South Korean memory giant SK Hynix is significantly investing in advanced chip packaging, aiming to capture more demand for High Bandwidth Memory (HBM), a vital component driving the burgeoning AI market. According to Bloomberg's report, Lee Kang-Wook, currently leading SK Hynix's packaging res...

On March 4th, Chinese assembly and testing company, JCET Group (JCET), announced its intention to acquire 80% equity of SanDisk Semiconductor Shanghai Co., Ltd. (SDSS), a subsidiary of Western Digital Corporation (WDC), for USD 624 million in cash. This strategic move aims to expand JCET’s market ...

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

Industry sources cited by the Liberty Times Net have pointed out that the Kumamoto plant holds significant importance for both Taiwan and Japan, as Japan is expected to look for attracting investments from TSMC, Intel, and Samsung to establish manufacturing facilities in the country. TSMC stands ...

In a bid to enhance its foundry capabilities, Samsung is earnestly integrating hybrid bonding technology. According to industry sources, Applied Materials and Besi Semiconductor are establishing equipment for hybrid bonding at the Cheonan Campus, slated for use in next-generation packaging solutions...