Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...

As demand for artificial intelligence continues to surge, the industry's appetite for high-performance computing chips has grown increasingly intense. According to a report by the Commercial Times, NVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdl...