Intel has outsourced the production of its Lunar Lake processors to TSMC. According to a report from Commercial Times, due to recent setbacks in Intel’s wafer foundry business, the company has decided to outsource all sub-3nm process manufacturing to TSMC.

The company is also said to be implementing a global 15% workforce reduction plan in an effort to reverse its decline. However, industry sources also reveal that the layoffs are primarily targeting the foundry business, while Intel’s Taiwan branch remains unaffected to maintain production partnerships with local chip manufacturers.

Intel remains committed to its wafer foundry business, as it reportedly released the 18A process design kit (PDK) to IC manufacturers in July.

However, recent reports indicate that Broadcom has expressed concerns about the feasibility of Intel’s 18A process, concluding that it is not suitable for mass production. A Broadcom spokesperson cited by the report has indicated that it is currently evaluating Intel Foundry Services’ products and services, though no final assessment has been reached yet.

Industry sources cited by Commercial Times further note that Broadcom has been collaborating with TSMC for many years, particularly in advanced processes below 7nm, positioning itself as a key player and securing a spot among TSMC’s top ten customers.

Looking at Intel’s latest quarterly report, its foundry business posted a loss of USD 2.8 billion, with an operating profit margin of -65.5%. The company acknowledged that the ongoing expansion of its Intel 4 and Intel 3 facilities in Ireland, along with increased R&D and startup costs for advancing its technology development, will impact profitability.

This has thus underscored the significant challenges Intel faced in achieving both technological breakthroughs and mass production in the semiconductor industry.

Intel is cutting costs and driving efficiency while actively pursuing transformation. The company aims to save USD 10 billion by 2025, even halted dividend payments—a move not seen in 30 years.

Additionally, its global expansion efforts have slowed. As per a recent report from Malaysian media outlet The Star, citing informed sources, it’s reported that Intel will temporarily halt its new chip packaging and testing project in Penang as part of cost-cutting efforts.

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• [News] Amidst Rumors of Germany Plant Delay, Intel’s Penang Project Also Reportedly on Hold
• [News] Intel’s 18A Reportedly Runs into Trouble with Broadcom, while 20A Plan on Arrow Lake Cancelled

(Photo credit: Intel)

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%.

FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecting it to the packaging substrate, then using spherical solder bumps to attach the package to the substrate.

It is mainly used in the packaging of high-density, high-speed, multi-functional large-scale IC chips, offering advantages such as high integration, small size, high performance, and low power consumption.

After a prolonged period of inventory cutting, the balance between semiconductor supply and demand sides has improved, with market demand gradually recovering.

The strong demand in fields such as high-speed network, server, smart driving, and optical module has continuously energized the development of high-multilayer high-speed boards and advanced HDI boards, which in turn is gradually boosting the prosperity of the packaging substrate industry.

As one of the main packaging methods for core electronic components like PC central processing unit, memory, and graphics processor, FCBGA boasts significant market potential in the development of 5G communications, artificial intelligence, virtual reality, and other fields.

Globally, IDM companies such as Micron, Infineon, and NXP have conducted extensive research and development in the FCBGA packaging field, while specialized packaging and testing companies like ASE Group, JCET, and Amkor have also developed various FCBGA technologies.

It is reported that numerous major international semiconductor companies, including Intel, Qualcomm, NVIDIA, AMD, and Samsung, are utilizing FCBGA technology.

Intel is one of the pioneers of FCBGA technology, first applying it to processors in 1997, while Apple is a loyal adopter of FCBGA technology, having used it in its processors from an early stage.

Data indicates that the global FCBGA packaging technology market will continue to grow rapidly in the coming years, with the market size expected to exceed USD 20 billion by 2026.

In face of such a highly potential opportunities, an increasingly more companies are channeling more efforts in developing FCBGA packaging technology, continuously facilitating its innovation and upgrade, and Chinese companies are also a part of this competition.

Currently, main companies engaging in FCBGA packaging substrates business in China include Fastprint, SCC, and FHEC (Forehope-elec), etc, which have disclosed their current progresses referring to FCBGA research and development.

