In pursuit of big chip technology, a team from the Chinese Academy of Sciences has designed an advanced 256-core processor system based on 16 chiplets and aims to expand this design to a 1,600-core big chip.

With each new generation of chips, increasing transistor density becomes progressively challenging. Chip manufacturers are exploring various methods to enhance processor performance, including architectural innovations, larger die sizes, multi-chiplet designs, and wafer-scale chips.

In a recent research paper, the Institute of Computing Technology at the Chinese Academy of Sciences has introduced a 256-core multi-chiplet design and further explored wafer-scale methods, constructing a big chip using an entire wafer.

The team presented an advanced 256-CPU multi-chiplet, referred to as the Zhejiang Big Chip, in the paper. This design is composed of 16 chiplets, each housing 16 CPUs based on the RISC-V architecture.

These chiplets are interconnected in a traditional symmetric multiprocessor (SMP) manner through a network-on-chip, so the chiplets could share memory.

Researchers from the Chinese Academy of Sciences stated that this design allows for scalability up to 100 chiplets (or 1,600-core).

Reports indicate that the chiplets are manufactured by Semiconductor Manufacturing International Corporation (SMIC) using 22-nm process technology. However, the power consumption of a 1,600-core component interconnected by an interposer and manufactured using a 22-nm process is not specified.

Researchers have noted that the multi-chiplet design can be applied to supercomputer processors. Within each chiplet, multiple cores are interconnected with ultra-low latency. Additionally, advanced packaging technology benefits the communication between chiplets, minimizing delays and NUMA (Non-Uniform Memory Access) effects in highly scalable systems to the greatest extent possible.

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(Photo credit: SMIC)

Dutch semiconductor equipment leader ASML Holding N.V. has announced that export licenses for certain equipment have been partially revoked by the Dutch government.

In a press release issued on January 1st, 2024, ASML stated, “A license for the shipment of NXT:2050i and NXT:2100i lithography systems in 2023 has recently been partially revoked by the Dutch government, impacting a small number of customers in China. We do not expect the current revocation of our export license or the latest U.S. export control restrictions to have a material impact on our financial outlook for 2023.”

The press release further stated, “In recent discussions with the US government, ASML has obtained further clarification of the scope and impact of the US export control regulations. The latest US export rules (published October 17, 2023) impose restrictions on certain mid critical DUV immersion lithography systems for a limited number of advanced production facilities.”

Bloomberg reported earlier on January 1^st, 2024, citing unnamed sources, that several weeks before the implementation of export controls on advanced semiconductor equipment in the Netherlands, the U.S. government had requested ASML to cancel the export of certain machines destined for China.

Previously, ASML’s CEO, Peter Wennink, stated that these limitations would exclude the vast majority of Chinese customers in response to the U.S. restrictions. This exclusion is due to the fact that these customers are involved in mature nodes, specifically in the production of semiconductors at 28nm and above.

In addition, last week, the South China Morning Post has cited data, indicating that in November 2023, China had imported critical semiconductor manufacturing lithography equipment from the Netherlands, experiencing a significant surge of 1050% in import value.

In an interview with the South China Morning Post, Jan-Peter Kleinhans, Senior Researcher and Head of Technology and Geopolitics Projects at the Berlin-based think tank “Stiftung Neue Verantwortung” (New Responsibility Foundation), mentioned that the impact on sales would not be immediate following the new U.S. restrictions.

Reportedly, this is because ASML has a lead time of approximately 18 months. This implies that the equipment shipped in the fourth quarter of 2023 would have been ordered in the second or third quarter of 2022, and ASML would apply for export licenses at some point thereafter.

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(Photo credit: ASML)

In 2019, the U.S. Commerce Department blacklisted Huawei and over 70 of its subsidiaries, restricting China’s advancement in advanced chip development.

However, in August 2023, Huawei unexpectedly launched its new flagship smartphone, the Mate 60 Pro, featuring its self-developed 5G chip, hinting at Huawei’s breakthrough in the U.S. 5G chip restriction.

The release of this new smartphone swiftly dominated the high-end smartphone market in China, with Apple being the primary target. As Huawei plans to expand the market share of its high-end flagship series in 2024, targeting the domestic market in China, the product is poised for direct competition with Apple.

The performance of Apple’s smartphones in the Chinese market next year will be a focal point of industry attention.

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In November 2023, China witnessed a remarkable 1050% surge in the import value of crucial chip manufacturing lithography equipment from the Netherlands, the primary exporter of photolithography equipment, according to the South China Morning Post.

