The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC's CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In response, NVIDIA has enlisted the help o...

TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain. In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due to the expansion of end-user applications such as PCs and mobile pho...

The highly anticipated 18th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, also known as IMPACT 2023, took place with grandeur from October 25th to 27th at Hall 1 of Taipei Nangang Exhibition Center. This prestigious event was co-organized by leading institution...

According to a report from Taiwan's Commercial Times, industry experts assert that Silicon Photonics (SiPh) is poised to revolutionize the cloud industry as communication transmission speeds surge beyond 1.6 Tbps. Utilizing Co-Packaged Optics (CPO) for integration, SiPh combines optical components a...

The AI landscape witnesses a robust surge with the consecutive launches of AMD's "Instinct MI300" series AI chips and NVIDIA's upcoming "B100" GPU structure. This wave of innovation propels a flourishing demand for AI-related Outsourced Semiconductor Assembly And Test Services (OSAT), surpassing in...