According to a report from Notebookcheck citing market rumors, it’s suggested that the AMD Zen 6 architecture, codenamed Morpheus, will utilize 2nm and 3nm processes. The Zen 6 series includes three versions: Standard, Dense Classic, and Client Dense. Later rumors also indicate the architecture will feature three core configurations: 8-core (Zen 6), 16-core (Zen 6c), and 32-core (Zen 6c Extended).

The same report further indicates that, in the consumer market, the Zen 6 series will include high-end laptop versions like Medusa Point, platform versions for AM5 like Medusa Ridge, and versions suitable for both gaming laptops and desktops like Medusa Halo. AMD plans to launch the Zen 6 architecture in the second quarter of 2025, with production starting by the end of 2025, though mass production might be delayed to 2026.

AMD unveiled Strix Point at COMPUTEX 2024, featuring a combination of the Zen 5 series and RDNA 3.5 architecture. Strix Point’s launch was delayed by two quarters due to issues related to AMD’s plans for 3nm production, which were eventually canceled.

AMD also had plans for Strix Halo, rumored to use TSMC’s N3E process for producing IOD (input/output die) chips similar to Medusa Halo. Strix Halo’s launch was also delayed, possibly due to issues with the IOD chip.

Compared to the Zen 5 series architecture, the Zen 6 series is expected to feature a nearly redesigned memory controller and a new scheduling program. The Zen 6 architecture represents a significant overhaul similar to the Zen 2 architecture, with substantial changes. AMD is said to be looking to finalize the Zen 6 series design by the third quarter and commence production in 2025.

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• [News] A Quick Overview at TSMC’s Latest Collaboration with Intel, NVIDIA and AMD at COMPUTEX 2024
• [News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

(Photo credit: AMD)

Samsung Electronics’ management has made a significant decision to invest in graphics processing units (GPUs). According to a report from Business Korea reported on June 18th, while the details of Samsung’s GPU investment have not been disclosed, this decision is noteworthy as it differs from their usual focus on memory and foundry services.

Per Business Korea citing Samsung Electronics’ governance report, the management committee approved the “GPU Investment Proposal” in March. The committee includes senior executives such as Han Jong-Hee, head of the Device eXperience (DX) division, as well as the presidents of the Mobile Experience (MX) and Memory Business divisions. Reportedly, this marks the first time since the agenda items were made public in 2012 that Samsung has decided to invest in GPUs, sparking speculation that the company aims to enhance its competitiveness in the GPU sector.

Industry sources cited in the same report interpret this investment as an internal strategy for Samsung to leverage GPUs to innovate semiconductor processes, rather than to develop or manufacture GPUs. At the “GTC Conference” held in March 2024, Samsung announced its collaboration with NVIDIA to develop AI-based digital twins, aiming to achieve full automation of semiconductor plants by 2030.

Reportedly, Samsung’s newly constructed high-performance computing (HPC) center in Hwaseong was completed in April 2024. This center houses a vast array of servers and network equipment necessary for semiconductor design, indicating a significant investment in GPUs.

According to the report, Samsung’s newly constructed high-performance computing (HPC) center in Hwaseong was completed in April 2024. This center houses a vast array of servers and network equipment necessary for semiconductor design, indicating a significant investment in GPUs.

Per another report from Bloomberg on June 4th, NVIDIA CEO Jensen Huang, during a briefing at the COMPUTEX, told reporters that NVIDIA is evaluating HBM provided by both Samsung and Micron Technology. Huang mentioned that there is still some engineering work needed to be completed, expressing the desire for it to have been finished already.

As per Huang, though Samsung hasn’t failed any qualification tests, its HBM product required additional engineering work. When asked about Reuter’s previous report concerning overheating and power consumption issues with Samsung’s HBM, Huang simply remarked, “there’s no story there.”

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• [News] Reasons for Samsung’s HBM Chips Failing Nvidia Tests Revealed, Reportedly Due to Heat and Power Consumption Issues
• [News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

(Photo credit: Samsung)

This year’s COMPUTEX successfully attracted global attention, with the participation of 1,000 exhibitors and nearly 50,000 technology experts, startups, professional buyers, and international media. Building on the success of this year’s exhibition, COMPUTEX 2024 will revolve around Artificial Intelligence (AI) and is scheduled to take place from June 4 to 7 at the Nangang Exhibition Center, Halls 1 and 2. The organizer cordially invites interested exhibitors to register and join this global technology extravaganza.

COMPUTEX 2024: Building an AI Technology Ecosystem

According to market research firm IDC’s predictions, global spending on AI system-related software, hardware, and services is expected to exceed $300 billion by 2026. Additionally, the compound annual growth rate (CAGR) for 2022 to 2026 is projected to reach 26.5%. Given the continued expansion of the global AI computing trend into various industries, COMPUTEX 2024 focuses on six major themes: AI Computing, Advanced Connectivity, Future Mobility, Immersive Reality, Innovations, and Sustainability. New additions to the event include exhibition areas with forward-looking development potential, such as AI Computing and System Integration, Components and Battery Energy Storage, and Smart Mobility. We invite global technology enterprises to join us in co-creating the AI technology ecosystem.

InnoVEX, the innovation and startup exhibition area, stands as COMPUTEX’s international benchmark platform for startups. It provides startup companies with opportunities to find manufacturing partners and international sales channels while hosting startup competitions and product presentations to increase visibility and garner support from international investors.

Diverse and Rich Exhibition Activities Receive Support from Technology Leaders

This year, COMPUTEX Keynotes & Forums made a significant impact by featuring heavyweight tech CEO speakers. The event created quite a buzz in the industry, drawing an attendance of 7,000 people on-site and an impressive 2.5 million online views. In 2024, the organizers will continue to host these speaking engagements, inviting tech giants and high-level executives to share their profound insights into future technology trends. These discussions delve deep into areas such as AI, system integration, data science, IoT, and more, fostering cross-disciplinary exchanges and knowledge sharing.

Throughout the exhibition, there will be additional events, including international press conferences, opening ceremonies, procurement meetings, themed guided tours, Happy Hour, and more. These activities are designed to enhance communication and interaction among exhibitors, international media, international buyers, and domestic industry professionals.

COMPUTEX 2024: Registration to Exhibit is Now Open for this Global Business Opportunity Event

Registration for COMPUTEX 2024 is now officially open; an outstanding platform for businesses interested in expanding international markets, staying updated on the latest industry trends, and identifying potential supply chain partners. We warmly welcome participants in today’s tech, especially the fields of AI technology, system integration solutions, smart technology, and startups.

(Image: COMPUTEX)