As per a report from Reuters, US Commerce Secretary Raimondo stated on May 8th that the need for the government to take the threat posed by China-produced connected cars more seriously, suggesting potential “extreme action” to restrict or prohibit the import of such vehicles to prevent the leakage of data belonging to US citizens.

Regarding the national security risk investigation launched by Washington earlier this year into Chinese automobiles, Raimondo expressed concerns that Chinese connected vehicles could collect a vast amount of data about Americans, including who they are, what they say in their car, where they go to, as well as their patterns of driving.

Per Reuters, the US administration initiated a review in February this year on whether the import of Chinese automobiles poses a national security risk. Raimondo stated on May 8th that the Department of Commerce is reviewing the public’s comments on this review submitted before April 30th.

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• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei
• [News] US Considers Sanctioning Huawei-Linked Chinese Chip Network, Huawei-Related Enterprises Blacklisted

(Photo credit: Pixabay)

Microsoft President Brad Smith announced the investment of USD 3.3 billion to construct an artificial intelligence data center in Wisconsin, aiming to make the state a core driver of the innovation economy. Notably, the site of the facility was originally intended for a LCD panel plant promised by Foxconn six years ago.

According to Microsoft’s press release, the AI data center in Wisconsin is expected to create 2,300 union construction opportunities by 2025 and will provide long-term employment opportunities over the next several years.

Microsoft’s press release highlights that this investment will be utilized for constructing cloud computing and artificial intelligence infrastructure, establishing the first AI co-innovation lab in the United States focused on the manufacturing industry, and promoting AI training programs with the goal of enabling over 100,000 Wisconsin residents to acquire necessary AI skills.

The press release also notes that Microsoft will collaborate with Gateway Technical College to establish a Data Center Academy, aiming to train more than 1,000 students within five years, equipping them to enter roles in data centers or information technology departments.

Microsoft’s new facility in Racine County, Wisconsin, was originally intended to be the site of a LCD panel plant planned by Foxconn, a subsidiary of Hon Hai Precision Industry Co., Ltd. (Foxconn Group), according to a report by CNA.

In June 2018, then-chairman of Foxconn, Terry Gou, and then-US President Donald Trump attended the groundbreaking ceremony for the panel plant. Foxocnn announced an investment of USD 10 billion, and Trump described the project as the “8th wonder of the world.”

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• [News] Microsoft Reportedly Stockpiling AI Chips to Boost Hardware Capability
• [News] Breaking Away from NVIDIA Dependency, Microsoft Reportedly Developing In-House AI Server High-Speed Network Card

(Photo credit: iStock)

According to a report from Economic Daily News citing The Wallstreet Journal, Apple is rumored to be developing its own AI chips tailored for data centers, which could potentially give the world’s top smartphone seller a crucial advantage in the AI arms race. The report, quoting sources familiar with the matter, stated that Apple has been working closely with its chip manufacturing partner TSMC to design and produce these chips in the primary stage. However, it is still unclear whether the final version has been produced yet.

It is suggested that Apple’s server chips may focus on executing AI models, particularly in AI inference, rather than AI training, where Nvidia’s chips currently dominate.

Over the past decade, Apple has gradually become a major player in chip design for products like iPhone, iPad, Apple Watch, and Mac. The latest project involving Apple chips for data center servers, internally named “Project ACDC” (short for Apple Chips in Data Center), will integrate Apple’s IC design capabilities into the operation of clients’ servers, sources said.

The project has been in operation for several years, though the timetable for launching this server chip remains unclear. Apple is expected to unveil more new AI products and AI-related updates at its Worldwide Developers Conference (WWDC) in June.

An Apple spokesperson declined to comment on the reported developments.

According to reports from Wccftech on April 23rd, Apple is said to be working on a self-developed AI server processor using TSMC’s 3-nanometer process, with plans for mass production expected in the second half of 2025.

Four major cloud service providers (CSPs) including Google, Microsoft, Amazon, and Meta, sequentially released their first-quarter financial performance for the year 2024 (January 2024 to March 2024) at the end of April.

