, the reports indicate.

Therefore, to address these challenges, Russia’s Ministry of Industry and Trade, along with government-controlled MIET, have developed the initiative, which addresses multiple aspects of chipmaking, including manufacturing tools, raw materials, and electronic design automation (EDA) tools, according to the reports.

However, the report by Tom’s Hardware raises concerns about the feasibility of the initiative, as many of the specific details remain somewhat vague.

For instance, one of the initiative’s key goal is the development of lithography equipment for 350nm and 130nm process technologies, which has a very wide gap in between. Also, Russia intends to manufacture domestic lithography systems capable of handling 65nm and 90nm process technologies. Nevertheless, even this would represent significant progress in the country’s microelectronics production, it would still lag 25 to 28 years behind the industry’s leading edge, the report states.

Recently, China has set two records in semiconductor chip sector: first, it mass-produced the world’s first 28nm embedded RRAM image quality adjustment chip; second, it developed the world’s first 16-bit quantum bit semiconductor microprocessor chip.

• Mass Production of the World’s First 28nm Embedded RRAM Image Quality Adjustment Chip

As per the official account of “Beijing Yizhuang,” the world’s first 28nm embedded RRAM (Resistive Random Access Memory) image quality adjustment chip, developed by Chinese semiconductor company Xianxin Technology in collaboration with domestic research institutes, has achieved mass production in Beijing and has been successfully applied in the high-end series of Mini LED televisions of leading brands in China.

It is reported that this 28nm display chip adopts the “digital chip + embedded RRAM” technology solution. Compared with the mainstream counterpart in the industry, which uses the “TCON + external FLASH memory,”  this chip effectively addresses issues like the high cost of external memory devices and the slow read speed of compensation parameters.

Furthermore, the chip integrates RRAM IP directly on the 28nm process node, enabling lower cost, smaller size, and higher efficiency.

Data shows that this mass-produced 28nm embedded RRAM image quality adjustment chip is not only the first domestically developed 28nm display chip in China but also the world’s first advanced commercial image quality adjustment chip to use 28nm embedded RRAM IP.

It possesses fully independent intellectual property rights. Its built-in RRAM memory module and core RRAM IP technology are derived from the transformation of research institute results, and the image quality adjustment algorithm is independently developed by Xianxin Technology.

• HKPU Develops a 16-bit Quantum Bit Semiconductor Microprocessor Chip

Recently, a research team from Hong Kong Polytechnic University (HKPU) successfully developed the world’s first 16-bit quantum bit semiconductor microprocessor chip, providing a novel solution for simulating large and complex molecular spectra.

HKPU explained that the team used a linear photonic network and compressed vacuum quantum light source to simulate molecular vibration spectra. This 16-bit quantum microprocessor chip is manufactured and integrated on a single chip.

In addition, the research team also developed a complete system, including optoelectronic thermal packaging for the quantum photonic microprocessor chip and control module, driver software and user interface, as well as programmable underlying quantum algorithms. The developed quantum computing system can be applied to different computational models.

The quantum microprocessor can be used to handle complex tasks, such as faster and more accurate simulations of large protein structures or optimizing molecular reactions.

Dr. Zhu Huihui, a postdoctoral researcher and the first author of the research paper, stated that this method can break through traditional limitations, enabling early practical molecular simulations and potentially achieving quantum acceleration in related quantum chemistry applications.

It is reported that, in addition to HKPU, other collaborative institutions include Nanyang Technological University, City University of Hong Kong, Beijing Institute of Technology, Southern University of Science and Technology, Institute of Microelectronics (IME), and Chalmers University of Technology in Sweden.

Read more

• [News] China’s Core AI Industry Achieved a Market Size of Nearly CNY 600 Billion
• [News] Nanjing, China Achieved Breakthrough in Manufacturing Key SiC Chip for the First Time

(Photo credit: Xianxin Technology)