On November 30th, Apple revealed an extension of its partnership with Amkor in the advanced packaging sector within the United States. Apple proudly proclaimed its role as the inaugural and principal client for Amkor’s recently established facility in Peoria, Arizona. In this collaboration, Amkor will handle the packaging of Apple chips manufactured at the nearby TSMC’s wafer fab. Worth noting, Apple is also TSMC’s leading customer at the Arizona fab.

Jeff Williams, Apple’s CEO, emphasized Apple’s unwavering commitment to American manufacturing, stating that they will continue expanding investments in the U.S. Apple silicon’s groundbreaking performance capabilities have enabled users to accomplish unprecedented tasks. The announcement highlights the anticipation of Apple silicon being manufactured and packaged in Arizona.

According to the press release, Apple and Amkor have been collaborating for over a decade, packaging chips extensively used in all Apple products. Concerning the new factory, Amkor will invest approximately $2 billion, and upon completion, it will employ over 2,000 people.

Apple also underscores that the investment in advanced manufacturing is part of the company’s commitment in 2021 to invest USD 430 billion in the U.S. economy over five years. Currently, Apple is working towards achieving this goal through direct spending with American suppliers, data center investments, U.S. capital expenditures, and other domestic expenditures.

On the other hand, Amkor outlined plans to establish a state-of-the-art manufacturing campus featuring an expansive 500,000 square feet of cleanroom space. The primary objective of the initial phase is to initiate production within the next two to three years.

Amkor aims to provide cutting-edge technology catering to high-volume semiconductor advanced packaging and testing, specifically supporting crucial markets such as high-performance computing, automotive, and communications. The newly proposed production facility will be strategically located within a semiconductor hub, surrounded by front-end wafer fabs, IDM, and existing or expanding suppliers in the field, including TSMC, Intel, Applied Materials, ASML, and others.

“Amkor has been a strategic OSAT partner to TSMC for many years,” said Dr. C.C. Wei, CEO of TSMC. “TSMC applauds Amkor for investing in the future of the semiconductor industry with us in Arizona. We share Amkor’s excitement for its significant investment and the value this facility will bring to TSMC, our customers, and the ecosystem.”

Giel Rutten, CEO from Amkor, indicated the incorporation of this new U.S. facility with Amkor’s advanced facilities across Asia and Europe serves to strengthen global extension and fosters both global and regional supply chains. Amkor’s investment is positioned to bolster them in advanced packaging and testing, concurrently reaffirming the commitment to expanding chip manufacturing in the United States.

According from the financial reports, Amkor’s two largest clients are Apple and Qualcomm. Apple accounted for 20.6% and Qualcomm 10.1%. of Amkor’s USD 7.1 billion in revenue last year.
(Image: Amkor)

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ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE’s progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing investments in advanced packaging, expecting a twofold increase in revenue share for advanced packaging in the coming year.

The market’s attention is keenly focused on wafer bank (a storage system used in semiconductor manufacturing to keep semiconductor wafers on hand for production, helping to streamline the manufacturing process) levels and inventory management. Tung mentioned that wafer bank levels are consistently declining and will further reduce Q4. With consumer electronics and computer clients gearing up to launch new products, inventory levels are expected to be maintained at a certain level. Overall, inventory reduction is nearing completion.

Tung emphasized that the real challenge lies not in inventory reduction but in the timing of the recovery in consumer demands and the impact of inflation. ASE remains cautious in its outlook for the upcoming year.

As for AI-related developments, Tung is optimistic about the expansion of CoWoS advanced packaging capacity through TSMC. ASE is also set to boost its production capacity for advanced packaging to cater to urgent customer demands. Next year, it is expected that revenue in advanced packaging will double. Tung emphasized that the AI era has already arrived and expects AI to extend to more terminal devices over the next few years. ASE has also invested in the development of Co-Packaged Optics (CPO) technology, ready to meet customer demands when the market is prepared.

To seize opportunities in advanced packaging, ASE previously introduced an Integrated Design Ecosystem (IDE) to optimize collaborative design tools through a platform, systematically enhancing advanced packaging architecture. This initiative has the potential to reduce design cycles by approximately 50%.

