Apple


2023-12-08

[News] Tata Group Plans to Build New iPhone Assembly Plant in India, Aligning with Apple’s Localization Strategy for the Supply Chain

Apple’s iPhone is gaining even more popularity in India, with Tata Group, India’s conglomerate, reportedly preparing to build a new iPhone assembly plant. According to Bloomberg, this move aligns with Apple’s broader manufacturing strategy expansion in India.

Previously reported by TrendForce, Apple’s decision to opt for India is primarily due to the fact that since 2015, India has become the fastest-growing regional market for smartphones globally. Earlier in October this year, Tata Group officially acquired Wistron’s subsidiary in Bengaluru, primarily responsible for assembling orders for the iPhone 14. 

According to sources from Bloomberg, Tata Group is not only recruiting new staff for this facility but also planning to build the largest iPhone assembly plant in the town of Hosur, Tamil Nadu, India.

The new facility is expected to establish 20 assembly lines, planning to employ approximately 50,000 workers within the next 2 years. It is slated to be operational within 12 to 18 months. However, the existing government-supported PLI (Production-Linked Incentive) fiscal incentives will expire around the time of operation. Therefore, Apple and Tata Group may seek new subsidies from the government for the production of the new iPhones.

Apple has been actively expanding in India, and the new iPhone assembly plant is a crucial strategy for both companies. For Apple, it serves to diversify the supply chain risk by gradually shifting the assembly of iPhones from China to India. Meanwhile, Tata Group aims to expand its traditional business scope.

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(Photo credit: Apple)

Please note that this article cites information from Bloomberg and TechNews.

2023-12-08

[News] Bezel-Less iPhone on the Horizon? LG Innotek Rumored to Develop Under-Panel Camera

In the pursuit of a larger screen-to-body ratio, smartphones adopting a “bezel-less” design have become a trend. According to a report from the Korean media outlet “The Elec,” rumors in the market suggest that Apple’s iPhone 17 Pro, expected to be released in 2025, will achieve a “100% bezel-less” look, with supplier LG Innotek reportedly developing an under-display camera. This innovation could potentially become a major selling point for the new iPhone series.

LG Innotek, a major South Korean smartphone camera module manufacturer, is actively working on developing an Under-Panel Camera (UPC) in response to the specific requirements of its important customer, Apple.

The concept involves completely hiding the camera components beneath the screen, eliminating the need for a camera notch. This approach aims to offer a seamless, all-screen experience, and it is anticipated that iPhones featuring under-display cameras could be introduced within the next few years.

However, the report further indicated from its sources that, currently, Apple is more likely to adopt specifications for under-display Face ID rather than UPC.

The reason behind this lies in the fact that under-display cameras come with certain drawbacks. Since the camera is under the display panel, the light transmission of the cover glass can affect the entry of light into the image sensor. Poor resolution and the inability to support high-speed continuous shooting are common fatal flaws associated with under-display cameras.

Nevertheless, according to “The Elec”, in an attempt to overcome these drawbacks, LG Innotek is working on incorporating a free-curve prism under the display for UPC. This hardware enhancement aims to improve the light transmission of the camera under the screen, addressing the issues of low transparency and poor imaging quality.

However, an industry source has pointed out that it is currently uncertain when Apple will actually use the under-display cameras produced by LG Innotek. Reportedly, according to insiders, Apple is not entirely satisfied with the samples provided by LG Innotek.

As early as 2021, Apple’s competitor Samsung had already introduced the Z Fold 3 with an under-display camera design, but the image quality of the camera was significantly inferior to that of traditional punch-hole cameras.

(Photo credit: LG Innotek)

Please note that this article cites information from TheLec and TechNews.

2023-12-07

[News] Can Mini LED Overcome Challenges Post-Apple’s Shift? Explore Its Prospects Beyond Apple’s Favor

LED

In the past few years, the rapid growth of the Mini LED backlight market has been closely tied to the support from consumer electronics giant Apple. Apple pioneered the integration of Mini LED backlight technology into tablet products, sparking increased demand for Mini LED technology in the consumer market. However, it seems that Apple is now steering away from the Mini LED backlight technology path.

Recently, well-known Apple supply chain analyst Ming-Chi Kuo released a 2024 forecast report for the new iPad models. The upcoming iPad Pro is expected to replace the current Mini LED backlight panel with an OLED panel.

