On September 12, 2023, Apple unveiled its iPhone 15 series at its annual fall product launch event. The four models introduced were the iPhone 15, iPhone 15 Plus, iPhone 15 Pro, and iPhone 15 Pro Max.

TrendForce’s Perspective:

• Limited Key Features with a Focus on High-End Models

Upon examining the four new devices released by Apple, it becomes evident that, similar to the iPhone 14 series introduced in 2022, Apple has continued to adopt a “focus on high-end upgrades” strategy. The higher-tier Pro series highlights upgrades such as the inclusion of the new A17 Pro processor (manufactured using TSMC’s 3nm process), a titanium metal casing, and a charging port that supports USB 3.0 with 10Gbps transfer speed. Additionally, the flagship Pro Max model introduces a periscope camera module capable of achieving 5x optical zoom for the first time.

In contrast, the lower-tier iPhone 15 and iPhone 15 Plus show relatively modest upgrades. They feature the previous generation A16 Bionic processor (manufactured using TSMC’s 4nm process), and while their charging ports adhere to USB standards, they only support USB 2.0 transfer speeds. The most notable upgrade for these models is the inclusion of dynamic islands and an upgraded 48MP main camera. This strategy clearly distinguishes Apple’s products across different price ranges, and the “focus on high-end upgrades” approach aims to drive up the average selling price (ASP) and subsequently increase revenue.

• The Chinese Market Remains a Significant Variable

Just two weeks ago, Huawei quietly released 5G smartphones, despite still facing restrictions from the U.S. in chip technology. This resulted in a significant gap between the chip manufacturing process used in Huawei’s new devices (SMIC N+2, roughly equivalent to TSMC’s 7nm process) and the most advanced process technology (TSMC’s 3nm) currently available. Nevertheless, consumer response in China has been positive, and there have been reports of Huawei continually revising its new device shipment figures.

Despite Apple’s supply chain diversifying away from China due to international geopolitical risks, China remains an extremely important market for Apple. Apple previously benefited from Huawei’s withdrawal from the high-end smartphone market in China due to sanctions, capturing a significant portion of Huawei’s market share in the country. Even as the global smartphone market faces challenges, Apple continues to experience growth in China’s high-end market. With the strong resurgence of Huawei as a formidable competitor and reports of China potentially banning government officials from using iPhones and other foreign brands, if confirmed, it is likely to impact iPhone sales. Given the various challenges within the Chinese market, Apple’s ability to maintain strong sales performance will be the biggest variable for the iPhone 15’s success.

(Photo credit: Apple)

TrendForce’s latest insights reveal that by 2023, shipments of foldable smartphones could skyrocket to an impressive 18.3 million units, marking a 43% YoY surge. However, this only captures a slim 1.6% of the year’s total smartphone market. Fast forward to 2024, and we’re looking at another leap—a 38% growth, translating to a hefty 25.2 million units and nudging the market share up to 2.2% Looking at the medium to long term, TrendForce believes the expansion of the foldable smartphone market is inevitable. By 2027, shipments could soar to a whopping 70 million units, seizing around 5% of the global smartphone market.

The driving force behind the foldable market’s expansion? Reduced costs and the expansion strategies of Chinese brands. TrendForce posits that as the cost of components plummets—especially panel and hinge expenses—the stage is set for foldable phone prices to potentially slide below the US$1,000 threshold. This shift would undeniably spur consumer interest and purchase intent.

Branding paints its own picture. This year, Samsung once again led the pack, with projections pointing toward a robust 12.5 million unit shipment. But there’s a twist. Its stronghold, a staggering 82% market share in 2022, slipped to 68%. Why? It’s because of the surging tidal wave of foldables from Chinese contenders. Huawei clinched the runner-up spot, estimated to have dispatched around 2.5 million foldables for a respectable 14% of the market share. Hot on their heels were OPPO and Xiaomi, with market shares of 5% and 4%, respectively. Other brands have each snagged less than 4%.

Pandemic repercussions echo here too. TrendForce sheds light on the fact that Chinese foldable brands, impacted by recent global events, have mostly kept their eyes on home turf, eschewing aggressive overseas expansion. However, if these brands pivot and ramp up their global sales game, they might just turbocharge the foldable market’s growth trajectory.

And then, there’s Apple—the enigmatic juggernaut. To date, Apple’s foray into foldables has been tepid, to say the least. This restraint has undoubtedly doused consumer fervor for foldable. Yet, true to form, Apple’s unwavering obsession with user experience could be the culprit. Persistent challenges with foldable tech—think panel evenness and hinge design—might be holding them back. But here’s the kicker: Achieving perfection with larger foldable panels is somewhat simpler than their smaller counterparts. Could this mean Apple might leapfrog right into medium-sized foldable products—like laptops or tablets? Only time will tell.