Besides, Strongteam, a real estate company attempting to enter the semiconductor field, has set its sight on the FCBGA sector.

Fastprint disclosed that its low-layer FCBGA packaging substrates are currently in the small-batch delivery stage, with primary applications in the automotive and AI sectors.

SCC stated that it already has the capability of mass producing FCBGA packaging substrates with 16 layers and less, and the capability of sample manufacturing products with more than 16 layers.

The production line validation, sample delivery, and certification processes for various product levels have proceeded smoothly on track. Strongteam is actively transitioning into the semiconductor field and plans to invest in high-end FCBGA IC substrate enterprises.

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• [News] Samsung Gains Early Market Entry Advantage in the Panel-Level Packaging Sector Ahead of TSMC
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(Photo credit: Samsung)

Reuters previously reported that Intel is considering selling its stake in Altera, a FPGA (Field-Programmable Gate Array) manufacturer, as part of its business restructuring and cost-cutting efforts, as AMD and Marvell are said to be potential buyers.

As per a report from Economic Daily News citing sources, it’s believed that if the sale goes through, a significant portion of Altera’s orders could be redirected to TSMC, which would be highly beneficial for the Taiwanese foundry giant.

The same report indicated that Altera used to be a major customer of TSMC. However, after Intel acquired Altera in 2015, the orders were redirected to Intel. TSMC’s rapid growth, bolstered by orders from clients like Apple, AMD, and NVIDIA, helped mitigate the impact of losing Altera’s business though.

If Altera is no longer part of Intel, as it might be is acquired by companies like AMD or Marvell, which are currently key clients of TSMC, it is likely that Altera’s orders may return to TSMC in significant volumes.

Intel acquired Altera for USD 16.7 billion in 2015, and has previously indicated plans to sell a portion of its stake through an initial public offering (IPO), though no specific date has been set.

Citing sources familiar with the matter, Reuter’s report suggested that Intel’s plan does not currently include splitting up the company or selling its foundry business to buyers like TSMC, Reuters notes.

Intel had already begun segregating its wafer foundry business into an independent division and financials, starting from the first quarter of this year.

Per Reuters, the company has established a wall between its foundry and IC design business to ensure that the design division’s potential customers cannot access the confidential technologies of Intel’s foundry clients.

Read more

• [News] AMD Could Emerge as a Prospective Buyer for Intel’s Potential Sale of Altera
• [News] Intel Reportedly Mulls to Sell FPGA Unit Altera and Freeze USD 32 Billion German Project amid Crisis

(Photo credit: Intel)

AI chip giants NVIDIA and AMD have been under heated competition for a couple of years. NVIDIA, though controls the lion’s share of the market for AI computing solutions, had been challenged by AMD while the latter launched Instinct MI300X GPU in late 2023, claiming the product to be the fastest AI chip in the world, which beats NVIDIA’s H200 GPUs.

However, months after the launch of MI300X, an analysis by Richard’s Research Blog indicates that AMD’s MI300X’s cost is significantly higher than NVIDIA’s H200’s, while H200 outperforms MI300X by over 40% regarding inference production applications, which makes NVIDIA’s high margin justifiable.

AMD’s MI300X: More Transistors, More Memory Capacity, More Advanced Packaging…with a Higher Cost

The analysis further compares the chip specifications between the two best-selling products and explores their margins. NVIDIA’s H200 is implemented using TSMC’s N4 node with 80 billion transistors. On the other hand, AMD’s MI300X is built with 153 billion transistors, featuring TSMC’s 5nm process.

Furthermore, NVIDIA’s H200 features 141GB of HBM3e, while AMD’s MI300X is equipped with 192GB of HBM3. Regarding packaging techniques, while NVIDIA is using TSMC’s CoWoS 2.5D in the H200, AMD’s MI300X has been moved to CoWoS/SoIC 3D with a total of 20 dies/stacks, which significantly increases its complexity.