Each company has achieved double-digit growth of the revenue, with increased capital expenditures continuing to emphasize AI as their main development focus. The market’s current focus remains on whether AI investment projects can successfully translate into revenue from the previous quarter to date.

TrendForce’s Insights:

1. Strong Financial Performance of Top Four CSPs Driven by AI and Cloud Businesses

Alphabet, the parent company of Google, reported stellar financial results for the first quarter of 2024. Bolstered by growth in search engine, YouTube, and cloud services, revenue surpassed USD 80 billion, marking a 57% increase in profit. The company also announced its first-ever dividend payout, further boosting its stock price as all metrics exceeded market expectations, pushing its market capitalization past USD 2 trillion for the first time.For Google, the current development strategy revolves around its in-house LLM Gemini layout, aimed at strengthening its cloud services, search interaction interfaces, and dedicated hardware development.

Microsoft’s financial performance is equally impressive. This quarter, its revenue reached USD 61.9 billion, marking a year-on-year increase of 17%. Among its business segments, the Intelligent Cloud sector saw the highest growth, with a 21% increase in revenue, totaling $26.7 billion. Notably, the Azure division experienced a remarkable 31% growth, with Microsoft attributing 7% of this growth to AI demand.

In other words, the impact of AI on its performance is even more pronounced than in the previous quarter, prompting Microsoft to focus its future strategies more on the anticipated benefits from Copilot, both in software and hardware.

This quarter, Amazon achieved a remarkable revenue milestone, surpassing USD 140 billion, representing a year-on-year increase of 17%, surpassing market expectations. Furthermore, its profit reached USD 10.4 billion, far exceeding the USD 3.2 billion profit recorded in the same period in 2023.

The double-digit growth in advertising business and AWS (Amazon Web Services) drove this performance, with the latter being particularly highlighted for its AI-related opportunities. AWS achieved a record-high operating profit margin of 37.6% this quarter, with annual revenue expected to exceed $100 billion, and short-term plans to invest USD 150 billion in expanding data centers.

On the other hand, Meta reported revenue of USD 36.46 billion this quarter, marking a significant year-on-year growth of 27%, the largest growth rate since 2021. Profit also doubled compared to the same period in 2023, reaching USD 12.37 billion.

Meta’s current strategy focuses on allocating resources to areas such as smart glasses and mixed reality (MR) in the short and medium term. The company continues to leverage AI to enhance the user value of the virtual world.

2. Increased Capital Expenditure to Develop AI is a Common Consensus, Yet Profitability Remains Under Market Scrutiny

Observing the financial reports of major cloud players, the increase in capital expenditure to solidify their commitment to AI development can be seen as a continuation of last quarter’s focus.

In the first quarter of 2024, Microsoft’s capital expenditure surged by nearly 80% compared to the same period in 2023, reaching USD 14 billion. Google expects its quarterly expenditure to remain above USD 12 billion. Similarly, Meta has raised its capital expenditure guidance for 2024 to the range of USD 35 to USD 40 billion.

Amazon, considering its USD 14 billion expenditure in the first quarter as the minimum for the year, anticipates a significant increase in capital expenditure over the next year, exceeding the USD 48.4 billion spent in 2023. However, how these increased investments in AI will translate into profitability remains a subject of market scrutiny.

While the major cloud players remain steadfast in their focus on AI, market expectations may have shifted. For instance, despite impressive financial reports last quarter, both Google and Microsoft saw declines in their stock prices, unlike the significant increases seen this time. This could partly be interpreted as an expectation of short- to medium-term AI investment returns from products and services like Gemini and Copilot.

In contrast, Meta, whose financial performance is similarly impressive to other cloud giants, experienced a post-earnings stock drop of over 15%. This may be attributed partly to its conservative financial outlook and partly to the less-than-ideal investment returns from its focused areas of virtual wearable devices and AI value-added services.

Due to Meta’s relatively limited user base compared to the other three CSPs in terms of commercial end-user applications, its AI development efforts, such as the practical Llama 3 and the value-added Meta AI virtual assistant for its products, have not yielded significant benefits. While Llama 3 is free and open-source, and Meta AI has limited shipment, they evidently do not justify the development costs.

