Backend Testing and Packaging


2024-07-18

[News] TSMC Introduces “Foundry 2.0” to Include Packaging, Testing, Mask making and Others

In the Q2 earnings call today (July 18th), TSMC Chairman and CEO C.C. Wei introduced the concept of “Foundry 2.0,” redefining the foundry industry to further include sectors like packaging, testing, mask making, and others, the latest report by Technews noted. C.C. Wei pointed out that under ...

2023-08-23

Malaysia: Rising Global Hub for Semiconductor Backend Testing and Packaging in Supply Chain Shift

As reported by TechNews, a media partner of TrendForce, Southeast Asia and India, equipped with the advantages of demographic dividends, strategic geographic positioning, manufacturing capabilities, and rapidly growing economic markets, have undoubtedly emerged as the preferred destinations for the ...

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