Amid concerns on its progress of advanced nodes, Samsung’s DS Division recorded an operating profit of 3.86 trillion won in the third quarter, marking a 40% decline from the previous quarter. Now it seems that the struggling giant plans to further scale down on foundry production, aiming to decrease operations to about 50% by year-end, according to South Korean media outlet the Chosun Daily.

The report notes that Samsung’s semiconductor division is temporarily closing down some production lines at its foundry facilities in response to weak orders from U.S. tech companies and Chinese fabless firms.

According to sources familiar with the situation cited by the report, Samsung has already closed more than 30% of its 4nm, 5nm, and 7nm production lines at Pyeongtaek Line 2 (P2) and Line 3 (P3). Furthermore, the company is said to be carefully keeping an eye on customer orders, and planning to gradually halt operations, possibly shutting down approximately 50% of its facilities by year-end.

Though the financials of its foundry business has not been disclosed separately, analysts project that the chipmaker’s foundry business suffered losses of around 1 trillion won in the third quarter, leading the company to implement cost-cutting measures by shutting down portions of its production lines, according to the report.

Instead of maintaining production lines at low utilization rates, sources cited by the report indicate that Samsung has opted to shut down operations to save on electricity costs more effectively.

The report attributes Samsung’s decision to weaker-than-anticipated orders from Chinese fabless firms, which had previously represented a significant share of Samsung’s 4nm and 5nm production volumes. U.S. trade restrictions on China’s semiconductor sector have led some Chinese fabless companies to postpone their projects ahead of the U.S. presidential election, the report indicates.

The move does raises concerns on whether the company’s technological gap with foundry leader TSMC may be widening. Lee Jong-hwan, a professor of system semiconductor engineering at Sangmyung University, observed that while Samsung seems to prioritize on memory chips, the foundry division has been sidelined, according to the report.

However, in its latest financial announcement, Samsung states that it plans to leverage the mass production on the 2 nanometer (nm) Gate-All-Around (GAA) process to win new clients. The company aims to mass produce 2nm in 2025 and 1.4nm by 2027.

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(Photo credit: Samsung)

According to a report from Economic Daily News, while the industry is still focusing on the launch of Apple’s new products featuring self-developed M4 chips, Apple is reportedly making significant investments in the development of its next-generation M5 chips, to strengthen its position in the AI PC competition with more powerful ARM architecture processors.

Notably, the report highlighted that Apple will continue to adopt TSMC’s 3nm process, increasing orders for TSMC’s advanced processes. According to the report, it is expected that the next-generation M5 chip will be launched as early as the second half of next year to the end of the year.

In the current wave of AI PC competition, tech giants in the x86 camp, such as Intel and AMD, have launched new processors to vie for market share. Meanwhile, Apple, the market leader in the Arm camp, is accelerating its efforts to expand its presence and continue to develop next-generation self-developed chips, as indicated by the report.

According to the report, citing industry sources, Apple’s upcoming M5 chip is expected to deliver enhanced AI performance and computing power, potentially triggering a new wave of iPhone purchases. The report indicated that this will generate substantial chip foundry orders for TSMC. Plus, it will also benefit Apple’s end-product partners, such as Foxconn and Quanta.

Regarding Apple’s decision not to use TSMC’s 2nm process for the M5, the report, citing industry sources, noted that this is primarily due to the high costs. However, compared to the M4, the M5 features significant advancements, as it will utilize TSMC’s 3D chip-stacking technology, known as SoIC. This approach allows for better thermal management and reduced leakage compared to traditional 2D designs, as the report pointed out.

Apart from using TSMC’s 3nm process for chip development, the report noted, citing industry sources, that Apple has actively placed orders for TSMC’s 2nm process and the first batch of production capacity of the A16 process.

According to the report, The 2nm process is expected to be introduced as early as next year in the APs for Apple’s iPhone 17 Pro and 17 Pro Max models. As for the rumored ultra-thin iPhone 17 Air model, its AP may continue to use the 3nm process family.

