Taiwan’s semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity.

According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise its 3nm prices by over 5%, and advanced packaging prices are anticipated to increase by approximately 10% to 20% next year.

The members of TSMC’s 3nm family include N3, N3E, N3P, as well as N3X and N3A. As the existing N3 technology continues to be upgraded, N3E, which began mass production in the fourth quarter of last year, targets applications such as AI accelerators, high-end smartphones, and data centers.

N3P is scheduled for mass production in the second half of this year and is expected to become mainstream for applications in mobile devices, consumer products, base stations, and networking through 2026. N3X and N3A are customized for high-performance computing and automotive clients.

Source: TSMC

Per the industry sources cited by the same report, TSMC’s Zhunan advanced packaging plant (AP6), operational for a year now, has become Taiwan’s largest CoWoS base with the equipment moved into its AP6C plant. In the third quarter, CoWoS monthly production capacity is expected to double from 17,000 to 33,000 wafers.

Industry sources cited by the report further suggests that while AI accelerators do not use the most cutting-edge manufacturing processes, they rely heavily on advanced packaging technology. The ability of global semiconductor companies to secure more advanced packaging capacity from TSMC will determine their market penetration and control.

TSMC’s advanced packaging capacity is scarce, with primary customer NVIDIA having the highest demand, occupying about half of the capacity, followed closely by AMD. Broadcom, Amazon, and Marvell have also expressed strong interest in using advanced packaging processes. With gross margins close to 80%, NVIDIA is said to agree to price increases to secure more advanced packaging capacity, thereby distancing itself from competitors.

Previously, NVIDIA CEO Jensen Huang emphasized that TSMC is not just manufacturing wafers but also handling numerous supply chain issues. He also agreed that the current pricing is too low and would support TSMC’s price increase actions.

The industry sources cited by Commercial Times have indicated that TSMC plans to add CoWoS-related equipment by the third quarter and has requested equipment manufacturers to dispatch more engineers to fully staff its Longtan AP3, Zhunan AP6, and Central Taiwan Science Park AP5 plants.

In addition to Zhunan’s AP6C, the Central Taiwan Science Park plant, which originally only handled the latter stages of oS, will also gradually transition to CoW processes. Meanwhile, the Chiayi site is in the land preparation stage and is expected to progress faster than Tongluo.

Reportedly, industry sources further reveal that the prices for advanced process nodes such as 3nm and 5nm will also be adjusted. Particularly, strong demand for 3nm orders in the second half of the year is expected to drive utilization rates to near full capacity, extending through 2025. The 5nm process is experiencing similar demand dynamics, driven by AI needs.

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(Photo credit: TSMC)

The New York Times reported on June 5th that the U.S. Department of Justice (DOJ) and the Federal Trade Commission (FTC) have reached an agreement, led by senior officials of both agencies, over the past week. The DOJ will investigate whether NVIDIA has violated antitrust laws, while the FTC will examine the conducts of OpenAI and Microsoft.

Reportedly, Jonathan Kanter, who is said to be the top antitrust official in the DOJ’s Antitrust Division, highlighted at an AI conference at Stanford University last week that AI’s reliance on massive amounts of data and computing power gives dominant companies a significant advantage. In a February interview, FTC Chair Lina Khan stated that the FTC aims to identify potential issues in the early stages of AI development.

As per Reuters’ report, Microsoft, OpenAI, NVIDIA, DOJ and FTC did not immediately respond to requests for comment outside regular business hours.

In a May interview with CNBC, Appian co-founder and CEO Matt Calkins stated that AI might not be a winner take all market. He suggested that if alliances could secure victory in the AI race, Google would already have won.

Per a report from Roll Call on May 15th, a bipartisan Senate AI working group led by Senate Majority Leader Chuck Schumer released an AI roadmap, calling for the federal government to invest at least USD 32 billion annually in non-defense-related AI systems.

In March, The Information reported that Microsoft does not want its hiring of Inflection AI’s two co-founders and the majority of its 70-member team to be perceived as an acquisition.

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(Photo credit: NVIDIA)

On June 5th, NVIDIA CEO Jensen Huang gave a congratulatory gift to TSMC’s new chairman C.C. Wei, emphasizing that TSMC’s stock price has been undervalued. He supports Wei’s value theory and will back TSMC in its wafer and CoWoS pricing.

As per a report from Commercial Times citing sources, it’s estimated that both parties will negotiate chip prices for next year, potentially boosting TSMC’s revenue and profit margins further.

Jensen Huang revealed that he is not particularly worried about geopolitical issues because Taiwan has a strong supply chain. To ensure annual advancements in computing power, NVIDIA is building complete systems and creating more value.

