Charles Liang, President and CEO of AI server giant Supermicro, delivered a keynote speech at COMPUTEX earlier today. According to a report from CNA, while expressing his optimism in expanding the company’s market share in the Direct Liquid Cooling (DLC) field, Liang targets to capture a 15% market share in the new data center market by next year.

According to the report, Liang mentioned that Supermicro’s DLC solutions had a market share of less than 1% over the past 30 years. However, as DLC solutions now have a cost comparable to air-cooled solutions, yet more energy-efficient, more manufacturers are beginning to adopt them. It is estimated that Supermicro has around 1000 liquid-cooled cabinets shipped each month, and the aim is to capture 15% of the new data center market share within next year.

Supermicro offers comprehensive solutions at both the cabinet and data center levels. Its operations have expanded globally from the headquarter in San Jose, California, to manufacturing and operation centers in Asia and Europe. Liang stated that Supermicro’s Malaysian plant is expected to be operational in the fourth quarter of this year, with a monthly production capacity of up to 5000 cabinets, according to CNA’s report today.

Regarding Supermicro’s expansion plans, Liang said earlier that Supermicro, with over 4000 employees worldwide, its top priority would be expanding in Taiwan, aiming to finalize plans for a new campus in the near future.

In addition, Liang pointed out that AI is rapidly and significantly changing the world. Through its collaboration with GPU giant NVIDIA, Supermicro has become one of the leading suppliers of AI systems. He also emphasized that by adopting more energy-efficient systems, green computing can be cost-free and offer significant bonuses, according to the report.

While reiterating Supermicro’s strong bond with NVIDIA, Liang invited NVIDIA CEO Jensen Huang to join him on stage. When Liang introduced the liquid-cooled server cabinets on stage, Huang praised the liquid cooling solution for significantly reducing data center costs.

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• [COMPUTEX 2024] The Rise of Generative AI Sparks Innovation across Industries, with Taiwan-based Companies Leading as Essential Partners in the Global Supply Chain

(Photo credit: Supermicro)

NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply.

According to a report from Bloomberg on June 4th, Huang, during a briefing at the COMPUTEX, told reporters that NVIDIA is evaluating HBM provided by both Samsung and Micron Technology. Huang mentioned that there is still some engineering work needed to be completed, expressing the desire for it to have been finished already.

As per Huang, though Samsung hasn’t failed any qualification tests, its HBM product required additional engineering work. When asked about Reuter’s previous report concerning overheating and power consumption issues with Samsung’s HBM, Huang simply remarked, “there’s no story there.”

Previously, Reuters cited sources on May 24th, reporting that overheating and power consumption issues would affect Samsung’s fourth-generation HBM chip, “HBM3,” as well as the fifth-generation “HBM3e” planned for release by Samsung and its competitors this year.

Per the same report from Reuters, Samsung has been attempting to pass NVIDIA’s tests for HBM3 and HBM3e since last year, while a test for Samsung’s 8-layer and 12-layer HBM3e chips was said to fail in April.

In an official statement, Samsung noted that it is in the process of optimizing products through close collaboration with customers, with testing proceeding smoothly and as planned. The company said that HBM is a customized memory product, which requires optimization processes in tandem with customers’ needs.

Currently, SK Hynix is the primary supplier of NVIDIA’s HBM3 and HBM3e. According to an earlier TrendForce’s analysis, NVIDIA’s upcoming B100 or H200 models will incorporate advanced HBM3e, while the current HBM3 supply for NVIDIA’s H100 solution is primarily met by SK Hynix.

According to a report from the Financial Times in May, SK hynix has successfully reduced the time needed for mass production of HBM3e chips by 50%, while close to achieving the target yield of 80%.

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• [News] Reasons for Samsung’s HBM Chips Failing Nvidia Tests Revealed, Reportedly Due to Heat and Power Consumption Issues
• [News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

(Photo credit: Samsung)

Intel CEO Pat Gelsinger gave a keynote speech at the 2024 COMPUTEX TAIPEI yesterday. According to a report from UDN, Gelsinger addressed that the U.S. must carefully find an appropriate balance in its chip ban against China to avoid pushing China to accelerate the development of its own chips. He stated that Intel’s technology holds a competitive advantage in China and will continue to export appropriate products to China.

