As of February 8, 2022, it has been 3 months since Russia began amassing troops on its border with Ukraine and tensions have yet to ease. Since Ukraine is a major producer of gases required for semiconductor manufacturing, once the two sides go to war, some gases may be in short supply.

Ukraine primarily produces neon, krypton, and xenon, which are key materials for exposure and etching processes

According to TrendForce research, Ukraine supplies approximately 70% of the world’s neon gas. In the semiconductor manufacturing process, neon gas can be used in KrF lasers utilized during exposure. In addition to neon gas, Ukraine also supplies approximately 40% of the world’s krypton gas. Krypton gas is also used in KrF lasers and both neon and krypton gas are closely tied to the exposure process. Furthermore, Ukraine produces xenon which can be used in semiconductor etching processes, accounting for approximately 30% of the world’s supply. Since Ukraine is a major supplier in the neon, krypton, and xenon markets, if a war breaks out, shortages of neon, krypton, and xenon are likely to follow. Even if the market is quick to find new gas suppliers or expand gas production capacity, product certification will take several months or even more than half a year, plunging the supply of electronic gas required for semiconductor manufacturing processes into scarcity.

A shortage of neon and krypton due to the war will affect the shipment of mature process products

TrendForce indicates, the large supply of neon and krypton in Ukraine is primarily used in KrF lasers and KrF lasers are utilized in mature 8-inch wafer 250-130nm nodes. At present, products manufactured at the 250-130nm nodes include power management chips (PMIC), micro-electromechanical systems (MEMS), and power semiconductor components such as MOSFET components and IGBTs. Once Ukraine and Russia go to war and the war expands into a stalemate, the shortage of neon and krypton will affect shipments of the aforementioned products to varying degrees. From the perspective of end-user products, the automotive industry, which requires large quantities of power management chips and power semiconductors, will face a new wave of material shortages.

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Undaunted by deadlocked US-Sino relations, the great pandemic of 2020, and the US Department of Commerce’s ban on Huawei’s use of software and equipment produced by US manufacturers in the same year, China’s packaging and testing industry has, instead, used these factors as stimulus get back on track. Faced with these three major challenges, the Chinese government has responded with policies such as domestically producing both equipment and semiconductors, allowing China’s packaging and testing industry to buck the trends set in 2020. According to TrendForce statistics, industry revenue in 2020 reached US$7.02 billion and approximately US$9.53 billion in 2021.

A brief summary of China’s packaging and testing industry in recent years is as follows: the US-Sino trade war has been raging since 2018 and, due to tariff issues and the gradual rise in personnel salaries, terminal manufacturers whom had already established plants or subsidiaries in China were forced to gradually relocate relevant factories to SE Asia and India in order to avoid growing overhead costs, moreover impacting the revenue performance of China’s packaging and testing industry. As of June 2019, the tariff issue remained unresolved due to dubious US.-Sino relations but this issue could no longer impede the revenue recovery momentum of China’s packaging and testing industry.

Packaging and testing and localized equipment skirts bans and a moderate threshold for technology research and development attracts overseas manufacturers

After the U.S. Department of Commerce imposed export control bans on Huawei, HiSilicon, and SMIC, the market mostly predicted that China’s packaging and testing industry would be hit next but this did not happen. According to TrendForce, the primary reason for this is that the nature of current back-end packaging and testing technology is relatively crude compared to front-end wafer manufacturing and, considering Chinese government’s recent policy of localizing equipment and the degree of substitutability of non-US equipment manufacturers, even if the U.S. Department of Commerce proposes further bans against the industry, its effects will be limited.

In response to the US-Sino trade conflict, the Chinese government has proposed relevant measures such as semiconductor autonomy which has driven a gradual mainstreaming of domestic equipment production plans. In addition, national funds have been continuously injected into semiconductor equipment manufacturers, even though the level of technological development at this stage remains inferior to major manufacturers in Europe, the United States, and Japan. However, for those with modest requirements for back-end process conditions, testing, and testing equipment, China’s domestic packaging and testing equipment does have a certain proportion and scale.