For more information on reports and market data from TrendForce’s Department of Display Research, please click here, or email Ms. Grace Li from the Sales Department at graceli@trendforce.com

(Photo credit: Samsung)

Source to ChinaTimes, according to rumors in the mobile industry, due to increasing uncertainties in the mainland Chinese market, Apple plans to make India one of the first launch markets for its iPhone 15 series and aims to produce the iPhone 15 series simultaneously in India and China. By manufacturing and selling locally in India, Apple hopes to reduce the uncertainties in the Chinese market.

Reports from ICsmart suggest that industry rumors indicate that as mainland China continues to increase regulatory measures, Apple is also accelerating its expansion into India to mitigate uncertainties in the Chinese market. Suppliers have revealed that in the past, the production of new iPhones in India lagged behind China by about a year, but last year, the production gap had narrowed to approximately one month. Apple is now even more determined to expedite the production of the iPhone 15 in India this year, with the goal of achieving near-simultaneous production in both China and India or reducing the production gap to within 10 days.

The report points out that before the iPhone 14, Apple only assembled a small portion of its phones in India, with a shipment schedule lagging behind China by 6 to 9 months. However, this gap was significantly reduced last year. By the end of March this year, 7% of Apple’s iPhones were produced in India. Foreign estimates suggest that by around 2025, the proportion of iPhones manufactured in India could reach 25%.

TrendForce believes India will become the second-largest production site for iPhone

According to TrendForce insights, Apple is indeed aiming to produce more iPhones in India. From the iPhone 14 series, The company manufactured iPhones almost simultaneously in India and China, reducing the initial production gap between the two countries.

If we take a look at iPhone assembly capacity, there is still around 5% in India. Although Apple plans to bring not only assembly but also key component vendors from China to India, supply chain partners are showing a passive attitude toward establishing production sites there, considering India’s policies, languages, cultural factors, and vulnerable infrastructures.

Foreign vendors will face the challenges above, however, as for Indian local vendors, challenges are mainly on technical capabilities, Therefore the most effective way to enter Apple’s supply chain is to acquire companies/factories that are already on the certified list. Just like the Tata Group did.

Also, TrendForce indicates, that with Apple’s intention, PLI, and the following incentive policies, we believe India will gradually become the second-largest production site of the iPhone in the future. However foreign vendors should be willing to suffer higher costs or successfully obtain any form of compensation from Apple, otherwise the transition process will continue to be slow.

The Indian “Economic Times” notes that with the release of the iPhone 15 series this week, the Indian market has the opportunity to be among the first countries for sales. Additionally, it is expected that after December, iPhones manufactured in India will be exported to Europe and the United States, signaling Apple’s progress in diversifying its supply chain. Apple is already the largest smartphone exporter in India.

The report indicates that Apple has raised its annual growth target for sales in over 200 premium retail stores in India for the second and third quarters to nearly 100%. Apple CEO Tim Cook also mentioned in the latest earnings conference call that the company broke its revenue record in India, the world’s third-largest smartphone market, and achieved double-digit sales growth.

(Source: https://www.chinatimes.com/realtimenews/20230912005365-260409?chdtv)

With the increasing demand for massive computing in fields such as AI, communication, and autonomous vehicles, the evolution of integrated circuits (ICs) has reached a physical limit under the premise of Moore’s Law. How can this limit be surpassed? The answer lies in the realm of optics. Currently, many domestic and international companies are actively embracing “Silicon Photonics” technology. When electronics meet photons, it not only addresses the signal transmission loss issue but is also considered a key technology that could usher in a new era, potentially revolutionizing the future world.

Integrated circuits (ICs) cram millions of transistors onto a single chip, performing various complex calculations. Silicon Photonics, on the other hand, represents integrated “light” paths, where light-conductive pathways are consolidated. In simple terms, it is a technology that converts “electronic signals” into “optical signals” on a silicon platform, facilitating the transmission of both electrical and optical signals.

As technology rapidly advances and computer processing speeds increase, communication between chips has become a critical factor in computing performance. For instance, when ChatGPT was first launched, there were issues with lag and interruptions during the question and answer process, which were related to data transmission problems. Therefore, as AI technology continues to evolve, maintaining computational speed is a crucial aspect of embracing the AI era.

Silicon Photonics has the potential to enhance the speed of optoelectronic transmission, addressing the signal loss and heat issues associated with copper wiring in current computer components. Consequently, semiconductor giants such as TSMC and Intel have already invested in related research and development efforts. In this context, we interviewed Dr. Fang Yen Hsiang, director of the Opto-Electronics Micro Device & System Application Division and Electronic and Optoelectronic System Research Laboratories at the Industrial Technology Research Institute (ITRI), to gain insights into this critical technology.

What Is the Relationship Between Silicon Photonics and Optical Transceivers?

An optical transceiver module comprises various components, including optical receivers, amplifiers, modulators, and more. In the past, these components were individually scattered on a PCB (printed circuit board). However, to reduce power consumption, increase data transmission speed, and minimize transmission loss and signal delay, these components have been integrated into a single silicon chip. Fang emphasizes that this integration is the core of Silicon Photonics.

