According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in Q4 2026, the facility will repor...

According to a previous report from Nikkei citing sources, TSMC is rumored to be entering the fan-out panel-level packaging sector. As cited in a report from UDN, Intel and Samsung have also announced plans to invest in this area. With TSMC, the leading wafer foundry, joining the fray, the three sem...

Taiwan's semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity. According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise ...

With high demand for AI chips from major players like NVIDIA and AMD, the capacity for advanced packaging falls short of meeting demand. Industry sources cited in a report from the Economic Daily News indicate that TSMC's new CoWoS facility in the Southern Taiwan Science Park in Chiayi is now underg...

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...