In an interview with Chinese media Sina, Lisa Su, CEO of AMD, emphasized that AI is the most revolutionary technology in the past 50 years. She believes that AI-powered PCs will play a crucial role in driving the growth of the PC market this year.

Su led AMD’s AI PC Innovation Summit in Beijing last week, showcasing the development momentum within China’s AI PC ecosystem. She shared these insights during interviews with Sina, which was then published on March 26th.

Lisa Su asserts that AI is propelling a revolution, marking the most transformative technology in nearly 50 years, swiftly reshaping all facets of the tech industry. From data centers to AI-powered PCs and edge computing, AMD is excited about the opportunities presented by this new era of computing.

Su emphasizes that PCs serve as the daily tools for users to interact with AI through personalized experiences. Leveraging Ryzen AI’s leading edge and extensive ecosystem partnerships, AMD aims to deliver seamless AI experiences from the cloud to the PC.

Lisa Su acknowledges that the global PC market saw a decline post-pandemic, but anticipates some level of growth this year, driven by AI-powered PCs prompting consumers to upgrade their devices.

She believes that while most AI PCs currently target the high-end segment, over time, they are expected to penetrate every price range.

Regarding the applications of AI PCs, Su finds communication, productivity, and creativity particularly exciting. Many applications are still in their early stages, but she expects to see more developments in the coming years.

Lisa Su also mentioned a compelling incentive for people to upgrade to AI PCs: increased efficiency. She posed a question to the media, asking if users would be willing to purchase an AI PC if it could save them 5 hours of work per week. In her view, “everyone’s answer would be YES.”

AMD is strategically positioning itself in the AI market. In December last year, it announced that its accelerated processing unit (APU) MI300A had entered mass production, while the AI accelerator GPU MI300X had begun shipping. Meanwhile, its new Ryzen 8040 series laptop processors have also hit the market, aiming to capture the AI PC market.

To deliver AI experience on PCs, AMD utilizes three computing engines: CPU based on Zen architecture, GPU based on RDNA architecture, and the XDNA-based AI engine, also known as the Neural Processing Unit (NPU). Additionally, its Ryzen 8040 series processors offer leading-edge computing and AI experiences. By the end of this year, the company plans to engage over 150 independent software vendors in developing for Ryzen AI.

TrendForce previously issued an analysis in a press release, indicating that the AI PC market is propelled by two key drivers: Firstly, demand for terminal applications, mainly dominated by Microsoft through its Windows OS and Office suite, is a significant factor. Microsoft is poised to integrate Copilot into the next generation of Windows, making Copilot a fundamental requirement for AI PCs.

Secondly, Intel, as a leading CPU manufacturer, is advocating for AI PCs that combine CPU, GPU, and NPU architectures to enable a variety of terminal AI applications.

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(Photo credit: AMD)

Benefited from frequent orders from its top three clients, Apple, Intel, and AMD, strong momentum has reportedly been driven for TSMC’s 3-nanometer orders, as per a report from Economic Daily News. Anticipated to see sequential growth throughout the year, these orders are expected to remain robust until the end of the year, positioning TSMC as a leader in the semiconductor industry’s recovery.

TSMC has a longstanding policy of not commenting on customer order dynamics. However, it is cited in the report that in the fourth quarter of last year, 3-nanometer orders accounted for approximately 15% of its revenue. With the adoption of 3-nanometer production by major clients this year, revenue from 3-nanometer orders is expected to surpass 20%, becoming the second-largest revenue contributor, following only the 5-nanometer process.

Looking at the orders placed by the top three clients for the 3-nanometer process, Apple is set to introduce the A18 series processor in its iPhone 16 lineup this year. Additionally, the latest self-developed M4 chip for laptops will also be produced by TSMC using the 3-nanometer process, starting in the second quarter.

On the Intel side, the Lunar Lake central processor, graphics processor, and high-speed IO chip are all confirmed to begin mass production at TSMC in the second quarter. This marks Intel’s first instance of outsourcing its entire mainstream consumer platform chip series to TSMC, making it a significant new source of orders for TSMC’s 3-nanometer process this year.

AMD, on the other hand, is poised to unveil its new Zen 5 architecture platform under the code name “Nirvana” this year, expected to significantly enhance AI applications. Following its customary practice, AMD will utilize TSMC’s wafer foundry services, with production set to commence on the 3-nanometer process and an expected launch in the latter half of the year.