Additionally, the 12.9-inch version of the iPad Air model will feature an Oxide backplane, similar to the one used in Mini LED backlight panels, to enhance display performance.

From Apple’s strategic shift in abandoning Mini LED in favor of OLED for iPad Pro, it appears that the primary consideration is cost.

While the manufacturing process for Mini LED has matured in recent years, resulting in continuous cost reductions, the current cost of Mini LED remains higher compared to the more established and mature OLED technology.

In contrast, OLED’s cost performance is noteworthy. According to observations from TrendForce, OLED manufacturers have committed to investing in 8.5th generation OLED for laptops and tablets this year, indicating a potential further decrease in OLED costs.

Furthermore, OLED offers features such as slim design, low power consumption, quick response, high clarity, and flexibility, similar to Mini LED backlight technology.

This not only enhances the display performance of iPad Pro but also optimizes aspects like thickness, weight, and energy consumption, aligning with the characteristics of portable tablet products.

Apple’s Planned Shift from Mini LED to OLED

Looking back at the development of Mini LED in recent years, Apple’s utilization of this technology has not been extensive, and it has typically been reserved for Apple’s most high-end products, such as the 2019 Pro Display XDR. Subsequent releases, including the iPad Pro and MacBook Pro, also adopted the same technology.

While Apple successfully integrated Mini LED backlight technology into the highest-end versions of displays, tablets, and laptops, some releases and production of Apple’s Mini LED backlight products were delayed during this period. This includes rumored products like the iMac Pro featuring Mini LED backlight screens and the second generation of the 27-inch display Apple Studio Display.

While Apple has been incorporating Mini LED backlight technology into high-end products, the company is also exploring the expansion of OLED technology beyond iPhones to include more devices.

Last year, it was reported that BOE is constructing an 8.6th generation OLED display production line to fulfill orders for Apple’s future iPad and MacBook models featuring OLED screens, expected to be operational by the end of 2024.

As for the upcoming iPad Pro tablet set to be launched as early as next year, there are indications that Samsung and LG will provide dual-layer OLED panels. This promises a doubling of screen brightness, an extended lifespan, and lower power consumption compared to Mini LED backlight technology.

Mini LED Backlight Demand Continues to Grow

TrendForce analysis indicates that, influenced by the Apple brand effect, Mini LED backlight has officially entered the application markets of laptops and tablets. However, due to high costs, Apple has notably slowed down the pace of introducing Mini LED backlight to laptops and tablets.

While the change in Apple’s display technology roadmap has had a certain impact on the Mini LED backlight market, especially in tablets and laptops where Apple holds a larger share, TrendForce’s report points out that the applications of Mini LED in TVs, displays, and automotive displays are still on a growth path.

It is worth noting that the main applications in TVs and displays continue to show a growth trend, while future potential applications like automotive displays provide more possibilities for the growth of the Mini LED backlight market.

With ongoing optimization of technology and costs, the overall Mini LED backlight market is expected to maintain a growth trend.

According to data from TrendForce’s report “2024 New Mini LED BLU Display Trend Analysis“, after a brief decline in shipments in 2023, applications with Mini LED backlight technology are expected to return to growth in 2024, with an estimated shipment volume of 13.79 million units.

With the trend of Mini LED terminal products becoming more affordable, the shipment volume is expected to continue growing, reaching an estimated 31.45 million units by 2027, with a CAGR of approximately 23.9% from 2023 to 2027.

(Photo credit: Apple)

2023-12-07

[News] The Alliance among Apple, TSMC, and Amkor May Pose Challenges to Samsung’s Advanced Packaging Strategy

As reported earlier, the global provider of outsourced semiconductor packaging and test services, Amkor, has been set to establish its presence in Arizona, USA, providing advanced packaging services for Apple chips manufactured by TSMC.

According to reports from South Korean media, the alliance formed among Apple, TSMC, and Amkor may pose a significant challenge to the South Korean semiconductor giant, Samsung Electronics, potentially creating competition for contracts and drawing close attention from the industry.

Amkor released a statement on November 30, announcing the establishment of the new facility in Peoria, northwest of Phoenix, Arizona. The construction is expected to commence in the second half of 2024, focusing primarily on advanced packaging requirements for high-end chips related to IoT, automotive electronics, 5G, artificial intelligence (AI), and high-performance computing (HPC). The facility has already secured orders from major players, with Apple being its first and largest customer.

