In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted. C.C. Wei pointed out that under ...

With the surge in new applications like AI, advanced packaging remains a hot topic, particularly with FOPLP (Fan-Out Panel Level Packaging) technology gaining renewed attention. According to sources cited by a report from MoneyDJ, leading semiconductor foundry TSMC has officially formed a team, curr...

According to a report from Economic Daily News, Foxconn Group is advancing into the field of advanced packaging with a strategic alliance between Taiwan and Japan, focusing on the trending panel-level fan-out packaging (FOPLP). Following Innolux's related developments in Taiwan, another of Foxconn's...

TSMC's advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has stated that TSMC intends to build another advanced pack...

On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end testing of advanced packaging processes, and high-performance computing ...