Regarding clients for the 2nm process, the report noted, citing comments from TSMC’s chairman C.C. Wei during a previous earnings call, that inquiries for the 2nm process are outpacing those for the 3nm process. Additionally, the A16 process is considered highly attractive for AI server applications.

Wei noted that high-performance computing (HPC) applications are increasingly moving toward chiplet designs; however, this shift will not impact the adoption of the 2nm process. According to the report, current customer demand for the 2nm process exceeds that of the 3nm process, and production capacity is expected to be higher, as the report indicated.

According to an industrial source cited by MoneyDJ, TSMC started the mass production of 3nm in 2022, while the 2nm is expected to enter volume production in 2025, indicating that the generation cycle for a node has been expanded to three years.

Thus, supported by TSMC’s major clients, the contribution from 3nm will continue to rise next year and remain a key revenue driver in 2026, while the 2nm process is expected to replicate or even surpass the success of 3nm, MoneyDJ notes. According to previous market speculations, tech giants such as Apple, NVIDIA and AMD are believed to be the first batch of TSMC’s 2nm customers.

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• [News] TSMC Says 2nm More Sought after than 3nm; A16 Attractive for AI Server Clients
• [News] TSMC’s 2nm Wafers Reportedly Set to Double in Price, Benefitting IP/ Material Companies

(Photo credit: Apple)

Rumors have been circulating for a while that China’s tech giants are capable of manufacturing chips in advanced nodes even without the need for extreme ultraviolet (EUV) lithography machines by ASML, and that local foundry SMIC has reportedly produced 5nm chips for Huawei. Now there seems to be a new member joining the ranks of the elite. According to the reports by MyDrivers and Wccftech, Xiaomi has successfully taped out its first 3nm SoC.

Though more details are yet to be confirmed, Wccftech indicates that it is possible that Xiaomi will launch the 3nm chipset sometime next year.

Xiaomi, according to the reports, has been developing its own custom chipsets for years. The first product is believed to be Surge S1, which was released with the Mi 5c smartphone in 2017. The report by MyDrivers suggests that the Surge S1, built on 28nm node, is a 64-bit octa-core processor.

Following the Surge S1, Xiaomi went on to develop several chips, reportedly including the Surge C1, Surge G1, and Surge T1, according to MyDrivers.

The information of Xiaomi’s recent success in its 3nm chip tape-out is reportedly disclosed by Tang Jianguo, Chief Economist of Beijing Municipal Bureau of Economy and Information Technology, at Beijing Satellite TV, MyDrivers notes. Citing Tang’s remarks, Wccftech indicates that the achievement is described as a historic milestone for China.

Wccftech further notes that as companies like Huawei have been prohibited from doing business with TSMC or Samsung due to U.S. trade sanctions, if Xiaomi does have reached the tape-out stage for its 3nm chipset, it could enable other Chinese companies, including Huawei, to leverage this technology in their devices.

However, more details are yet to be confirmed, as there are no updates on whether the SoC will use TSMC’s N3E process or the more advanced N3P node, according to Wccftech. Additionally, details about the chipset’s CPU cluster, GPU, or whether it will feature ARM designs or a custom architecture remain unknown. Therefore, it would be better to approach this rumor with caution.

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(Photo credit: Xiaomi)

TSMC has passed the test of the market with flying colors as it reported record high profit in the third quarter at the earnings call. By confirming that the AI demand is “real,” TSMC Chairman C.C. Wei stated that the foundry giant is expected to enjoy healthy growth over the next five years. But which node would be the one most clients show strong interest in?

According to the reports by the Economic Daily News and MoneyDJ, customer inquiries for 2nm are even higher than those for 3nm, while A16 is highly attractive for AI server applications.

TSMC’s 3nm has already shown robust momentum this year, as its shipments accounted for 20% of total wafer revenue in the third quarter, rising from 9% and 15% in the first and second quarter, respectively.

