Huawei’s Consumer Business CEO, Richard Yu, has publicly revealed plans for Huawei’s next-generation tri-folding phone for the first time. He stated that this product, widely considered challenging to achieve in the industry, is finally about to be launched after five years of development.

According to a report from the Chinese technology website ” Chinaz,” the tri-folding phone features an innovative inside-out folding mechanism and a dual-hinge design, with the screen size expected to reach approximately 10 inches.

Richard Yu pointed out that this new design will not only revolutionize the way phones are used but also broaden their use cases. When fully unfolded, the phone can rival a tablet, meeting basic office needs such as text and spreadsheet processing.

The latest industry news cited by the report further suggests that Huawei’s tri-folding phone will be unveiled in September, set to compete with Apple’s iPhone 16 series. Although the price of Huawei’s tri-folding phone is expected to be very high, potentially starting at nearly CNY 20,000, significantly surpassing the price of an iPhone, it showcases Huawei’s top-tier domestic technology and innovation in China.

However, despite the relatively noticeable growth in shipment volumes, the base number of foldable phones is very low, and the overall market size remains small.

Compared to the traditional smartphone market, which easily reaches sales volumes of over one billion units, TrendForce previously estimated that the shipments of foldable phones are expected to reach 17.8 million units in 2024, making up only 1.5% of the smartphone market. Despite high repair rates and costs, market penetration is projected to climb to 4.8% by 2028.

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• [News] Apple Reportedly Joins the Foldable Phone Market, Setting Stage for Three-Way Competition
• [News] Huawei Issues Rush Orders for Crucial Components, Focusing on CIS for Foldable Phones

(Photo credit: Huawei)

After Samsung announced a major breakthrough in 2nm, securing the first batch of orders from Japanese AI company Preferred Networks, its rival TSMC is also advancing. According to reports from Wccftech and ET News, TSMC is set to begin trial production of 2nm chips next week, which would reportedly be used in the upcoming iPhone 17 lineup in 2025.

The reports note that the trial production will be conducted in TSMC’s Baoshan Plant in Hsinchu, northern Taiwan, as facilities have been brought in during the second quarter. The iPhone 17 lineup is rumored to be the first to feature TSMC’s 2nm chips. Following that, the chips will likely be used in the 14-inch and 16-inch MacBook Pro models.

According to a previous report by MoneyDJ, TSMC’s 2nm production bases are located in Hsinchu Science Park and Kaohsiung, southern Taiwan, while the mass production is expected to kick off in Hsinchu first, with an initial monthly capacity of approximately 30,000 to 35,000 wafers.

Apple and TSMC share a long history of partnership, as the smartphone giant’s A17 Pro, M3 and M4 chips are all manufactured with TSMC’s 3nm node. As TSMC reportedly plans to enter 2nm trial production next week for Apple’s M5 chip, the company’s target for 2nm to enter mass production in 2025 would be on schedule, Wccftech notes.

According to Wccftech, The M5 chip, compared to its predecessor M4, is expected to have performance increase of 10 to 15 percent and a power consumption reduction of up to 30 percent compared to current 3nm-based chips.

Regarding the progress of other semiconductor heavyweights on 2nm, Samsung is said to commence mass production of 2nm chips for mobile devices by 2025. The initial SF2 2nm process will be ready next year, followed by an enhanced version, SF2P, in 2026. Its latest 2nm process, SF2Z, has incorporated optimized backside power delivery network (BSPDN) technology, and will enter mass production in 2027.

On the other hand, Intel’s 20A manufacturing technology (2nm) is reportedly scheduled for launch in 2024, introducing two technologies: RibbonFET surround gate transistors and BSPDN.

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• [News] The Imminent Arrival of 2-Nanometer Advanced Process
• [News] TSMC Reportedly Invests over USD 12.3 Billion in EUV, Advancing in 2nm Production

(Photo credit: Apple)

Apple is reportedly pushing the boundaries of AI with the upcoming iPhone 16 series, which is expected to have computational power that surpasses industry expectations. According to a report from Economic Daily News, it has suggested that Apple is developing the A18 chip for this year’s iPhone 16 models, with performance potentially exceeding that of Apple’s current most powerful AI chip, the M4. This advancement means the iPhone 16 series will be more capable of running AI models on-device, adapting to various AI tasks.

While these applications are primarily aimed at high-end smartphones, the sources cited by the same report have shown optimism that TSMC and Foxconn, as parts of Apple’s supply chain, are likely to benefit from this development.

The same report further cites the rumor that the A18 chip developed for the iPhone 16 series will feature a highly powerful neural engine, crucial for handling generative AI functions. To keep up with the AI trend, Apple introduced its proprietary AI application, “Apple Intelligence,” in collaboration with OpenAI at this year’s Worldwide Developers Conference (WWDC). This application is designed for high-end models like the iPhone 15 Pro and Pro Max, with hardware capabilities exceeding expectations.

The iPad Pro which unveiled in May is the first to feature the M4 chip. Compared to its predecessor, the M2, the M4 chip boasts up to a 50% increase in CPU speed. Built with TSMC’s second-generation 3-nanometer technology, the M4 chip includes Apple’s fastest neural engine to date, capable of supporting up to 38 trillion operations per second.

