According to the news from Liberty Times Net, NVIDIA's Q2 financials and Q3 forecasts have astounded the market, driven by substantial growth in their AI-centric data center operations. NVIDIA addresses CoWoS packaging supply issues by collaborating with other suppliers, boosting future capacity, an...

According to a report from Taiwan's Commercial Times, NVIDIA is aggressively establishing a non-TSMC CoWoS supply chain. Sources in the supply chain reveal that UMC is proactively expanding silicon interposer capacity, doubling it in advance, and now planning to further increase production by over t...

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

According to a report by Taiwan's Commercial Times, JPMorgan's latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC's CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected to reach 28,000 to 30,000...

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...