Recently, three leading Chinese semiconductor equipment manufacturers—AMEC (Advanced Micro-Fabrication Equipment Inc.), NAURA Technology Group, and ACM Research—released their latest 2024 financial forecasts and updates on new equipment developments. From revenue and profit changes to R&D...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...