According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in Q4 2026, the facility will repor...

Due to the impact of international situations and uncontrollable factors, the global semiconductor supply chain is undergoing a shift. According to a report from WeChat account DRAMeXchange, the Southeast Asian region, with its advantages in labor and development conditions, has become the preferred...

The surge in demand for advanced packaging is being primarily propelled by artificial intelligence (AI) chips. According to industry sources cited by CNA, TSMC's CoWoS production capacity is set to double this year, yet demand continues to outstrip supply. In response, NVIDIA has enlisted the help o...

TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain. In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due to the expansion of end-user applications such as PCs and mobile pho...

The highly anticipated 18th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, also known as IMPACT 2023, took place with grandeur from October 25th to 27th at Hall 1 of Taipei Nangang Exhibition Center. This prestigious event was co-organized by leading institution...