Broadcom


2024-12-24

[News] Broadcom Reportedly Focused on AI Development, Has No Plans to Acquire Intel

Broadcom CEO Hock Tan, known as an aggressive dealmaker in the semiconductor industry, told the Financial Times that the company is fully focused on advancing its AI business and has no intention of acquiring Intel. The same report noted that Tan explained Broadcom's AI semiconductor operations a...

2024-12-20

[News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025

While making strides in the HBM capacity expansion at its Cheongju M15X fab, SK hynix may have locked in another major client in addition to NVIDIA. According to South Korean media outlet The Elec, the memory giant has reportedly landed a substantial order to provide HBM to Broadcom. Sources cite...

2024-12-13

[News] Advanced Semiconductor Packaging Technologies Emerging

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

2024-12-12

[News] Apple Reportedly Teams Up with Broadcom to Develop AI Chip Using TSMC’s N3P Process

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC's N3P p...

2024-11-22

[Insights] Broadcom Unveils New PON Solutions, Accelerating Edge AI and ML Applications

In October 2024, chipmaker Broadcom introduced two PON power management chips, the BCM68660 and BCM55050. Both processors incorporate AI capabilities, aimed at simplifying maintenance tasks. These chips are manufactured using a 7nm process and include a Neural Processing Unit (NPU) optimized for...

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