Coincidentally, TSMC is also in the process of constructing an advanced process semiconductor wafer facility in Phoenix. 

TrendForce’s research has indicated that the current maximum capacity plan for TSMC’s Arizona plant is around 50,000, with 20-30,000 allocated for 4nm and 3nm each. It is anticipated that the expansion to this scale will only occur after 2027. This capacity is expected to cater to a limited number of domestic customers in the United States who require fully American-made semiconductor products.

Business Korea’s report also suggests that the alliance formed among Apple, TSMC, and Amkor may impact Samsung. Samsung’s second wafer facility in the U.S., located in Taylor City, Texas, is anticipated to start production in the second half of 2024, setting the stage for potential chip procurement battles with TSMC.

Speculations have arisen about Samsung possibly establishing a testing and packaging facility in Taylor City, following the strategy of strengthening vertical integration to enhance competitiveness and gain an advantage in chip procurement.

In November of this year, Samsung unveiled a new strategy called “GDP,” focusing on Gate-All-Around (GAA) transistor technology, DRAM, and 3.5D advanced packaging. The company has pledged to achieve a goal where more than half of its wafer foundry revenue comes from AI chip orders within five years.

(Photo credit: TSMC)

Please note that this article cites information from Business Korea and TechNews

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2023-12-01

[News] Apple Expands Amkor Partnership at Arizona Fab with Amkor’s $2B Investment in Advanced Packaging

On November 30th, Apple revealed an extension of its partnership with Amkor in the advanced packaging sector within the United States. Apple proudly proclaimed its role as the inaugural and principal client for Amkor’s recently established facility in Peoria, Arizona. In this collaboration, Amkor will handle the packaging of Apple chips manufactured at the nearby TSMC’s wafer fab. Worth noting, Apple is also TSMC’s leading customer at the Arizona fab.

Jeff Williams, Apple’s CEO, emphasized Apple’s unwavering commitment to American manufacturing, stating that they will continue expanding investments in the U.S. Apple silicon’s groundbreaking performance capabilities have enabled users to accomplish unprecedented tasks. The announcement highlights the anticipation of Apple silicon being manufactured and packaged in Arizona.

According to the press release, Apple and Amkor have been collaborating for over a decade, packaging chips extensively used in all Apple products. Concerning the new factory, Amkor will invest approximately $2 billion, and upon completion, it will employ over 2,000 people.

Apple also underscores that the investment in advanced manufacturing is part of the company’s commitment in 2021 to invest USD 430 billion in the U.S. economy over five years. Currently, Apple is working towards achieving this goal through direct spending with American suppliers, data center investments, U.S. capital expenditures, and other domestic expenditures.

On the other hand, Amkor outlined plans to establish a state-of-the-art manufacturing campus featuring an expansive 500,000 square feet of cleanroom space. The primary objective of the initial phase is to initiate production within the next two to three years.

Amkor aims to provide cutting-edge technology catering to high-volume semiconductor advanced packaging and testing, specifically supporting crucial markets such as high-performance computing, automotive, and communications. The newly proposed production facility will be strategically located within a semiconductor hub, surrounded by front-end wafer fabs, IDM, and existing or expanding suppliers in the field, including TSMC, Intel, Applied Materials, ASML, and others.

“Amkor has been a strategic OSAT partner to TSMC for many years,” said Dr. C.C. Wei, CEO of TSMC. “TSMC applauds Amkor for investing in the future of the semiconductor industry with us in Arizona. We share Amkor’s excitement for its significant investment and the value this facility will bring to TSMC, our customers, and the ecosystem.”

Giel Rutten, CEO from Amkor, indicated the incorporation of this new U.S. facility with Amkor’s advanced facilities across Asia and Europe serves to strengthen global extension and fosters both global and regional supply chains. Amkor’s investment is positioned to bolster them in advanced packaging and testing, concurrently reaffirming the commitment to expanding chip manufacturing in the United States.

According from the financial reports, Amkor’s two largest clients are Apple and Qualcomm. Apple accounted for 20.6% and Qualcomm 10.1%. of Amkor’s USD 7.1 billion in revenue last year.
(Image: Amkor)

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