ASE Group


2024-07-15

[News] TSMC Reportedly Forms a Team on FOPLP Development, with Mini Line on the Road   

With the surge in new applications like AI, advanced packaging remains a hot topic, particularly with FOPLP (Fan-Out Panel Level Packaging) technology gaining renewed attention. According to sources cited by a report from MoneyDJ, leading semiconductor foundry TSMC has officially formed a team, curr...

2024-06-25

[News] Leading IC Packaging and Testing Services Provider ASE Expands Globally Amid AI Demand

On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end testing of advanced packaging processes, and high-performance computing ...

2024-06-21

[News] ASE Sets Up New Facility in Kaohsiung for Advanced Packaging, Targeting Completion in 2026 

According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in Q4 2026, the facility will repor...

2024-04-29

[News] Following TSMC, ASE Reportedly Plans to Establish Plant in Kumamoto

Following TSMC's announcement of investing USD 20 billion to build two plants in Kumamoto, Japan, industry sources cited by a report from Commercial Times has indicated that the major global semiconductor assembly and testing provider, ASE Group, is in discussions with the Japanese government to fin...

2024-03-18

[News] The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?

"It is not the shortage of AI chips, it is the shortage of our CoWoS capacity," replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight. As per a report from TechNews, the hard...

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