According to the analysis, under the same process, the number of transistors in the logic compute die and the total die size/total cost are roughly proportional. AMD’s MI300X, equipped with nearly twice the number of transistors compared to NVIDIA’s H200, therefore, is said to cost twice as much of the latter in this respect.

With 36% more memory capacity and much higher packaging complexity, AMD’s MI300X is said to suffer a significantly higher manufacturing cost than NVIDIA’s H200. It is also worth noting that as NVIDIA is currently the dominant HBM user in the market, the company must enjoy the advantage of lower procurement costs, the analysis suggests.

This is the price AMD has to pay for the high specifications of the MI300X, the analysis observes.

NVIDIA’s 80% Margin: High at First Glance, but Actually Justifiable

On the other hand, citing the results of MLPerf tests, the analysis notes that in practical deployment for inference production applications, the H200 outperforms the MI300X by over 40%. This means that if AMD wants to maintain a similar cost/performance ratio (which CSP customers will demand), the MI300X price must be about 30% lower than the H200. The scenario does not take other factors into consideration, including NVIDIA’s familiarity with secondary vendors, the Compute Unified Device Architecture (CUDA), as well as related software.

Therefore, the analysis further suggests that NVIDIA’s 80% gross margin, though might seem to be high at first glance, actually allows room for its competitors to survive. If NVIDIA were to price its products below a 70% margin, its rivals might struggle with negative operating profits.

In addition to achieving better product performance at a lower cost through superior hardware and software technology, NVIDIA excels at non-technical economic factors, including R&D and the scaling of expensive photomasks, which impact operational expenditures (OPEX) and cost distribution as well, while its long-term commitments to its clients, confidence, and time-to-market also play a role, the analysis notes.

Regarding the key takeaways from their latest earnings reports, NVIDIA claims the demand for Hopper remains strong, while Blackwell chips will potentially generate billions of dollars in revenue in the fourth quarter. AMD’s Instinct MI300 series, on the other hand, has emerged as a primary growth driver, as it is expected to generate more than USD 4.5 billion in sales this year.

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• [News] NVIDIA’s Q3 Forecast Fails to Impress, while It Claims Blackwell to Bring Several Billion Dollars Revenue in Q4
• [News] Foxconn Confirms Shipment of NVIDIA’s GB200 to Start in Q4 as Planned

(Photo credit: NVIDIA)

Rumors have been circulating that Intel has been working with investment bankers on options to navigate the company through difficulties, which may include selling off its Field Programmable Gate Array (FPGA) unit Altera and halt its investment project in Germany, according to the report by Reuters.

Regarding the status quo of the FPGA market, a report by TechNews states that its applications have been concentrated in small-scale sectors such as communications, defense, and chip prototyping, with Xilinx and Altera dominating the field. As a result, rumors have emerged that Intel might sell its entire Altera division to another chip company looking to expand its product portfolio.

Notably, per industry sources cited in the report from TechNews, it’s further suggested that AMD could be a potential buyer, as it would help the US chip giant expand its FPGA product lineup, which would be more effectively ingrated with its current porfolio.

Altera generated USD 342 million in revenue in the first quarter of 2024, a significant decrease of 58% compared to USD 816 million in the same period last year.

On the other hand, AMD’s Embedded Solutions Division, which includes products acquired from Xilinx in 2022, reported a 46% year-over-year decline in sales to USD 846 million for the first quarter, falling short of Wall Street expectations. Both companies’ recent financial reports have been underwhelming.

In addition to AMD, Marvell, a company specialized in network IC design, has also been reported as a potential buyer for Altera.

Previously revealed in a report by Bloomberg on August 29 citing sources, Intel is said to be considering several potential strategies, including spinning off its product design and foundry businesses, canceling some of its regional facility construction plans, or pursuing mergers. These options are expected to be discussed at the board meeting scheduled for September.

Read more

• [News] Intel Reportedly Mulls to Sell FPGA Unit Altera and Freeze USD 32 Billion German Project amid Crisis
• [News] Lip-Bu Tan Resigns from Intel Board Amid Reported Disagreements

(Photo credit: AMD)