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    2024-07-11

    [News] Foxconn Ventures into Advanced Packaging, Sharp to Follow with Production Capacity in 2026

    Semiconductors

    According to a report from Economic Daily News, Foxconn Group is advancing into the field of advanced packaging with a strategic alliance between Taiwan and Japan, focusing on the trending panel-level fan-out packaging (FOPLP). Following Innolux's related developments in Taiwan, another of Foxconn's...

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