This surge, measured in terms of value, indicates that Chinese semiconductor companies have managed to maintain a channel for ordering advanced equipment despite the tightened export restrictions imposed by the United States

Lithography equipment holds a paramount position among the ten types of equipment essential in the manufacturing process of integrated circuits (ICs).

Reportedly, despite substantial financial investments, China has been acknowledged to lag behind in this technology for many years. Despite allocating significant funds, the country has still struggled to narrow the gap with leading enterprises in this crucial aspect of IC manufacturing.

Meanwhile, in October, the U.S. Department of Commerce expanded its export control regulations on China, with the new provisions taking effect from November 2023.

These regulations specifically restrict the Dutch company ASML from selling certain immersion Deep Ultraviolet (DUV) lithography equipment to Chinese facilities engaged in advanced semiconductor manufacturing. Consequently, China’s import of equipment has seen a consecutive surge for nearly two months.

In November, China imported 16 lithography equipment units from the Netherlands, valued at USD 762.7 Million, marking a tenfold year-on-year increase. By comparison, in October, China imported 21 lithography equipment units valued at USD 672.5 million, with an average price difference of 46% per unit.

In November of this year, China imported a total of 42 lithography equipment, valued at USD 816.8 million, including 15 units from Japan. When combined, the imports from the Netherlands and Japan accounted for almost the entire amount spent by China on lithography equipment in November.

In response to the U.S. restrictions, ASML’s CEO, Peter Wennink, previously stated that these limitations would exclude the vast majority of Chinese customers. This exclusion is due to the fact that these customers are involved in mature or traditional semiconductor manufacturing, specifically in the production of semiconductors at 28nm and above.

Jan-Peter Kleinhans, Senior Researcher and Head of Technology and Geopolitics Projects at the Berlin-based think tank “Stiftung Neue Verantwortung” (New Responsibility Foundation), mentioned that the impact on sales would not be immediate following the new U.S. restrictions.

As per the report from South China Morning Post, this is because ASML has a lead time of approximately 18 months. This implies that the equipment shipped in the fourth quarter of 2023 would have been ordered in the second or third quarter of 2022, and ASML would apply for export licenses at some point thereafter.

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(Photo credit: ASML)

As one of the key cases in the US-China tech war, American memory giant Micron Technology had mend relations with China. Recently, Micron said a global settlement agreement with state-backed competitor Fujian Jinhua Integrated Circuit (JHICC) concerning intellectual property theft lawsuits.

According to Bloomberg’s report, on December 24th, Micron has indicated that it has reached a global settlement agreement with Fujian Jinhua Integrated Circuit. A Micron spokesperson stated in an email, “The two companies will each globally dismiss their complaints against the other party and end all lawsuits between them.” However, no further information or details were provided.

In March of this year, the Cyberspace Administration of China conducted a cybersecurity review of Micron products, and in May, it cited cybersecurity concerns as the reason for prohibiting Chinese operators of “critical infrastructure” from using Micron’s chips.

Micron stated that the Chinese restrictions have affected approximately half of its sales related to Chinese customers. Accordingly, Micron derives about a quarter of its global revenue from China and Hong Kong.

Reportedly, industry insiders believe that following the settlement between the two parties, it is not anticipated to have a significant impact on the upward trend of memory prices.

Appeared to have attempted to pacify Beijing, Micron announced in June an increased investment in China, planning to invest over CNY 4.3 billion in the next few years in its packaging and testing facility located in Xi’an, China.

Micron has decided to acquire the packaging equipment of Powertech Semiconductor (Xi’an), planning to construct new facilities at the Micron Xi’an plant and introduce state-of-the-art and high-performance packaging and testing equipment.

In 2017, Micron filed a lawsuit in the United States against Fujian Jinhua and its Taiwanese partner United Microelectronics Corporation (UMC), accusing these two companies of stealing trade secrets related to Micron’s memory.

A year later, as the U.S. Department of Justice intensified actions against China in economic espionage cases, Fujian Jinhua and UMC were charged with conspiring to steal Micron’s trade secrets. The Trump administration at the time placed Fujian Jinhua on the so-called Entity List, prohibiting U.S. component sales to this Chinese DRAM maker.

In 2021, UMC and Micron announced a settlement. UMC admitted guilt in an agreement with U.S. prosecutors, and the prosecution agreed to drop the charges of economic espionage and conspiracy.

Nevertheless, the case against Fujian Jinhua by the US Department of Justice remains pending.

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(Photo credit: Micron)