TSMC, reportedly, is expanding its production capacity for the 3nm family and advanced packaging this year to meet the large orders from major clients such as Apple, NVIDIA, and AMD in the coming years.

As per TrendForce’s data, the 3nm process alone contributed 6% to TSMC’s Q3 revenue, with advanced processes (≤7nm) accounting for nearly 60% of its total revenue.

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• [News] Apple Reportedly Places Large Orders for TSMC’s 3nm While Simultaneously Securing Significant Advanced Packaging Capacity
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(Photo credit: TSMC)

The US-China tech war continues to escalate, as reported by the Financial Times (FT). Beijing has reportedly instructed official institutions in China to refrain from using PCs and servers equipped with microprocessors from Intel and AMD, as well as to reduce procurement of Microsoft Windows operating systems and database software outside of China.

In response to these reports, both Microsoft and Intel have declined to comment, while AMD, China’s Ministry of Finance, Ministry of Industry and Information Technology, and the China Information Security Evaluation Center have not responded to requests for comment from FT reporters.

FT further reveals that Chinese authorities have requested state-owned enterprises to promote localization internally. Intel and AMD are the two major semiconductor giants in the United States, dominating nearly all global market shares of PC processors.

As both Intel and AMD are significant customers of TSMC’s advanced process nodes, this move is expected to influence TSMC’s future order status. Regarding China’s full-scale development of proprietary computer processors, its potential impact on ASIC-related companies in Taiwan remains to be seen.

As per Industry sources cited by the report, they have suggested that this move by Chinese authorities demonstrates their determination to strengthen local semiconductor autonomy and enhance manufacturing and design capabilities. On the manufacturing side, the focus remains on supporting SMIC, while chip design is primarily led by companies such as Huawei and Phytium.

Per the same report, following the release of new guidelines by China’s Ministry of Finance and Ministry of Industry and Information Technology on December 26th last year, officials have begun adhering to the latest standards for PC, laptop, and server procurement this year. They have mandated that government departments at the township level and above, as well as party organizations, must incorporate standards for purchasing “secure and trustworthy” processors and operating systems.

The China Information Technology Security Evaluation Center has published the first list of “safe and reliable” processors and operating systems, all of which are from Chinese enterprises.

Among the 18 approved processors are chips from Huawei and Phytium. Chinese processor manufacturers are utilizing a hybrid architecture combining Intel x86, Arm, and self-developed designs for chip production, while operating systems are sourced from open-source Linux software.

Prior to the speculated tightening of restrictions by China on the United States, a report from Bloomberg citing sources had already signaled that the US government is considering adding Chinese semiconductor companies linked to Huawei to a blacklist.

Currently, companies that have been listed on the entity list by the US Department of Commerce include Huawei, SMIC (Semiconductor Manufacturing International Corporation), and Shanghai Micro Electronics. Additionally, China’s other major memory manufacturer, Yangtze Memory Technology Corp, was added to this restriction list in 2022.

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(Photo credit: iStock)

As the demand for AI is becoming urgent, according to industry sources cited by the ChinaTimes News, TSMC’s Fab20 P1 plant in Hsinchu’s Baoshan area will undergo equipment installation engineering in April to warm up for mass production of the GAA (gate-all-around) architecture.

Reportedly, it is expected that Baoshan P1, P2, and the three fabs scheduled for advanced process production in Kaohsiung will all commence mass production in 2025, attracting customers such as Apple, NVIDIA, AMD, and Qualcomm to compete for production capacity.

Regarding this rumor, TSMC declined to comment.

Per the industry sources cited by the same report, whether wafer manufacturing is profitable is depending on the yield after mass production. The key lies in the speed at which the yield improves; the longer it takes and the higher the cost, the more challenging it becomes.

As per the same report, TSMC is said to be accelerating its entry into the 2-nanometer realm in April, aiming to shorten the time required for yield improvement in advanced processes. This move not only poses a continuous threat to Samsung and Intel but also widens TSMC’s leading edge.

Industry sources cited by the ChinaTimes’ report have revealed that TSMC has prepared for first tool-in at P1, with trial production expected in the fourth quarter this year and mass production in the second quarter of next year. Equipment manufacturers indicate that they have already deployed personnel and conducted preparatory training in response to TSMC’s customized demands.

