ArF lithography machine


2024-09-19

[Insights] China’s MIIT Unveils Latest Domestic DUV Equipment, Faces Challenges for 40nm Processes

On September 9, 2024, China’s Ministry of Industry and Information Technology (MIIT) released the “Guiding Catalog for the Promotion and Application of Major Technical Equipment (2024 Edition),” listing 286 domestically manufactured equipment items. Among these, the KrF and ArF lithography machine, categorized under electronic specialty equipment, have attracted significant market attention.

According to TrendForce’s analysis, the catalog aims to promote the adoption of domestic equipment in key manufacturing sectors. This is achieved through subsidies for domestic equipment to lower the threshold for companies adopting these tools. The catalog will be updated every 2-3 years to align with the latest policy and industry developments.

With the Netherlands expanding its restrictions on ASML’s exposure equipment exports, the disclosure of two domestic lithography machines by China’s Ministry of Industry and Information Technology carries symbolic significance. The KrF Lithography Machine (model 2.1.5) is designed for 12-inch wafers, with a working wavelength of 248nm, resolution ≤ 110nm, and overlay accuracy ≤ 25nm. The ArF Lithography Machine (model 2.1.6) is also for 12-inch wafers, with a working wavelength of 193nm, resolution ≤ 65nm, and overlay accuracy ≤ 8nm. Both machines fall under the category of deep ultraviolet (DUV) lithography equipment.

Despite initial market speculation that the ArF lithography machine might be suitable for 8nm processes, TrendForce’s latest market analysis suggests otherwise. The machine’s overlay accuracy of ≤ 8nm is inadequate for advanced processes, which require ≤ 3nm for 10nm processes and ≤ 2nm for 7nm processes. Additionally, for advanced processes, the resolution must be ≤ 38nm, while this machine’s resolution is ≤ 65nm, making it challenging to handle even 40nm processes.

Although the ArF lithography machine could potentially be used for 55nm or more advanced processes with multiple exposures, its insufficient overlay accuracy would lead to unmanageable yield issues, significantly impacting production efficiency.

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(Photo credit: SMIC)

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