Tung pointed out that there are signs of a recovery in PC-related chip testing and packaging, and this year’s performance in automotive chip testing and packaging is expected to outperform other segments.

Looking ahead to future market conditions, Tung believes that the global semiconductor industry’s environment in the coming year will be more favorable than the current year.

(Image: ASE)

With the approach to the end of 2023, TrendForce revealed the tech trends in every sector, apparently, AI continues as the main focus to decide the direction of how the tech supply chain will be in the next few years, here are the seeings:

CSPs increase AI investment, driving a 38% growth in AI server shipments by 2024

• CSPs increase AI investment, fueling a 38% growth in AI server shipments by 2024.
• Major CSPs like Microsoft, Google, and AWS are driving this growth due to the rising popularity of AI applications, pushing AI server shipments to 1.2 million units in 2023.

HBM3e set to drive an annual increase of 172% in HBM revenue

• Major memory suppliers are set to introduce HBM3e with faster speeds (8 Gbps) to enhance the performance of AI accelerator chips in 2024–2025.
• HBM integration is becoming common among GPU manufacturers like NVIDIA and AMD, and it is expected that HBM will significantly contribute to memory suppliers’ revenues in 2024, with an annual growth rate of 172%.

Rising demand for advanced packaging in 2024, the emergence of 3D IC technology

• Leading semiconductor firms like TSMC, Samsung, and Intel are emphasizing advanced packaging technology’s importance in boosting chip performance, conserving space, reduce power usage, and minimize latency. They’re establishing 3D IC research centers in Japan to underscore this role.
• Generative AI is driving increased demand for 2.5D packaging tech, integrating computing chips and memory with a silicon interposer layer. Additionally, 3D packaging solutions like TSMC’s SoIC, Samsung’s X-Cube, and Intel’s Foveros.

NTN is set to begin with small-scale commercial tests, broader applications of this technology are on the way in 2024

• Collaboration between satellite operators, semiconductor firms, telecom operators, and smartphone makers is growing due to increased satellite deployments by operators. This collaboration focuses on mobile satellite communication applications and bidirectional data transmission under specific conditions.
• Major semiconductor manufacturers are ramping up efforts in satellite communication chips, leading top smartphone manufacturers to integrate satellite communication into high-end phones using the SoC model, which is expected to drive small-scale commercial testing of NTN networks and promote widespread adoption of NTN applications.

6G communication to begin in 2024, with satellite communication taking center stage

• 6G standardization begins around 2024-2025, with initial technologies expected by 2027-2028. This enables novel applications like Reconfigurable Intelligent Surfaces (RIS), terahertz bands, Optical Wireless Communication (OWC), NTN for high-altitude comms, and immersive Extended Reality (XR) experiences.
• Low-orbit satellites will play a key role in 6G as its standards solidify, peaking around the time of 6G commercialization. The use of drones for 6G communication and environmental sensing is also set to surge in the 6G era.

Innovative entrants drive cost optimization for Micro LED technology in 2024

• In 2023, the focus in Micro LED display technology is on cost reduction through chip downsizing, aiming for at least a 20-25% annual reduction. A hybrid transfer approach, combining stamping and laser bonding, is gaining attention for efficient mass production.
• Micro LED holds potential in micro-projection displays for transparent AR lenses. Challenges include achieving ultra-high PPI with 5 µm or smaller chips, particularly with red LEDs’ low efficiency. Various innovative approaches, such as InGan-based red LEDs and vertically stacked RGB LEDs.

Intensifying competition in AR/VR micro-display technologies

• Increasing AR/VR headset demand drives demand for ultra-high PPI near-eye displays, with Micro OLED technology at the forefront, poised for broader adoption.
• Challenges in brightness and efficiency impact Micro OLED displays and their dominance in the head-mounted display market depends on the development of various micro-display technologies.

Advancements in material and component technologies are propelling the commercialization of gallium oxide

• Gallium oxide (Ga₂O₃) is gaining prominence for next-gen power semiconductor devices due to its potential in high-voltage, high-temperature, and high-frequency applications in EVs, electrical grids, and aerospace.
• The industry is already producing 4-inch gallium oxide mono-crystals and advancing Schottky diode and transistor fabrication processes, with the first Schottky diode products expected by 2024.

