The demand for TSMC’s CoWoS advanced packaging is skyrocketing. Following NVIDIA’s expansion confirmation in October, there are reports in the industry that major clients like Apple, AMD, Broadcom, Marvell, and others are also placing additional orders with TSMC.

To meet the demands of these five major clients, TSMC is fast-tracking the expansion of CoWoS advanced packaging capacity. Next year, the monthly capacity will increase by about 20% more than the original doubling target, reaching 35,000 wafers, reported by UDN News.

TSMC has not commented on the capacity deployment for CoWoS advanced packaging. Industry sources believe that the substantial orders from TSMC’s major clients indicate a widespread growth in AI applications, driving the demand for chips such as GPU and AI accelerators.

In response to the continuous increase in AI demand, TSMC had previously announced the doubling of CoWoS advanced packaging capacity expansion for next year but did not disclose the monthly production capacity. Industry reports suggest that TSMC’s CoWoS advanced packaging capacity next year will not only double but will also increase by an additional 20% from the original target, resulting in a total monthly capacity of 35,000 wafers.

NVIDIA currently stands as the main large customer for TSMC’s CoWoS advanced packaging, securing almost 60% of TSMC’s related capacity, which is used in its AI chips such as H100 and A100. Additionally, AMD’s latest AI chip products are in the mass production stage, and the upcoming MI300 chip, expected to launch next year, will adopt both SoIC and CoWoS advanced packaging.

At the same time, Xilinx, a subsidiary of AMD, has been a significant customer for TSMC’s CoWoS advanced packaging. With the continuous growth in AI demand, not only Xilinx but also Broadcom has started increasing orders for TSMC’s CoWoS advanced packaging capacity.

(Image: TSMC)

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As Jiwei reported, AMD, although trailing NVIDIA in AI, has recently clinched significant deals, earning the trust of two major clients, Oracle and IBM. Oracle plans to integrate AMD’s Instinct MI300X AI chips into their cloud services, complemented by HPC GPUs. Additionally, as per insights from Ming-Chi Kuo, TF International Securities analyst, IBM is set to leverage AMD’s Xilinx FPGA solutions to handle artificial intelligence workloads.

Oracle’s extensive cloud computing infrastructure faces challenges due to a shortage of NVIDIA GPUs. Nonetheless, Oracle maintains an optimistic outlook. They aim to expand the deployment of the H100 chip by 2024 while considering AMD’s Instinct MI300X as a viable alternative. Oracle has decided to postpone the application of their in-house chips, a project with a multi-year timeline. Instead, they are shifting their focus to AMD’s high-performance AI chip, the MI300X, well-regarded for its impressive capabilities.

Reports indicate that Oracle intends to introduce these processor chips into their infrastructure in early 2024.

Similarly, IBM is exploring chip options beyond NVIDIA. Their new AI inference platform relies on NeuReality’s NR1 chip, manufactured on TSMC’s 7nm process. AMD plays a pivotal role in NeuReality’s AI solution by providing the essential FPGA chips. Foxconn is gearing up for AI server production using this technology in the Q4 2023.

Guo also pointed out that, although Nvidia remains the dominant AI chip manufacturer in 2024, AMD strengthens partnerships with platform service providers/CSPs like Microsoft and Amazon while acquiring companies like Nod.ai. This positions AMD to potentially narrow the AI gap with Nvidia starting in 2025. This collaboration also affirms that AMD remains unaffected by the updated U.S. ban on shipping AI chips to China.

(Image: AMD)

Following the US’s recent expansion of chip control measures targeting China on October 17th, the American chip maker, Advanced Micro Devices (AMD) is reportedly planning workforce reductions of approximately 10% to 15% at its Shanghai research center. Additionally, there are rumors of impending layoffs in the Chinese subsidiary of Synopsys, a leading Electronic Design Automation (EDA) giant from the US.

As reported by the tech media ICsmart, recent leaks on a Chinese social community have hinted at AMD’s workforce cuts in China, which are expected to affect around 10% to 15% of their employees, encompassing roughly 300 to 450 individuals. Notably, the Radeon Technologies Group (RTG) department is anticipated to be significantly affected.

Insiders within AMD revealed that on October 25th, all meeting rooms at the Shanghai research center were pre-booked by the Human Resources department, strongly suggesting that layoffs are on the horizon.