According to an industrial source cited by MoneyDJ, TSMC started the mass production of 3nm in 2022, while the 2nm is expected to enter volume production in 2025, indicating that the generation cycle for a node has been expanded to three years.

Thus, supported by TSMC’s major clients, the contribution from 3nm will continue to rise next year and remain a key revenue driver in 2026, while the 2nm process is expected to replicate or even surpass the success of 3nm, MoneyDJ notes. According to previous market speculations, tech giants such as Apple, NVIDIA and AMD are believed to be the first batch of TSMC’s 2nm customers.

Citing C.C.Wei, the Economic Daily News notes that the high-performance computing (HPC) applications demand more powerful processors, which accelerates the development of chiplet designs. However, the trend does not seem to impact the adoption of 2nm, and clients are showing even stronger interests for the node compared with 3nm.

And TSMC does plan to expand its 2nm capacity thanks to the strong demand, as the schedule of mass producing 2nm in 2025 remains on track.

According to a previous report from MoneyDJ, TSMC’s 2nm fabs in Hsinchu’s Baoshan and Kaohsiung will achieve a monthly capacity of approximately 30,000 to 35,000 wafers, respectively. By 2027, their combined capacity is set to exceed 100,000 wafers, marking the mainstream transition to the next generation of processes.

As for TSMC’s angstrom-level A16 process, it is creating a buzz even before mass production in 2026. Citing C.C.Wei’s remarks, the report by the Economic Daily News notes that the A16 is highly attractive for AI server applications, and TSMC is actively preparing the related production capacity to meet customer demand.

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Ahead of TSMC’s upcoming third-quarter earnings call this Thursday, a report by the Commercial Times gives a heads-up on the foundry giant’s outlook of 3nm orders next year. With NVIDIA and AMD ramping up their next-gen AI accelerators, combined with the strong demand from smartphone chips, orders for TSMC’s 3nm node are set to see a surge in 2025, the report indicates.

According to analysts cited by the report, most flagship smartphone chips are expected to be manufactured with 3nm next year. For instance, Apple’s A19 Pro is said to adopt TSMC’s N3P process, while the Android phones are likely to follow suit.

In terms of the demand from AI accelerators, the report notes that AMD’s MI350 series will likely be manufactured with the 3nm node, which is going to benefit TSMC.

It is worth noting that according to another report by Commercial Times, at Advancing AI 2024 last week, AMD CEO Lisa Su highlighted the company’s close partnership with TSMC, saying that she would be glad to see the CHIPS Act bringing more manufacturing lines back to the U.S.

Sources cited by Commercial Times suggest that for now, AMD has no plans to collaborate with chip makers other than TSMC, and that the company is currently conducting a qualification assessment for chip production at TSMC’s Arizona fab (Fab 21).

On the other hand, Commercial Times indicates that NVIDIA’s orders on TSMC will likely see an increase next year, which would further tighten the foundry giant’s capacity in 3nm and 5nm. NVIDIA’s R-series GPUs are reportedly to be manufactured with TSMC’s 3nm as well, the report notes, but it would not be released until 2026.

TSMC is expected to see strong 3nm demands from other tech giants in 2025 as well. According to the report, Intel is said to outsource most of its Lunar Lake chips to TSMC, while the AI PC chip MediaTek co-develops with NVIDIA is also rumored to be built using the 3nm process. The report states that this chip is expected to debut in the second quarter of next year and enter mass production in the third quarter.

Sources cited by the report note that as clients turn to place orders on 3nm for their latest AI accelerators, foundry capacity will further be strained. Notably, TSMC’s CoWoS packaging reportedly allows interposers reaching 3.3 times for its maximum reticle size to manufacture chips such as NVIDIA’s B200, AMD’s MI300, or Intel’s Gaudi 3, with the number of chips produced on per interposer becoming fewer.

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(Photo credit: TSMC)