According to a report from Economic Daily News, TSMC plans to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), with an estimated investment exceeding NTD 200 billion. Construction at the STSP Phase III site is expected to begin as early as March 2025, a...

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked due to slowing deman...

Ahead of TSMC’s earnings call on January 16th, the foundry giant’s capacity expansion plans remains a key focus, as the market is curious about its progress of Arizona plant and its CoWoS (Chip on Wafer on Substrate) output. Notably, the company has reportedly seen positive progress in both a...

TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC's CoWoS monthly ca...

According to a report by the Economic Daily News, TSMC has made significant progress in its silicon photonics strategy. The company recently achieved the integration of co-packaged optics (CPO) with advanced semiconductor packaging technologies, with sample deliveries expected to commence in early 2...