With the rapid advancement of technologies such as artificial intelligence, high-performance computing, 5G, and autonomous driving, the semiconductor industry is undergoing unprecedented transformations. In this wave of technological innovation, packaging technology, often seen as the "unsung hero" ...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Amid the AI boom, global semiconductor giants such as TSMC have been making strides in CoWoS capacity expansion. However, market demand for materials related to advanced packaging has also been brewing, as China is seeing a surge in mergers and acquisitions in the sector recently, according to Chine...