Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...

TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC's CoWoS monthly ca...

Has the elephant started dancing? In addition to the reshuffle of its semiconductor executive team in November, Samsung is reportedly set to significantly revamp its supply chain for advanced semiconductor packaging, as per a report from South Korean media outlet ETNews. Notably, the move is expe...

With the rapid advancement of technologies such as artificial intelligence, high-performance computing, 5G, and autonomous driving, the semiconductor industry is undergoing unprecedented transformations. In this wave of technological innovation, packaging technology, often seen as the "unsung hero" ...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...