According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Ecosystem Forum, TSMC announced that it is on track to begin mass production of the first chips using its A16 (1.6nm-class) process technology by the end of 2026. The report notes that the...

Earlier in June, Samsung updated its roadmap in the Angstrom era, stating that its 2nm node optimized with backside power delivery network (BSPDN), referred to as SF2Z, will enter mass production in 2027. Now, according to the latest report by the Korea Economic Daily, compared with the traditional ...

As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

As per a report from Taiwan's TechNews," TSMC, Samsung, and Intel have been actively deploying Backside Power Delivery Network (BSPDN) strategies recently, and have announced plans to incorporate BSPDN into their logic chip development roadmap. For instance, Samsung intends to implement BSPDN techno...