According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Amid the AI boom, global semiconductor giants such as TSMC have been making strides in CoWoS capacity expansion. However, market demand for materials related to advanced packaging has also been brewing, as China is seeing a surge in mergers and acquisitions in the sector recently, according to Chine...

Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress. TSMC Establishes First Advanced Packaging Zone According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first "Advanced...

According to a report in South China Morning Post, China's leading chip-packaging company, Changjiang Electronics Technology Co. (JCET), recently announced a significant restructuring of its board of directors following the acquisition of a 22.5% stake by the state-owned China Resources Group, as t...