As a new milestone in chip manufacturing processes, the 2-nanometer node will provide higher performance and lower power consumption. It adopts Nanosheet technology structure and further develops backside power rail technology. TSMC believes that the 2-nanometer node will enable it to maintain its technological leadership and seize the growth opportunities in AI.

In fact, the cost of producing 2-nanometer chips is exceptionally high. Per the report citing sources, compared to the 3-nanometer node, costs are expected to increase by 50%, with the per-wafer cost reaching USD 30,000. Therefore, the initial adopters are expected to be smartphone chip clients, notably Apple.

Previously, per a report from the media outlet wccftech, Apple’s iPhone, Mac, iPad, and other devices will be the first users of TSMC’s 2nm process. Apple will leverage TSMC’s 2nm process technology to enhance chip performance and reduce power consumption. This advancement is expected to result in longer battery life for future Apple products, such as the iPhone and MacBook.

Unlike with the 3-nanometer node, the complexity of the design means customers must start collaborating with TSMC earlier in the development process. Market speculations suggest that many clients such as MediaTek, Qualcomm, AMD, and NVIDIA have already begun cooperation. TSMC’s earnings call also emphasized that the number of customers for N2 is higher than that for N3 at the same stage of development.

The Fab 20 facility is expected to begin receiving related equipment for 2nm production as early as April, with plans to transition to GAA (Gate-All-Around) technology from FinFET for 2nm mass production by 2025.

The competition in the development of 2-nanometer technology is fierce. ASML plans to produce 10 2-nanometer EUV lithography machines this year, with Intel already reserving 6 of them. Additionally, Japan has mobilized its national efforts to establish Rapidus Semiconductor Manufacturing, which also aims to compete in the 2-nanometer process.

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Following NVIDIA’s GTC 2024, AMD also hosted an AI PC Innovation Summit on March 21st, with CEO Lisa Su leading the top executives in attendance. As per a report from Commercial Times, by collaborating with partners including brands ASUS, MSI, and Acer, AMD has showcased its exciting applications in AI PCs.

AMD highlights that future language models will evolve in two directions: one is the large-scale models introduced by tech giants, which use increasingly more parameters and become more complex in operation, with closed architecture being a major characteristic.

The other direction is small open-source models, which are becoming more widely accepted by the public. These models with fewer parameters can run smoothly on edge devices, especially AI PCs, expecting a significant influx of developers.

Furthermore, the AI compute requirements for large and small language models are entirely different. AMD has different hardware positioning to meet all demands.

Lisa Su emphasizes that artificial intelligence is driving a revolution, reshaping every aspect of the tech industry, from data centers to AI PCs and edge computing. AMD is excited about the opportunities presented by this new era of computing.

TrendForce previously issued an analysis in a press release, indicating that the AI PC market is propelled by two key drivers: Firstly, demand for terminal applications, mainly dominated by Microsoft through its Windows OS and Office suite, is a significant factor. Microsoft is poised to integrate Copilot into the next generation of Windows, making Copilot a fundamental requirement for AI PCs. Secondly, Intel, as a leading CPU manufacturer, is advocating for AI PCs that combine CPU, GPU, and NPU architectures to enable a variety of terminal AI applications.

Introduced around the end of 2023, Qualcomm’s Snapdragon X Elite platform is set to be the first to meet Copilot standards, with shipments expected in the second half of 2024. This platform is anticipated to deliver around 45 TOPS.

Following closely behind, AMD’s Ryzen 8000 series (Strix Point) is also expected to meet these requirements. Intel’s Meteor Lake, launched in December 2023 with a combined CPU+GPU+NPU power of 34 TOPS, falls short of Microsoft’s standards. However, Intel’s upcoming Lunar Lake might surpass the 40 TOPS threshold by the end of the year.

The race among Qualcomm, Intel, and AMD in the AI PC market is set to intensify the competition between the x86 and Arm CPU architectures in the Edge AI market. Qualcomm’s early compliance with Microsoft’s requirements positions it to capture the initial wave of AI PC opportunities, as major PC OEMs like Dell, HPE, Lenovo, ASUS, and Acer develop Qualcomm CPU-equipped models in 2024, presenting a challenge to the x86 camp.

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• [News] AMD Reportedly Faces Obstacles in Selling Custom AI Chips to China
• [News] NVIDIA and AMD Clash in AI Chip Market, as TSMC Dominates Orders with Strong Momentum in Advanced Processes

(Photo credit: AMD)