Regarding the AI era, Gelsinger mentioned that all devices will eventually become AI devices, and all businesses will become AI businesses. He also introduced Intel’s foundry services as the first production system designed for the AI era. He stated that AI will be ubiquitous, its applications including AI PCs, end devices, enterprise products, and data centers.

At a press conference following the event, Gelsinger was asked about the development of Intel’s foundry services. He noted that everything is on track, with the goal of achieving this through a more flexible and balanced supply chain.

Regarding whether the U.S. chip export ban is prompting China to accelerate its chip development, Gelsinger said that the ban acts like a “magic line.” If the bans are too strict, it could force China to speed up the development of its own chips, so it is indeed crucial to carefully find the appropriate balance.

Per a report from tom’s hardware, Gelsinger agrees on strict restrictions on manufacturing technology, particularly emphasizing limitations on EUV lithography, which he believes will curb Chinese chipmakers’ capabilities to keep American companies competitive in China.

Notably, per Reuters citing sources, the U.S. government has reportedly revoked the licenses of Intel and Qualcomm to supply semiconductor chips used in laptops and handsets to Huawei. Some companies received notices on May 7th, and the revocation of the licenses took immediate effect.

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• [News] Intel CEO Gelsinger Unveils Lunar Lake Processors, Giving Credit to TSMC
• [News] U.S. Imposes Further Sanctions, Revoking Intel and Qualcomm’s License to Supply Chips to Huawei

(Photo credit: iStock)

This year’s COMPUTEX successfully attracted global attention, with the participation of 1,000 exhibitors and nearly 50,000 technology experts, startups, professional buyers, and international media. Building on the success of this year’s exhibition, COMPUTEX 2024 will revolve around Artificial Intelligence (AI) and is scheduled to take place from June 4 to 7 at the Nangang Exhibition Center, Halls 1 and 2. The organizer cordially invites interested exhibitors to register and join this global technology extravaganza.

COMPUTEX 2024: Building an AI Technology Ecosystem

According to market research firm IDC’s predictions, global spending on AI system-related software, hardware, and services is expected to exceed $300 billion by 2026. Additionally, the compound annual growth rate (CAGR) for 2022 to 2026 is projected to reach 26.5%. Given the continued expansion of the global AI computing trend into various industries, COMPUTEX 2024 focuses on six major themes: AI Computing, Advanced Connectivity, Future Mobility, Immersive Reality, Innovations, and Sustainability. New additions to the event include exhibition areas with forward-looking development potential, such as AI Computing and System Integration, Components and Battery Energy Storage, and Smart Mobility. We invite global technology enterprises to join us in co-creating the AI technology ecosystem.

InnoVEX, the innovation and startup exhibition area, stands as COMPUTEX’s international benchmark platform for startups. It provides startup companies with opportunities to find manufacturing partners and international sales channels while hosting startup competitions and product presentations to increase visibility and garner support from international investors.

Diverse and Rich Exhibition Activities Receive Support from Technology Leaders

This year, COMPUTEX Keynotes & Forums made a significant impact by featuring heavyweight tech CEO speakers. The event created quite a buzz in the industry, drawing an attendance of 7,000 people on-site and an impressive 2.5 million online views. In 2024, the organizers will continue to host these speaking engagements, inviting tech giants and high-level executives to share their profound insights into future technology trends. These discussions delve deep into areas such as AI, system integration, data science, IoT, and more, fostering cross-disciplinary exchanges and knowledge sharing.

Throughout the exhibition, there will be additional events, including international press conferences, opening ceremonies, procurement meetings, themed guided tours, Happy Hour, and more. These activities are designed to enhance communication and interaction among exhibitors, international media, international buyers, and domestic industry professionals.

COMPUTEX 2024: Registration to Exhibit is Now Open for this Global Business Opportunity Event

Registration for COMPUTEX 2024 is now officially open; an outstanding platform for businesses interested in expanding international markets, staying updated on the latest industry trends, and identifying potential supply chain partners. We warmly welcome participants in today’s tech, especially the fields of AI technology, system integration solutions, smart technology, and startups.

(Image: COMPUTEX)