Huang further emphasized that TSMC is not just manufacturing wafers but also handling numerous supply chain issues. He agrees that the current pricing is too low and will support TSMC’s price increase actions.

Notably, according to a previous Commercial Times’ report, NVIDIA’s H200 and B100 are said to adopt TSMC’s 4-nanometer and 3-nanometer processes, respectively.

Industry sources cited by Commercial Times also noted that in NVIDIA’s most recent quarterly report, its gross margin reached 78.36%, significantly outperforming AMD’s 46.78% and even TSMC’s first-quarter margin of 53.07%, exceeding it by 25 percentage points. If TSMC raises prices for its advanced processes, NVIDIA’s gross margin will remain unaffected. However, this price increase will dilute the gross margins for other companies using TSMC’s advanced processes, including Apple, AMD, and Qualcomm. 

In response to long-term capacity planning, TSMC held a board meeting on June 5th and approved a capital budget of USD 17.356 billion to expand advanced process capacity, primarily to address long-term capacity planning and the burgeoning demand for AI.

Semiconductors are fundamental to driving AI, with advanced processes and packaging being crucial competitive factors. Last year, TSMC’s advanced packaging capacity was strained, with ODM and OEM companies waiting for supply. Although there has been some relief in the first quarter of this year, the market demand is still unmet.

TSMC has confirmed the strong demand, stating that even tripling the capacity from 5nm to 3nm processes is insufficient, necessitating further capacity expansion. Sources cited by Commercial Times estimate that by the end of this year, TSMC’s CoWoS monthly capacity could reach 45,000 to 50,000 wafers, while SoIC capacity could reach 5,000 to 6,000 wafers.

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(Photo credit: TSMC)

During NVIDIA founder and CEO Jensen Huang’s keynote speech on June 2, he shared insights on how the AI era is driving the development of a new global industrial revolution.

According to a report from TechNews, he covered various technologies and application areas, including advancements in accelerated computing, microservices, industrial digitalization, and consumer devices, which are expected to become key focus areas in the evolving AI market.

• Accelerated Computing

1. Collaboration between the computer industry and NVIDIA to build AI factories and data centers: NVIDIA and leading computer manufacturers worldwide announced today the launch of a series of systems based on the NVIDIA Blackwell architecture. These systems feature Grace CPUs, NVIDIA networking technologies, and infrastructures to assist enterprises in establishing AI factories and data centers.

2. Foxconn utilizes NVIDIA artificial intelligence and Omniverse technology to train robots and streamline assembly operations: Foxconn operates over 170 plants worldwide, with its latest being a virtual plant driving the latest developments in industrial automation technology.

The latest of Foxconn’s plant is a digital twin model of a new factory in Guadalajara, Mexico, a hub for the electronics industry. Engineers at Foxconn define processes and train robots in this virtual environment to enable physical factories to efficiently produce the next generation of accelerated computing engines, the NVIDIA Blackwell HGX system.

3. NVIDIA significantly strengthens Ethernet networks for generative artificial intelligence: NVIDIA announced widespread adoption of the NVIDIA Spectrum-X Ethernet platform and will accelerate the release of new products. CoreWeave, GMO Internet Group, Lambda, Scaleway, STPX Global, and Yotta are the first batch of AI cloud service providers to adopt NVIDIA Spectrum-X, bringing ultimate network performance to their AI infrastructure.

Additionally, NVIDIA’s partners have also released products utilizing the Spectrum platform, including ASRock Rack, ASUS, GIGABYTE Technology, Ingrasys Inc., Inventec, Quanta Cloud Technology, Wistron and Wiwynn. Moreover, Dell Technologies, Hewlett Packard Enterprise, Lenovo, and Super Micro Computer have collaborated with NVIDIA to incorporate the Spectrum platform into their respective products.

• Microservices

NVIDIA NIM has revolutionized deployment model: NVIDIA has announced that its inference microservice, NVIDIA NIM, optimized in container form, is now available for download by 28 million developers worldwide.

This allows deployment to cloud, data centers, or workstations, enabling developers to effortlessly build generative artificial intelligence applications for assisting partners, such as copilots and chatbots, within minutes, a process that previously took several weeks.

• Industrial Digitalization

1. Electronics manufacturers adopt NVIDIA AI and Omniverse to drive robotic factories and accelerate industrial digitization: NVIDIA announced that major Taiwanese electronics manufacturers, including Delta Electronics, Foxconn, Pegatron Corporation, and Wistron Corporation, are using NVIDIA’s technology to transform their factories into more autonomous production facilities through new reference workflows.