For example, relevant companies such as Hangzhou Changchuan and Shanghai Raintree have invested in the automatic optical inspection instruments (AOI) and testing equipment that are required in the latter stage of packaging and testing. On the other hand, due to the relatively low threshold for research and development of back-end packaging and testing equipment, many international companies such as Japan’s Advantest and Singapore’s Besi have also set up shops in China. Chinese packaging and testing and their equipment manufacturers are essentially unaffected by relevant export bans, so the industry can still anticipate technological and revenue performance in the next few years.

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The allocation of Murata’s primary production hubs and production capacity is as follows: 56% in Japan, 36% in China, 3% in Singapore, and 5% in the Philippines, according to TrendForce’s investigations. Recently, a cluster of employees at Murata’s Fukui Takefu Plant tested positive for the COVID-19 virus. Since production diversion management had been strengthened and anti-pandemic measures implemented in advance, only some categories of production capacity have been reduced or suspended and this incident has not halted production for the entire factory. According to TrendForce, the Fukui Takefu Plant accounts for 20.7% of the company’s production capacity, mainly producing high-end consumer MLCCs. The current production reduction or suspension of some items will affect the supply of products such as servers and high-end smartphones. Fortunately, Fukui Takefu still retains 4~ 6 weeks of inventory and this incident should not tighten market supply in the short term.

Decentralized production hubs and off-site backups are major issues for MLCC suppliers after the pandemic

In addition, according to data released by the National Health Commission of the People’s Republic of China on January 17, the cumulative number of COVID-19 cases as of January 16 reached 163, including 80 in Tianjin and 9 in Guangdong, distributed among the production center of suppliers such as SEMCO, TAIYO, WALSIN, FENGHUA, and VIIYONG. The current situation will once again test the operation and risk management of MLCC suppliers as they disperse production hubs and back each other in terms of production capacity.  These plans have become an important 2-3 year strategy for MLCC suppliers.

It is worth noting that the recent pandemic outbreak in Tianjin, China is intensifying. Samsung, which is located in the Tianjin Economic-Technological Development Area, is currently operating normally. However, as the Winter Olympics opening ceremony draws near, China has stepped up its zero-COVID policy. In order to avoid a situation in which employees are unable to return to the factory due to a positive COVID test in the area where they reside, some production line employees have been temporarily living in the factory. Korean executives are also living in the factory to enhance response times to rapidly developing circumstances. In addition, the Philippines, one of the major production centers of MLCC in Southeast Asia, has also experienced a sharp increase in the number of confirmed COVID-19 cases since January this year. Murata and Samsung, who currently have factories in the region, have not reported the impact of the local pandemic and TrendForce will continue to monitor these two industry players moving forward.

Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce’s investigations. Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues. In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated. Circumstances as a whole will continue affecting shipments of related whole devices. Only the PC category is expected to emerge largely unscathed in 1Q22.

Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market’s supply situation is expected to be approximately the same as in 4Q21. However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking.

In terms of the whole servers, the FPGA delivery cycle is currently at over 50 weeks at most, while the delivery cycle of Lan chips has improved significantly, from the original 50+ weeks to approximately 40 weeks. However, escalating purchase order activity caused by the uncertainty of the pandemic combined with an accumulated backlog of demand (Back order/backlog) have pushed the SMT capacity of ODMs to full load in general. The aforementioned phenomenon have not only accelerated the consumption of ICs such as FPGA and PMIC, but the demand for additional purchase orders of FPGA, PMIC and MOSFET is still compelling. The overall market remains tight and the production of server motherboards in the future may face hidden issues. TrendForce has ascertained a more crucial matter. Taking the L6 server as an example, its production scale in 1Q22 will be roughly the same as the previous quarter. However, whole server shipments will show a seasonal decline with a decrease of approximately 8% QoQ.

