As the demand for AI GPUs increases, TSMC's advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same report, TS...

According to a report from Commercial Times, after suffering a multi-billion-dollar loss in its foundry business, Intel has recruited Naga Chandrasekaran, a veteran responsible for process technology development at Micron, as its Chief Operating Officer. Intel is reportedly facing setbacks in dev...

According to a report from UDN, China's largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the "JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project." The project will soon be com...

As TSMC stands at the core of the global semiconductor industry, NVIDIA founder Jensen Huang stirred up an AI frenzy when he visited Taiwan in June. According to a report from Commercial Times, during his visit, he met with TSMC founder Morris Chang and then-President C.C. Wei, and personally visite...

TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is also entering the FOPLP (Fan-Out Panel-Level Pac...