UMC has reportedly received a contract to manufacture crucial chips for Apple’s upcoming iPhone antenna modules. According to a report from Economic Daily News, the production volume is said to be in the tens of thousands.

Regarding this, UMC does not respond to specific customer and market rumors. It is reported that the orders from UMC this time come from Qorvo, a supplier for Apple’s power amplifier (PA).

Qorvo designs new iPhone antenna components for Apple, integrating new chips and supplying them with Qorvo power amplifiers. These new chips adopt UMC’s 3DIC technology and are manufactured by UMC.

Per the report citing industry sources, it has revealed that the chips Qorvo outsourced UMC this time are products of Anokiwave, a wireless communication chip factory that Qorvo recently merged with early this year. They will be integrated into the design of new iPhone antenna modules and are currently gradually increasing in volume.

As smartphones gradually integrate AI functionality, the sources cited in the same report also reveal that Apple is enhancing efficiency by adopting a new design for the next generation iPhone antenna module. They are incorporating products from Anokiwave, which was acquired by Qorvo earlier this year, to enhance iPhone reception capabilities.

With Qorvo leveraging Anokiwave’s products and partnering with UMC for manufacturing, UMC secures critical component chip orders for the iPhone once again. Previously, UMC also manufactured driver IC chips for Apple through NovaTek.

Read more

• [News] UMC Seamlessly Integrates Key 12-Nanometer Technology as Intel Joins Forces
• [News] First Quarter Market Outlook Affected by Off-Season Effects, Three Foundries Discuss Industry Conditions

(Photo credit: Apple)

In the Chinese market, demand for Apple’s iPhone continues to falter, with Bloomberg reporting a significant 33% drop in iPhone shipments in February compared to the same month last year. As per Bloomberg’s report on March 26th, despite China remains Apple’s most crucial overseas market, iPhone demand in China has remained consistently low.

According to official data cited in the report, iPhone shipments in the Chinese market have plummeted by 33% in February compared to the same period last year, marking the second consecutive month of decline. Influenced by the later timing of the Lunar New Year compared to 2023, overseas smartphone shipments in February were said to be only around 2.4 million units, with iPhones accounting for a significant portion.

Apple is reportedly the only overseas manufacturer with a substantial market share in China. Data from the China Academy of Information and Communications Technology (CAICT) shows that iPhone shipments in January were approximately 5.5 million units, marking a significant 39% decline compared to the same month last year.

Still, a report from The Wall Street Journal on March 22 has highlighted that intensified competition with Chinese manufacturers like Huawei has led to tough sales competition for Apple’s iPhone in China.

Thus, the same report from Wall Street Journal indicated that Apple is in talks with Baidu to potentially integrate Baidu’s generative AI services into its own products, including iPhones, for the Chinese market. While the agreement is still in its early stages, incorporating a Chinese version of AI could potentially give Apple a competitive edge in the Chinese market.

Apple is reportedly intensifying its AI efforts, with plans to collaborate with Baidu on the Chinese version of its iPhone 16 series this year, as per a report from Economic Daily News. The devices will feature Baidu’s developed Generative AI technology, thus sparking a new wave of AI server deployment by Baidu.

In China, due to official requirements, providing generative AI services to ordinary consumers requires prior approval and scrutiny from relevant authorities. Only Chinese companies like Baidu and Alibaba have been granted permission. Apple has chosen Baidu as its AI service partner in the Chinese market.

According to the aforementioned reports, Apple and Baidu have entered into negotiations, planning to integrate Baidu’s generative AI services into products such as the iPhone for sale in China. By incorporating a Chinese version of AI, Apple aims to enhance its competitive advantage in the Chinese market.

Inventec, a Taiwanese manufacturer, has had close collaboration with Baidu for 13 years in the field of customized server manufacturing, has jointly developed an AI computing platform. Serving as a key server manufacturing partner for Baidu’s “All in AI” strategy, Inventec plays a major role in Apple’s swift push into the Chinese AI market alongside Baidu.

Inventec has traditionally refrained from commenting on order dynamics and customer relationships, emphasizing instead the robust shipment momentum of AI servers this year. Shipments are expected to more than double compared to last year. With AI server revenue accounting for approximately 5% to 6% last year, it is projected to surpass 10% this year.

Sources cited by the same report from Economic Daily News are optimistic that with Baidu becoming a key partner for Apple in the China’s generative AI landscape, Inventec’s AI server shipment momentum is poised to amplify, benefiting from the opportunities brought by the collaboration between Apple and Baidu.

As per a previous report from TrendForce, Baidu’s foray into AI chips can be traced back to as early as 2011. After seven years of development, Baidu officially unveiled its self-developed AI chip, Kunlun 1, in 2018. Built on a 14nm process and utilizing the self-developed XPU architecture, Kunlun 1 entered mass production in 2020. It is primarily employed in Baidu’s search engine and Xiaodu businesses.

Read more

• [News] Apple Reportedly Places Large Orders for TSMC’s 3nm While Simultaneously Securing Significant Advanced Packaging Capacity
• [News] Boosting Sales? Rare Price Cuts on Apple China’s Official Website

(Photo credit: Apple)

Benefited from frequent orders from its top three clients, Apple, Intel, and AMD, strong momentum has reportedly been driven for TSMC’s 3-nanometer orders, as per a report from Economic Daily News. Anticipated to see sequential growth throughout the year, these orders are expected to remain robust until the end of the year, positioning TSMC as a leader in the semiconductor industry’s recovery.

