ASE


2021-07-01

With Advanced Packaging Market Share Now Over 40%, Who Is the Global Leader in Technological Competence and Human Capital?

The rise of such products as automotive, industrial, telecom, and networking chips in recent years has resulted in continued advancements in packaging and testing technologies, and the market revenue of these technologies has seen a corresponding rise as well. Demand for advanced packaging has been ...

2021-06-02

MCO 3.0 Lockdown in Malaysia, Hotspot for Packaging/Testing and Passive Component Manufacturing, Projected to Have No Effect on Semiconductor Companies, Says TrendForce

National governments in Southeast Asian countries, including Thailand, Vietnam, and Malaysia, have been instituting increasingly stringent pandemic control measures in response to the intensifying COVID-19 pandemic in these countries. Remarkably, these countries are all hotspots in the electronic co...

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