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3D Stacked CPU
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2023-09-08
Continuing Moore’s Law: Advanced Packaging Enters the 3D Stacked CPU/GPU Era
As applications like AIGC, 8K, AR/MR, and others continue to develop, 3D IC stacking and heterogeneous integration of chiplet have become the primary solutions to meet future high-performance computing demands and extend Moore's Law. Major companies like TSMC and Intel have been expanding their i...
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