As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery Network (BSPDN) the...

As Moore's Law progresses, transistors are becoming smaller and denser, with more layers stacked on top of each other. This may require passing through 10 to 20 layers of stacking to provide power and data signals to the transistors below, leading to increasingly complex networks of interconnects an...