On August 8, 2024, Black Sesame Technologies, a company specializing in AI chip for smart vehicles, was listed on the Hong Kong Stock Exchange.

Founded in 2016, Black Sesame is a provider of automotive-grade intelligent vehicle computing chips and chip-based solutions. The company has established research and sales centers in Wuhan, Silicon Valley, Shanghai, Chengdu, Shenzhen, Chongqing, and Singapore.

Currently, Black Sesame has launched two major product lines: the Huashan series designed for autonomous driving and the Wudang series focused on cross-domain computing.

The SoCs of Huashan A1000 family is designed for autonomous driving and supports BEV fusion algorithms for L3 and below application scenarios.

The Huashan® A1000 automotive-grade high-performance autonomous driving chip applies to L2+ and L3 level autonomous driving, which is currently the most widely used autonomous driving chip in Chinese mass-produced car companies and the only local chip platform capable of backing integrated domain controllers with a single chip.

It’s reported that Huashan A1000 chip has been in full mass production and adopted by several leading Chinese car manufacturers, including FAW Group, Dongfeng Group, Geely Group, and JAC Group, and has been used in mass-produced models including Lynk & Co 08, Hycan V09, Dongfeng eπ007, and its first pure electric SUV Dongfeng eπ008. The next-generation SoC, Huashan A2000, is currently under development and is expected to be launched in 2024.

The Wudang C1200 family of intelligent vehicle cross-domain computing chips was rolled out in April 2023. It has completed full testing after tape-out, with successful functional and performance verification, and sample chips are now available to customers.

As an “All in one” chip, the C1200 family targets multi-domain integration and cross-domain computing, covering core scenarios of intelligent vehicles with a single chip and thus empowering smart vehicles as a whole. Black Sesame expects to generate revenue from C1200 in 2024 and achieve mass production before 2025.

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(Photo credit: Black Sesame Technologies)