TSMC has a longstanding policy of not commenting on customer order dynamics. However, it is cited in the report that in the fourth quarter of last year, 3-nanometer orders accounted for approximately 15% of its revenue. With the adoption of 3-nanometer production by major clients this year, revenue from 3-nanometer orders is expected to surpass 20%, becoming the second-largest revenue contributor, following only the 5-nanometer process.

Looking at the orders placed by the top three clients for the 3-nanometer process, Apple is set to introduce the A18 series processor in its iPhone 16 lineup this year. Additionally, the latest self-developed M4 chip for laptops will also be produced by TSMC using the 3-nanometer process, starting in the second quarter.

On the Intel side, the Lunar Lake central processor, graphics processor, and high-speed IO chip are all confirmed to begin mass production at TSMC in the second quarter. This marks Intel’s first instance of outsourcing its entire mainstream consumer platform chip series to TSMC, making it a significant new source of orders for TSMC’s 3-nanometer process this year.

AMD, on the other hand, is poised to unveil its new Zen 5 architecture platform under the code name “Nirvana” this year, expected to significantly enhance AI applications. Following its customary practice, AMD will utilize TSMC’s wafer foundry services, with production set to commence on the 3-nanometer process and an expected launch in the latter half of the year.

TSMC, reportedly, is expanding its production capacity for the 3nm family and advanced packaging this year to meet the large orders from major clients such as Apple, NVIDIA, and AMD in the coming years.

As per TrendForce’s data, the 3nm process alone contributed 6% to TSMC’s Q3 revenue, with advanced processes (≤7nm) accounting for nearly 60% of its total revenue.

Read more

• [News] Apple Reportedly Places Large Orders for TSMC’s 3nm While Simultaneously Securing Significant Advanced Packaging Capacity
• [News] TSMC Reportedly Attracts Influx of 3nm Customers, Predicts Production Capacity Utilization to Surge to 80% by Year-End

(Photo credit: TSMC)

As the demand for AI is becoming urgent, according to industry sources cited by the ChinaTimes News, TSMC’s Fab20 P1 plant in Hsinchu’s Baoshan area will undergo equipment installation engineering in April to warm up for mass production of the GAA (gate-all-around) architecture.

Reportedly, it is expected that Baoshan P1, P2, and the three fabs scheduled for advanced process production in Kaohsiung will all commence mass production in 2025, attracting customers such as Apple, NVIDIA, AMD, and Qualcomm to compete for production capacity.

Regarding this rumor, TSMC declined to comment.

Per the industry sources cited by the same report, whether wafer manufacturing is profitable is depending on the yield after mass production. The key lies in the speed at which the yield improves; the longer it takes and the higher the cost, the more challenging it becomes.

As per the same report, TSMC is said to be accelerating its entry into the 2-nanometer realm in April, aiming to shorten the time required for yield improvement in advanced processes. This move not only poses a continuous threat to Samsung and Intel but also widens TSMC’s leading edge.

Industry sources cited by the ChinaTimes’ report have revealed that TSMC has prepared for first tool-in at P1, with trial production expected in the fourth quarter this year and mass production in the second quarter of next year. Equipment manufacturers indicate that they have already deployed personnel and conducted preparatory training in response to TSMC’s customized demands.

As a new milestone in chip manufacturing processes, the 2-nanometer node will provide higher performance and lower power consumption. It adopts Nanosheet technology structure and further develops backside power rail technology. TSMC believes that the 2-nanometer node will enable it to maintain its technological leadership and seize the growth opportunities in AI.

In fact, the cost of producing 2-nanometer chips is exceptionally high. Per the report citing sources, compared to the 3-nanometer node, costs are expected to increase by 50%, with the per-wafer cost reaching USD 30,000. Therefore, the initial adopters are expected to be smartphone chip clients, notably Apple.

Previously, per a report from the media outlet wccftech, Apple’s iPhone, Mac, iPad, and other devices will be the first users of TSMC’s 2nm process. Apple will leverage TSMC’s 2nm process technology to enhance chip performance and reduce power consumption. This advancement is expected to result in longer battery life for future Apple products, such as the iPhone and MacBook.

Unlike with the 3-nanometer node, the complexity of the design means customers must start collaborating with TSMC earlier in the development process. Market speculations suggest that many clients such as MediaTek, Qualcomm, AMD, and NVIDIA have already begun cooperation. TSMC’s earnings call also emphasized that the number of customers for N2 is higher than that for N3 at the same stage of development.

The Fab 20 facility is expected to begin receiving related equipment for 2nm production as early as April, with plans to transition to GAA (Gate-All-Around) technology from FinFET for 2nm mass production by 2025.

The competition in the development of 2-nanometer technology is fierce. ASML plans to produce 10 2-nanometer EUV lithography machines this year, with Intel already reserving 6 of them. Additionally, Japan has mobilized its national efforts to establish Rapidus Semiconductor Manufacturing, which also aims to compete in the 2-nanometer process.

Read more

• [News] Intensified Competition in the Semiconductor Industry for 2nm Technology Dominance, Potentially Reshaping the Global Foundry Market
• [News] TSMC’s Primary Client for 2nm Chips Expected to be Apple, Set to Debut with iPhone 17 Lineup Next Year