Integrated Circuits’ Next Step: The Three Stages of Silicon Photonics

• Silicon Photonics Stage 1: Upgrading from Traditional Pluggable Modules

Silicon Photonics has been quietly developing for over 20 years. The traditional Silicon Photonics pluggable optical transceiver modules look very much like USB interfaces and connect to two optical fibers—one for incoming and one for outgoing light. However, the electrical transmission path in pluggable modules had a long distance before reaching the switch inside the server. This resulted in significant signal loss at high speeds. To minimize this loss, Silicon Photonics components have been moved closer to the server’s switch, shortening the electrical transmission path. Consequently, the original pluggable modules now only contain optical fibers.

This approach aligns with the actively developing “Co-Packaged Optics” (CPO) technology in the industry. The main idea is to assemble electronic integrated circuits (EIC) and photonic integrated circuits (PIC) onto the same substrate, creating a co-packaged board that integrates chips and modules. This co-packaging, known as CPO light engines (depicted in figure “d” below), replaces optical transceivers and brings optical engines closer to CPU/GPU chips (depicted in figure “d” as chips). This reduces transmission paths, minimizes transmission loss, and reduces signal delay.

According to ITRI, this technology reduces costs, increases data transmission by over 8 times, provides more than 30 times the computing power, and saves 50% in power consumption. However, the integration of chipsets is still a work in progress, and refining CPO technology will be the next important step in the development of Silicon Photonics.

• Solving the CPO Bottleneck and Beyond – Silicon Photonics Stage 2: Addressing CPU/GPU Transmission Issues

Currently, Silicon Photonics primarily addresses the signal delay challenges of plug-in modules. As technology progresses, the next stage will involve solving the electrical signal transmission issues between CPUs and GPUs. Academics point out that chip-to-chip communication is primarily based on electrical signals. Therefore, the next step is to enable internal chip-to-chip communication between GPUs and CPUs using optical waveguides, converting all electrical signals into optical signals to accelerate AI computations and address the current computational bottleneck.

• Silicon Photonics Ultimate Stage 3: The Arrival of the All-Optical Network (AON) Era

As technology advances even further, we will usher in the era of the “All-Optical Network” (AON). This means that all chip-to-chip communication will rely on optical signals, including random storage, transmission, switching, and processing, all of which will be transmitted as optical signals. Japan has already been actively implementing Silicon Photonics in preparation for the full transition to all-optical networks in this context.

Where Does Silicon Photonics Currently Face Technological Challenges?

Currently, Silicon Photonics faces several challenges related to component integration. First and foremost is the issue of communication. Dr. Fang Yen Hsiang provides an example: semiconductor manufacturers understand electronic processes, but because the performance of photonic components is sensitive to factors such as temperature and path length, and because linewidth and spacing have a significant impact on optical signal transmission, a communication platform is needed. This platform would provide design specifications, materials, parameters, and other information to facilitate communication between electronic and photonic manufacturers.

Furthermore, Silicon Photonics is currently being applied in niche markets, and various packaging processes and material standards are still being established. Most of the wafer foundries that provide Silicon Photonics chip fabrication belong to the realm of customized services and may not be suitable for use by other customers. The lack of a unified platform could hinder the development of Silicon Photonics technology.

In addition to the lack of a common platform, high manufacturing costs, integrated light sources, component performance, material compatibility, thermal effects, and reliability are also challenges in Silicon Photonics manufacturing processes. With ongoing technological progress and innovation, it is expected that these bottlenecks will be overcome in the coming years to a decade.

This article is from TechNews, a collaborative media partner of TrendForce.

(Photo credit: Google)

According to the news from ChinaTimes, Qualcomm announced on the 11th that it has reached a three-year agreement with Apple to supply 5G communication chips for Apple’s smartphones from 2024 to 2026. This also implies that Apple’s efforts to develop its own 5G modem chips may fall through, and the contract manufacturer TSMC stands to benefit the most.

Qualcomm did not disclose the value of this deal but mentioned that the terms of the agreement are similar to previous ones. Previous supply agreements have been highly profitable for Qualcomm but costly for Apple. According to UBS estimates from last month, Qualcomm’s sales of modem chips to Apple in the previous fiscal year amounted to $7.26 billion, accounting for approximately 16% of the company’s revenue.

This also highlights that Apple’s progress in developing modem chips may not be as expected, leading to a delay in their use in their flagship smartphones. Currently, Apple’s iPhones use 5G modem chips from Qualcomm.

Only a few companies worldwide have the capability to produce communication chips, including Qualcomm, MediaTek, and Samsung. In 2019, Apple acquired Intel’s smartphone modem business for $1 billion, along with 2,200 employees and a series of patents. Intel faced difficulties in developing 5G modem chips, resulting in annual losses of around $1 billion.

The market expects Apple to gradually reduce its reliance on third-party chip suppliers. Qualcomm originally estimated that by 2023, their 5G chips would make up only 20% of iPhones. However, Qualcomm’s CFO stated in November of the previous year that “most” of Apple’s phones in 2023 would contain their chips.

(Source: https://www.chinatimes.com/newspapers/20230912000097-260202?chdtv)