In terms of mobile phones, material shortages have gradually eased from the second half of 2021 partly due to the discretionary adjustment of mobile phone specifications. Mobile phone brands can adjust their specifications and configurations based on available materials. Currently, the supply of four components remains relatively tight. Among them, 4G SoC (30-40 weeks) and OLED DDIC/Touch IC (20-22 weeks) have a significant impact on the market. The former will affect brands that focus on selling 4G mobile phones. The latter is affected by oligopolistic market structure and the adjustment of foundry capacity. Thus, there are rumblings of insufficient supply. Though the supply of the remaining two items, PMIC and A+G Sensor, remains tight, material shortage risk can be largely mitigated through alternative material replacements or the adjustment of specifications and configurations. In terms of production, the 1Q22 supply chain will essentially carry on its performance from the previous quarter. However, due to disappointing holiday demand at the end of 2021, mobile phone brands must adjust the distributed inventory level of finished products in a timely manner. Combined with uncertainty caused by disruptions stemming from a winter-time pandemic, 1Q22 production performance is estimated to fall by approximately 13% QoQ.

In terms of PCs and laptops, starting from November 2021, material shortages have been partially alleviated. Therefore, the shipment volume of PC ODMs in 4Q21 has been revised upwards. Compared with mobile phones and whole servers, the impact of under/oversupply of materials on end PCs and notebooks is relatively minor. Except for the SSD PCIe 3.0 controller, current tightness exhibited in component supply is due to delays in the transition of Intel’s new platform. This temporary shortfall has led to a delivery cycle of approximately 8-12 weeks while any tightness in the supply of Type C IC, WiFi, and PMIC is gradually abating. TrendForce expects that, as overall supply chain stability recuperates, notebook shipments from ODM brands in 1Q22 will only decrease by 5.1% QoQ. However, if the component shortage factor is discounted, subsequent sales originating from various distribution channels will be another major variable TrendForce must consider.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com

A fire occurred at ASML’s factory in Berlin, Germany on January 3, according to TrendForce’s investigations. ASML is the largest supplier of key equipment (including EUV and DUV) required for foundry and memory production. According to TrendForce’s preliminary inquiry, approximately 200m2 out of a factory floor covering 32,000m2 was affected by the fire. This factory primarily manufactures optical components used in lithography systems such as wafer tables, reticle chucks, and mirror blocks. Reticle chucks used for affixing photomasks are in short supply. Currently, the majority of components produced at this factory go towards supplying EUV machines while the lion’s share of demand for these products come from foundries. If the fire delays component delivery, it cannot be ruled out that ASML will prioritize the allocation of output towards fulfilling foundry orders.

Lead time for this exclusive supply of key EUV machines has been long and may affect the timeframe of advanced manufacturing process transition  

In terms of foundries, EUV is primarily used in advanced manufacturing processes smaller than the 7nm node. Currently, the only companies in the world using this equipment for manufacturing are TSMC and Samsung including TSMC’s 7nm, 5nm, 3nm nodes, Samsung’s EUV Line (7nm, 5nm and 4nm) built in Hwaseong, South Korea, and 3nm GAA node. However, due to factors such as the shortage of global foundry production capacity and the active expansion of manufacturing, semiconductor equipment lead times are also stretching further into the future.

In terms of DRAM, Samsung and SK Hynix are already using EUV in their 1Znm and 1alpha nm processes, while US manufacturer Micron is expected to introduce EUV to their 1gamma nm process in 2024. According to TrendForce’s current information, the lead time on ASML EUV equipment is approximately 12 to 18 months. Due to this long equipment lead time, ASML is at liberty to wait for the completion of replace components for those lost in the fire during the time necessary for equipment assembly.

Overall, the ASML Berlin factory fire will have a greater impact on the manufacturing of EUV lithography equipment when it comes to foundries and memory. According to TrendForce’s information, it cannot be ruled out that ASML will obtain necessary components from other factory campuses. In addition, the current lead time for EUV equipment is quite long. Therefore, the actual impact on EUV supply remains to be seen.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com