Solid-state batteries poised to reshape the EV battery landscape over the next decade

• Major automakers and battery manufacturers are investing in solid-state and semi-solid-state battery technologies, aiming for a new cycle of technological iteration by 2024.
• After Li-ion batteries, sodium-ion batteries, with lower energy density, are suitable for budget-friendly EVs, and hydrogen fuel cells offer long-range and zero emissions, primarily for heavy-duty commercial vehicles, with widespread adoption expected after 2025, despite challenges.

BEVs in 2024 rely on power conversion efficiency, driving range, and charging efficiency

• Automakers are optimizing battery pack structures and material ratios to increase energy density and driving range. Solid-state batteries, with high energy density, may see limited installations in vehicles as semi-solid batteries in 2H23.
• The 800V platform will enable high-power fast charging, leading to the expansion of high-power charging stations. AI advancements are driving EVs toward advanced autonomous driving, with Tesla’s Dojo supercomputer investing in neural network training to maintain its position in the intelligent driving market.

Green solutions with AI simulations emerging as a linchpin for renewable energy and decarbonized manufacturing

• Under the background of optimizing energy consumption, creating interconnected data ecosystems, and visualizing energy flow and consumption. Carbon auditing tools and AI are key for organizations aiming to reduce carbon emissions and enhance sustainability.
• The IEA predicts global renewable energy generation to reach 4,500 GW by 2024, driven by policy support, rising fossil fuel prices, and energy crises. The adoption of AI-driven smart technologies in peripheral systems for stable energy generation.

OLED’s expansion will across various applications driven by the innovation of foldable phones

• OLED folding phones are improving in design by using lightweight materials, innovative hinge structures, and cost-reduction efforts to approach the thickness and weight of traditional smartphones.
• In the IT sector, industry players like Samsung, BOE Technology, JDI, and Visionox are making significant investments and developments in OLED technology to expand into various markets. Anticipated advancements in technology and materials are expected to increase OLED market penetration by 2025.

On October 11th, Amkor announced the official opening of its factory located in the Yen Phong 2C Industrial Park in Bac Ninh Province, Vietnam. The new facility, occupying 57 acres, is set to become Amkor’s largest, with an investment of approximately $1.6 billion by 2035. The factory primarily focuses on providing advanced system-level packaging and testing solutions to meet the semiconductor industry’s demand for advanced packaging. However, the company has not disclosed the factory’s current production and capacity.

Multiple Players Pursue CoWoS

The ongoing AI trend continues to drive demand for Chip-on-Wafer-on-Substrate (CoWoS) technology, benefiting TSMC, which holds a significant share of CoWoS production orders. However, companies like ASE Group, Amkor, and UMC are also positioning themselves in the CoWoS packaging manufacturing space. Industry experts believe that given the current high demand for TSMC’s CoWoS production, part of this demand may potentially shift to Amkor’s factories.

Furthermore, the popular Nvidia AI chips, which are in high demand globally, utilize 2.5D packaging technology, a responsibility currently held by TSMC. Recently, Nvidia hinted at the mass production of new AI chips like the GH200 and general server chip L40S, with reports suggesting that L40S will not require 2.5D packaging. Instead, it will be shared among several backend packaging companies, including ASE, Amkor, and SPIL.

Industry source has noted the strong demand for CoWoS in the AI sector, and with TSMC’s CoWoS production capacity already unable to meet demand for several quarters, some demand may potentially shift to Amkor or Samaung’s facilities.

Amkor has announced plans to expand its advanced packaging CoWoS-like capacity. According to industry insiders, Amkor’s monthly production capacity for 2.5D advanced packaging is expected to reach approximately 3,000 wafers in early 2023, with estimates of reaching 5,000 wafers by the end of 2023 and aiming for a significant increase to 7,000 units by the end of 2024.

Additionally, ASE Group has announced its presence in advanced CoWoS-related packaging. With their fan-out chip-on-substrate (FOCoS-Bridge) packaging technology, ASE has been chosen by major chip design house to handle their backend packaging after CoW.

In mid-September, South Korean media reported that Samsung is set to introduce its FO-PLP 2.5D advanced packaging technology to catch up with TSMC in the field of advanced packaging for AI chips. Samsung’s Advanced Packaging (AVP) team began developing FO-PLP advanced packaging for 2.5D chip packaging, allowing the integration of System-on-Chip (SoC) and High Bandwidth Memory (HBM) into an interposer to create a complete chip.