Therefore, Meta still needs to expand its ecosystem to facilitate the promotion of its AI services, aiming to create a business model that can translate technology into tangible revenue streams.

For example, Meta recently opened up the operating system Horizon OS of its VR device Quest to brands like Lenovo and Asus, allowing them to produce their own branded VR/MR devices. The primary goal is to attract developers to enrich the content database and thereby promote industry development.

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• [News] NVIDIA’s H100 Chip Heat Declines, CoWoS Capacity Eases
• [News] Microsoft Reportedly Stockpiling AI Chips to Boost Hardware Capability

The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging.

Southern Taiwan Science Park, Central Taiwan Science Park and Chiayi Science Park are all undergoing expansion. The Chiayi Science Park, approved this year, is set to construct two advanced packaging factories ahead of schedule. Phase one of Chiayi Science Park is scheduled to break ground this quarter, with first tool-in slated for the second half of next year. Phase two of Chiayi Science Park is expected to start construction in the second quarter of next year, with first tool-in planned for the first quarter of 2027, continuing to expand its share in the AI and HPC markets.

Advanced packaging technology achieves performance enhancement by stacking, thus increasing the density of inputs/outputs. TSMC recently unveiled numerous next-generation advanced packaging solutions, involving various new technologies and processes, including CoWoS-R and SoW.

The development of advanced packaging technology holds significant importance for the advancement of the chip industry. TSMC’s innovative solutions bring revolutionary wafer-level performance advantages, meeting the future AI demands of ultra-large-scale data centers.

Industry sources cited by the same report has stated that TSMC’s introduction of system-level wafer technology enables 12-inch wafers to accommodate a large number of chips, providing greater computational power while significantly reducing the space required in data centers.

This advancement also increases the power efficiency. Among these, the first commercially available SoW product utilizes an integrated fan-out (InFO) technology primarily for logic chips. Meanwhile, the stacked chip version employing CoWoS technology is expected to be ready by 2027.

As stacking technology advances, the size of AI chips continues to grow, with a single wafer potentially yielding fewer than ten super chips. Packaging capacity becomes crucial in this scenario. The industry sources cited in Commercial Time’s report also note that TSMC’s Longtan Advanced Packaging plant with a monthly capacity of 20,000 wafers is already at full capacity. The Zhunan AP6 plant is currently the main focus of expansion efforts, with equipment installation expected to ramp up in the fourth quarter at the  Central Taiwan Science Park facility, accelerating capacity preparation.

TSMC’s SoIC has emerged as a leading solution for 3D chip stacking. AMD is the inaugural customer for SoIC, with its MI300 utilizing SoIC paired with CoWoS.

Apple has also officially entered the generative AI battlefield. It’s noted by the sources as per the same report that Apple’s first 3D packaged SoIC product will be its ARM-based CPU for AI servers, codenamed M4 Plus or M4 Ultra, expected to debut as early as the second half of next year. The 3D packaged SoIC technology is projected to be further extended to consumer-grade MacBook M series processors by 2026.

NVIDIA, on the other hand, is reportedly set to launch the R100 in the second half of next year, utilizing chiplet and the CoWoS-L packaging architecture. It’s not until 2026 that they will officially introduce the X100 (tentative name), which adopts a 3D packaging solution incorporating SoIC and CoWoS-L.

As per a recent report from MoneyDJ citing industry sources, the SoIC technology is still in its early stages, with monthly production capacity expected to reach around 2,000 wafers by the end of this year. There are prospects for this capacity to double this year and potentially exceed 10,000 wafers by 2027.

With support from major players like AMD, Apple, and NVIDIA, TSMC’s expansion in SoIC is viewed as confident, securing future orders for high-end chip manufacturing and advanced packaging.

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• [News] TSMC Reportedly Secures 4 Major Clients for SoIC, Including Apple, NVIDIA and Broadcom
• [News] TSMC Reportedly Sensing Increased Orders Again, CoWoS Production Capacity Surges

(Photo credit: TSMC)