Chul Joo Hwang, Chairman of South Korean semiconductor equipment company Jusung Engineering, recently stated that future semiconductors will stack transistors together, as the expansion of DRAM and logic chips has reached its limit. Stacking transistors like NAND is necessary to overcome these challenges.

According to a report from South Korean media outlet The Elec, Hwang believes this means developing more atomic layer deposition (ALD) technology to reduce the use of extreme ultraviolet (EUV) lithography steps in the production process of advanced chips.

ALD technology is a thin film process that allows materials to grow layer by layer, offering high uniformity, precise thickness control, and excellent step coverage, overcoming challenges faced by traditional process technologies.

Reportedly, stacking transistors can reduce the need for further scaling of transistors. As evidence, deep ultraviolet (DUV) equipment is expected to be used in 3D DRAM production.

Hwang believes that as stacking becomes increasingly important, the demand for ALD equipment will also rise. Additionally, the production of III-V semiconductors and IGZO semiconductors requires ALD equipment.

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(Photo credit: Jusung Engineering)