It’s worth mentioning that Samsung’s FO-PLP 2.5D packaging is rectangular, while TSMC’s CoWoS 2.5D uses a circular substrate. Samsung’s FO-PLP 2.5D packaging avoids edge substrate losses and boasts higher production efficiency. However, due to the need to transplant chips from wafers onto rectangular substrates, the process is more complex.

CoWoS Demand Continues

CoWoS technology is a form of 2.5D and 3D packaging, where chips are stacked and then packaged onto a substrate, resulting in a 2.5D or 3D structure. This technology reduces chip space, while also decreasing power consumption and costs. CoWoS packaging is applied in high-performance computing, artificial intelligence, data centers, 5G, the Internet of Things, automotive electronics, and other fields.

TrendForce research indicates a growing demand for advanced packaging technologies for AI and HPC chips. Currently, TSMC’s CoWoS is the primary choice for AI server chip production. CoWoS packaging mainly consists of CoW (Chip on Wafer), integrating various logic ICs (such as CPUs, GPUs, ASICs, etc.) and HBM memory, while oS (On Substrate) integrates CoW elements using Solder bump interconnects and packages them on a substrate. These CoWoS packages become the primary computing units on server motherboards, together with other components like networks, storage, power supply units (PSUs), and other I/O units, forming complete AI server systems.

Explore more

• Advanced Packaging in High Demand, TSMC and OAST Increasing Equipment Orders
• Understanding the 3D Packaging Trends Pursued by TSMC, Intel and Samsung
• An In-Depth Explanation of Advanced Packaging Technology: CoWoS

(Photo credit: Amkor)

As AI demand continues to surge, TSMC (Taiwan Semiconductor Manufacturing Company) has initiated an extensive expansion plan for its CoWoS (Chip-on-Wafer-on-Substrate) production. Within the industry, reports suggest that TSMC, a leading semiconductor foundry, placed a significant wave of orders with Taiwanese equipment manufacturers last week, creating a notable impact.

Additionally, outsourced semiconductor assembly and testing (OSAT) giants, which were originally inquiring about orders, have also significantly increased their orders for advanced packaging. This wave of orders is estimated to be fulfilled between March and April of the upcoming year.

The growth in demand for advanced semiconductor processes due to AI applications necessitates advanced packaging technologies to keep pace. With packaging technologies advancing from 2D and 2.5D to the more advanced 3D IC (Integrated Circuit) configurations, the number of IC stacking layers is increasing, leading to a greater demand for advanced packaging equipment. Considering the current emphasis on CoWoS technology, the industry estimates that production capacity will reach 12,000 to 14,000 wafers in 2023 and double to over 30,000 wafers in 2024.

According to a report by Taiwan’s Money DJ, information from equipment industry sources reveals that TSMC recommenced orders for CoWoS equipment in April 2023, with a second wave of orders in June. Subsequently, sporadic additional orders were placed, and last week witnessed a new significant wave of orders, surprising many.

An anonymous executive from a Taiwanese equipment company expressed that they initially believed TSMC’s orders for CoWoS equipment had concluded, making the recent wave of orders even more unexpected. Furthermore, the increase in orders for advanced packaging equipment by semiconductor testing and packaging facilities is also seen as encouraging.

Market experts believe that semiconductor testing and packaging facilities and semiconductor foundries have different positions and advantages in the advanced packaging market. Their cooperative relationships outweigh their competition. Major OSAT players like ASE, Amkor, and JCET have long possessed advanced packaging technology and are positioned to become an alternative choice for major foundries due to their technical upgrades and competitive pricing. In other words, top-tier orders from customers will be firmly in TSMC’s grasp, while other opportunities will likely be pursued by SATS companies.

Regarding the supply of CoWoS equipment, suppliers like Scientech have received over 30 orders for wet etching processing equipment, while Grand Process Technology and others have shipped nearly 20 units. Meanwhile, G2C+ Alliance members such as GMM and C Sun have reportedly received over 40 orders from the TSMC’s Longtan factory.

(Photo credit: TSMC)