2nm


2024-06-14

[News] Samsung Unveils Next-gen 2nm Node Roadmap; SF2Z with Backside Power Delivery to Enter Production in 2027

After naming its new head for the semiconductor business in May, claiming to strengthen the company’s competitiveness in cutting-edge chips, Samsung has now disclosed its latest developments regarding AI chips. According to information from Reuters and Samsung’s press release, the company plans ...

2024-04-26

[News] Rapidus Focuses on Small Clients, Diversifies into Japan to Mitigate US Geopolitical Risks

Henri Richard, head of Rapidus Design Solutions, the US subsidiary of Japan's semiconductor foundry startup Rapidus, and former Chief Marketing Officer at processor giant AMD, indicates that Rapidus aims to position itself as a filler of market gaps during the interview with global media The Regis...

2024-04-17

[News] Apple Not Adopting TSMC 2nm for iPhone 17? A19 Pro Chip Rumored to Use N3P Process

Apple currently uses TSMC's 3-nanometer process for multiple chipsets. According to a report from wccftech, the iPhone 17 chipset will not adopt the 2-nanometer process. Instead, the A19 Pro chip, expected in 2025, is reportedly maintaining the 3-nanometer technology. The same report suggests tha...

2024-04-15

[News] TSMC Reportedly Accelerates 2nm Progress, with Kaohsiung Plant Rumored to Commence First Tool-in by Year-end

TSMC, the leading semiconductor foundry, recently announced plans to establish a 2nm production line in the US, while attention remains on expansion progress in Taiwan. According to a report from MoneyDJ, it has indicated that the 2nm fab in Hsinchu's Baoshan is proceeding steadily as planned, an...

2024-04-08

[News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab

The U.S. government officially announced today that it will provide a USD 6.6 billion subsidy to TSMC, and in its latest press release, confirmed that TSMC will build its third fab in Arizona, USA, with total investment rising to USD 65 billion. Due to various construction and chip incentive fact...

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