This workflow combines NVIDIA Metropolis visual artificial intelligence (AI) technology, NVIDIA Omniverse’ physically accurate rendering and simulation technology, and NVIDIA Isaac’s AI robot development and deployment technology.

2. Industry leaders adopt NVIDIA’s robotic technology to develop tens of millions of AI-supported autonomous machines, including BYD Electronics, Siemens, Teradyne Robotics, and Alphabet’s Intrinsic, among more than ten global leading companies in the robotics industry.

These companies integrate NVIDIA Isaac acceleration libraries, physically principled simulation content, and AI models into their software frameworks and robot models to enhance efficiency in factories, warehouses, and distribution centers. This enables human colleagues to work in safer environments and serves as intelligent assistants in executing repetitive or ultra-precise tasks.

3. NVIDIA introduces NVIDIA IGX with Holoscan support, enabling enterprise software to run medical, industrial, and scientific artificial intelligence applications in real-time at the edge: To meet the growing demand for real-time artificial intelligence computing technology at the industrial edge, NVIDIA announces the comprehensive launch of NVIDIA AI Enterprise-IGX software with Holoscan on the NVIDIA IGX platform.

• Consumer Devices

1. NVIDIA utilizes GeForce RTX AI PC to deliver the real AI assistant experience: NVIDIA announces the launch of the new NVIDIA RTX technology, designed to support AI assistants and digital human platforms running on new GeForce RTX AI laptops.

2. NVIDIA introduces Digital Human Microservices to lay the foundation for future generative AI digital avatars: NVIDIA announces the comprehensive rollout of NVIDIA ACE generative artificial intelligence microservices to accelerate the development of the next wave of digital humans and numerous breakthroughs in generative AI soon to be introduced on the platform.

Companies in customer service, gaming, and healthcare sectors are among the first to adopt ACE technology, making it easier to create, personalize, and interact with realistic digital humans. These microservices have broad applications in customer service, telehealth, gaming, and entertainment.

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(Photo credit: NVIDIA)

According to a report from Liberty Times, Taiwanese foundry UMC stated yesterday that the company’s operations in the second quarter would see a slight increase compared to the first quarter, and the second half of the year would be better than the first half.

With UMC’s technology and processes, the company estimated that it can capture about 10-20% of the AI foundry market share, which is expected to drive future business growth.

• Edge Computing to Become Widespread in 4 Years

At UMC’s shareholder meeting yesterday, Co-General Manager Jason Wang stated that semiconductor applications are becoming increasingly diverse and important. The most promising growth areas include autonomous vehicles, AI servers, and AI PCs.

UMC sees significant growth potential in high-speed transmission and power management. In high-performance computing (HPC), UMC will focus on back-end integration, including interposers and advanced 3D IC packaging.

Jason Wang pointed out that AI is currently in early stages, and thus more focused on building the infrastructure for high-speed computing. However, once the infrastructure is complete, the market will gradually expand to the widespread adoption of edge computing, which he estimates will take about four years.

UMC plans to position itself early, developing technologies that align with customer applications. UMC is optimistic about the market prospects and has high expectations for the future, Wang noted.

UMC’s CFO Chitung Liu stated that while UMC does not have advanced processes for producing HPC chips in the AI field, it has made significant progress in edge computing and related process technologies. With UMC’s technology, processes, and capacity, it is estimated that the company can still capture a 10-20% share of the AI foundry market, which is considerable and will be a major driver of future operational growth.

UMC currently produces CoWoS advanced packaging-related silicon interposers at its Singapore plant, with monthly capacity doubling to 6,000 wafers this year. UMC will continue to invest according to market conditions, according to Liu.

• Effects of U.S.-China Trade War Order Transferring Take At Least Six Month to be Seen

Regarding the benefits of diversification amid the U.S.-China trade war, Liu mentioned that it takes time for customers to redesign and transition orders. It can take at least six to nine months in the short term for the effects to be seen, and up to one to two years in the long term for orders to be successfully transitioned.

Currently, there are no significant effects from diversification in the short term. However, UMC’s production is diversified across regions including Singapore, Japan, China, and Taiwan, with collaborations with Intel in Arizona, USA. Thus, UMC can meet customer needs regardless of where they choose to manufacture, Liu explained.

Liu reiterated the stance from last month’s briefing, stating that the situation in the first half of the year has improved from the economic downturn, and second-quarter revenue is expected to see a slight increase compared to the previous quarter. He hopes for better performance in the second half of the year.

In terms of application markets, the short-term performance of the automotive and industrial sectors appears weak, but growth is expected in the medium to long term. On the other hand, prospects for the communication and consumer sectors in the second half of the year are expected to be better than the first half.

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(Photo credit: UMC)