In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence ...

According to media reports, in response to the booming demand in the artificial intelligence market, TSMC has altered its Kaohsiung factory plan. Originally scheduled for a 28-nanometer mature process, the factory will now be equipped with a 2-nanometer advanced process, with mass production expecte...

High Bandwidth Memory (HBM) is emerging as the preferred solution for overcoming memory transfer speed restrictions due to the bandwidth limitations of DDR SDRAM in high-speed computation. HBM is recognized for its revolutionary transmission efficiency and plays a pivotal role in allowing core compu...

According to TrendForce, the global quantum computing market was valued at US$470 million in 2021, an increase of 16.7% compared to 2020. This market is mainly led by China and the United States, driving global quantum computing and its technological progress, especially in upper-layer software. In ...