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    Insights

    2023-08-23

    TrendForce Analysis: Minor Changes Expected in iPhone15 PCB, iPhone 16 Mainboard to Adopt RCC Material

    Consumer Electronics

    Apple is expected to unveil the iPhone 15 in September 2023, with minimal changes anticipated in its PCB design. According to research from TrendForce, the iPhone 16, set to launch in 2024, is projected to adopt the use of RCC (Resin Coated Copper) material for its mainboard to reduce the device's t...

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    Insights

    2023-06-15

    Apple Plans to Introduce RCC Materials in 2024, Enabling Space Saving and Increased Battery Capacity in iPhones

    Consumer Electronics

    TrendForce's investigation into the supply chain reveals that Apple plans to upgrade the PCB materials in its new iPhone models in 2024. The current copper-clad laminate (CCL) will be partially replaced with resin-coated copper (RCC), aiming to reduce the size and thickness of the mainboard. This up...

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