Established in 2006, AMD’s Shanghai research center stands as their largest facility outside of the United States, employing around 3,000 professionals. The center plays a crucial role in designing, developing, and testing products like Central Processing Units (CPUs), Graphics Processing Units (GPUs), and Accelerated Processing Units (APUs). It has been instrumental in introducing innovative products to AMD’s portfolio, such as the Ryzen series processors and Radeon series graphics cards. The RTG department at AMD is responsible for advancing Radeon series graphics card technologies.

AMD’s financial report for the second quarter of this year reveals a total revenue of $5.4 billion, a decline of 18% compared to the previous year. Significantly, the net profit was only $27 million, marking a substantial 94% drop from the same period last year.

China represents AMD’s most substantial overseas market, with sales reaching $5.27 billion in 2022, contributing to 22% of their total revenue.

Reports indicate that the US introduced new bans on Chinese chips on October 7th last year, particularly affecting high-performance chips used for AI computations. On October 17th, the US further tightened these restrictions, leading to the inclusion of more NVIDIA and AMD GPU products, directly impacting AMD’s research and development efforts in mainland China. Given this context, news of AMD layoffs in China doesn’t come as a surprise.

The report also suggests that, while this isn’t something China welcomes, from another perspective, these layoffs might channel more talent towards local GPU manufacturers. Many key figures in Chinese GPU startups have their roots in AMD.

Furthermore, there are rumors that Synopsys recently convened an all-hands meeting, indicating the possibility of impending layoffs.

As a global leader EDA, Synopsys established its presence in China back in 1995 and has since established offices in various cities. The company boasts a workforce of over 1,500 people and has a robust system for technical research and talent development.

The report mentions that the impact of the US restrictions on Synopsys mainly stems from its inability to supply to Chinese chip design companies already included on the US Entity List, such as Huawei’s Hisilicon. While it has negatively impacted its business, the growing trend of Chinese firms pursuing self-developed chip production mitigates the overall impact.

(Image: AMD)

Source to UDN, the DRAM market has been buzzing with positive developments lately, and may get a chance to see an upturn by the end of the year. Among the key factors driving this optimism is the DDR5 specification DRAM, which is poised to capitalize on opportunities in AI servers and laptops next year, gradually increasing demand.

After more than a year of corrections, the DRAM market is finally showing signs of improvement. Major DRAM manufacturers like Samsung and SK Hynix are still reducing production capacity, but their focus is primarily on DDR4 specification DRAM. Industry sources suggest that Samsung, in response to the growing demand for DDR5 DRAM, is set to significantly ramp up DDR5 production in the fourth quarter of this year, anticipating strong order demand next year.

In fact, such as Intel and AMD are planning to introduce new platforms next year that will support DDR5 specification DRAM, indicating a gradual decline in DDR4 demand. Beyond the consumer market, the server market is expected to experience a substantial surge in DDR5 demand, driven by the imminent launch of Intel’s fifth-generation server platform, Emerald Rapids, which fully supports DDR5. As AI server demand gains momentum, DDR5 demand is poised to enter a high-growth phase.

(Source: https://money.udn.com/money/story/5612/7488629 ; Image credit: Micron)

According to Taiwan’s Money DJ, the AI wave is showing no signs of slowing down. Led by NVIDIA, major players including AMD, Intel, and international chip giants are aggressively entering the AI arena, driving increasing demand for advanced packaging and advanced processes. Industry reports suggest that TSMC is reallocating several thousand personnel from its Hsinchu 12B plant to support its Longtan and Tainan 18B facilities in a bid to address the current urgent demands.

TSMC typically follows a process of initial research and development (R&D) stages for advancing its processes before handing them over to the mini-line teams and then proceeding to full-scale production. As a result, the 2nm process is slated for trial production in the second quarter of 2024, leaving a gap of approximately six months. It is rumored that TSMC is mobilizing staff from its Hsinchu 12B plant to provide support for the CoWoS-focused Longtan facility and the Tainan 18B plant, which is responsible for mass-producing the 3nm process, to address the immediate needs.

Equipment suppliers estimate that TSMC’s CoWoS production capacity is set to reach 12,000 to 14,000 wafers per month by the end of this year, with a projected doubling of production by 2024. By the end of that year, it is expected to reach at least 26,000 wafers per month, potentially even surpassing 30,000 wafers. Meanwhile, for the 3nm family, in addition to Apple and MediaTek, AMD, NVIDIA, Qualcomm, and even Intel are confirmed to adopt the N3 family of processes.

(Photo credit: TSMC)