ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...

Recently, Samsung Electro-Mechanics announced that by 2026, the sales share of its high-end Flip Chip Ball Grid Array (FCBGA) substrates for server and artificial intelligence will exceed 50%. FCBGA is an integrated circuit (IC) packaging technology，which involves flipping the chip and connecti...

Per a report by the Vietnam News Agency, Vietnamese Prime Minister Phạm Minh Chính recently signed Government Decree No. 791/QĐ-TTg on the establishment of the National Steering Committee for Semiconductor Industry Development. The main tasks and functions of the steering committee include as...

TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is also entering the FOPLP (Fan-Out Panel-Level Pac...