If the A18 chip is equipped with an even more powerful neural engine, its computational speed will surpass that of the M4 chip. This means the iPhone 16 series will be able to run AI models locally with greater efficiency. Reportedly, TSMC is the exclusive supplier for the iPhone 16’s processors, therefore expected to be benefited from the strond demand of A18.

On the other hand, Foxconn, historically the largest assembler of iPhones, has recently focused on high-end models. As Apple intensifies AI functionality in new devices, the market anticipates a new wave of device upgrades, enhancing Foxconn’s performance in consumer electronics in the latter half of the year.

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• [News] Apple Unveiled M4 Chip for AI, Heralding a New Era of AI PC
• [News] Battle in AI PCs: Exploring Intel, AMD, and Qualcomm Chips’ AI Computing Power

(Photo credit: Apple)

TSMC’s capital expenditure is set to surge again in 2025 due to strong demand. According to a report from Economic Daily News citing sources, due to continued investment in the most advanced 2nm process and strong demand for 2nm technology, production capacity will be allocated to the Southern Taiwan Science Park. TSMC’s capital expenditure in 2025 is expected to reach between USD 32 billion to USD 36 billion, marking the second-highest in its history, with a year-over-year increase of 12.5% to 14.3%.

Reportedly, the market notes that ASML and Applied Materials will be the main beneficiaries of the increased capital expenditure by the leading manufacturer, and related suppliers are likely to benefit as well. TSMC has declined to comment on market rumors and reiterated that information regarding capital expenditure, and the progress of the 2nm process should be based on the content of the April earnings call next year.

TSMC emphasized at its April earnings call that its capital expenditure and capacity planning are based on long-term structural market demand. Capital expenditure for 2024 is expected to range between USD 28 billion and USD 32 billion. The 2nm process is scheduled to enter mass production as planned in 2025, with the production curve expected to be similar to that of 3nm.

In response to media questions at this year’s shareholder meeting, TSMC Chairman C.C. Wei stated that the previously announced USD 100 billion investment plan over three years was successfully achieved last year. He highlighted that AI presents a bright future for TSMC. He mentioned that capital expenditure and capacity planning are being carefully considered in line with market demand, and whether spending will exceed previous plans remains to be seen.

The sources cited by the same report have further reported that the demand from TSMC’s 2nm customer base has been unexpectedly strong. The related capacity expansion plans are also said to be directed towards the Southern Taiwan Science Park, facilitating process upgrades and creating space for new production.

In the 2nm client landscape, Apple remains a frontrunner, earmarking the technology for flagship smartphones. Intel has also expressed interest, with AMD, NVIDIA, and MediaTek expected to follow suit.

TSMC continues to push forward with its goal of 2nm mass production by 2025. The first fab in Baoshan for 2nm will have equipment installed by April 2024, and the second Baoshan fab will also maintain its schedule. The Kaohsiung fab is planned for 2nm expansion, with the earliest equipment installation expected by the third quarter of 2025. If the STSP also joins in production, mass production could continue to expand from late 2025 into 2026.

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• [News] TSMC Achieved a New Step in the Construction of its Third 2nm Fab
• [News] Apple Not Adopting TSMC 2nm for iPhone 17? A19 Pro Chip Rumored to Use N3P Process

(Photo credit: TSMC)

Due to restrictions on AI products’ usage in China, Apple is actively seeking Chinese partners to advance in the local AI application market. According to the latest report by the Economic Daily News, the tech giant has been engaged with Chinese firms such as Baidu, Alibaba, and Baichuan Intelligence to push AI efforts. While the move helps to boost these firms’ investment in AI server infrastructure, it may further benefit Taiwan’s AI server supply chain.

The report noted that the industry is optimistic about Baidu’s potential cooperation with Apple, while Alibaba is also a strong competitor. Taiwanese contract electronics manufacturer Inventec, a contract manufacturing partner for both Baidu and Alibaba’s servers, thus reportedly positions itself as a major winner in Apple’s bid to capture the Chinese AI application market.

It is worth noting that Inventec has formed strong partnership with Baidu, as the company has been providing customized server manufacturing services for the Chinese search engine leader for 13 years, according to the report. Inventec has been a key partner since the second generation of Baidu’s super AI computing platform, X-MAN 2.0, which addresses cooling challenges with cold plate liquid cooling technology.

Inventec’s clients include the four major North American cloud service providers (CSPs) as well as Chinese CSP giants such as Baidu, Alibaba, Tencent, and ByteDance.

Based on the information disclosed on its official website, Inventec not only builds edge computing products for brand-name server customers, but also focuses on customizing designs to meet cloud clients’ demands for deep learning, training, and machine learning by maximizing the synergies between CPU and GPU.

The pressure Apple has been facing in the Chinese market, on the other hand, is escalating in the AI arena. As China is Apple’s largest market for iPhones outside the United States, in order to bring AI functions into its devices, Apple is still searching for a Chinese AI partner to support its new iPhone launch in a few months.

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• [News] Apple’s AI Push on iPhone 16 in China Faces Obstacles in Finding Local Partners

(Photo credit: Inventec)