As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix int...

Driven by the AI chip wave, "advanced packaging" emerges as the hottest technology in the semiconductor industry. Its significance extends beyond computational power demands, as the escalating cost of semiconductor processes and the limits of Moore's Law make the "integration capability" of advanced...

The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a report from TechNe...

As the United States intensifies its chip embargo against China, the Chinese Academy of Engineering (CAE) has released an annual report for technological development. This report serves as a strategic guide to navigate the embargo and promote autonomous technological growth comprehensively. ......

Advanced Semiconductor Engineering, Inc. (ASE) has unveiled its Integrated Design Ecosystem™ (IDE) – a collaborative design toolkit, meticulously tailored to enhance advanced package architecture on the VIPack™ platform. This innovation streamlines the transition from single-die SoC to multi-d...