On January 16, Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding, officially inaugurated its new advanced packaging facility at the Tanzi Science Park. SPIL also announced that three additional advanced packaging facilities are set to expand production capacity by 2025....

Recently, leading foundries GlobalFoundries and TSMC have both ramped up efforts in advanced packaging, while the U.S. Department of Commerce has increased subsidies for advanced packaging technologies. GlobalFoundries Invests $575 million in Advanced Packaging and Photonics Center On January ...

Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC's CoWoS monthly ca...

Has the elephant started dancing? In addition to the reshuffle of its semiconductor executive team in November, Samsung is reportedly set to significantly revamp its supply chain for advanced semiconductor packaging, as per a report from South Korean media outlet ETNews. Notably, the move is expe...