Amid the AI boom, global semiconductor giants such as TSMC have been making strides in CoWoS capacity expansion. However, market demand for materials related to advanced packaging has also been brewing, as China is seeing a surge in mergers and acquisitions in the sector recently, according to Chine...

Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress. TSMC Establishes First Advanced Packaging Zone According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first "Advanced...

According to a report in South China Morning Post, China's leading chip-packaging company, Changjiang Electronics Technology Co. (JCET), recently announced a significant restructuring of its board of directors following the acquisition of a 22.5% stake by the state-owned China Resources Group, as t...

Amkor and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high vo...

Driven by the massive demand for AI chips, advanced packaging is in short supply, and the development of three major advanced packaging technologies CoWoS, SoIC, and FOPLP is booming. In addition, two major billion-dollar projects in China have made recent progress, further advancing the region's ad...