As reported by China’s Jiwei on October 2nd, Samsung has revealed that its chip manufacturing division has secured an order from AI chip client Tenstorrent to produce chips utilizing its cutting-edge 4nm process. ......

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...

In the post-Moore's Law era, chiplet design has been burgeoning as the mainstream architecture. With the widespread adoption of EUV technology by foundries on process nodes of 5nm and below, the cost of semiconductor fabrication has skyrocketed. The cost of the 5nm process has grown by almost 1x ...